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Global Technologies makes acquisition in the United Kingdom

Mycronic’s Global Technologies division has acquired RoBAT, a company headquartered in the United Kingdom, which has developed a technology for fast and reliable tests of signal quality on PCBs.

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High Flex becomes PCB Assembly Solutions

Mycronic’s High Flex division will from today operate under the name PCB Assembly Solutions. The new name reflects the division’s growing product offering of advanced production equipment and

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Smaller, smarter, faster

Just outside of Nürnberg, Germany, one forward-thinking manufacturer is rapidly modernizing its production to meet fast-growing demands for advanced industrial IoT electronics. Thanks to the

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Thinking outside the line

Mr. Liu Haifeng has never been one to stick with the status quo. As General Manager of Wuxi Good Electronics Co., Ltd., he is always on the hunt for the latest production technologies, new

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Autonomous inspection

21st century industries demand 21st century manufacturing solutions. With the help of the latest 3D automated optical inspection systems, MSL Circuits – an ALL Circuits company, is helping

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User-driven design

Introducing the all-new pick-and-place graphical user interface User-driven design An all-new pick-and-place graphical user interface (GUI) raises the visibility of vital process data while

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Solutions

SMT Solutions PCB assembly solutions Case stories Mycronic offers advanced PCB assembly solutions to help streamline the manufacturing process. Our solutions are designed with precision and

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Webinars

die-bonding

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Notice of Annual General Meeting in Micronic Mydata

Notice of Annual General Meeting in Micronic Mydata The shareholders in Micronic Mydata AB (publ) are hereby given notice to attend the Annual General Meeting (AGM), to be held on Tuesday, 6 May

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Mycronic 4.0 to be launched at Productronica 2015 - Mycronic’s intelligent factory delivers new leaps in productivity

Mycronic 4.0 to be launched at Productronica 2015 - Mycronic’s intelligent factory delivers new leaps in productivity Täby, 26 October, 2015 - In response to the SMT industry’s urgent need to

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Mycronic AB is EDGE certified for its gender diversity work

Mycronic AB is EDGE certified for its gender diversity work Täby, 9 December, 2015 - Mycronic AB is one of the first companies in Sweden to reach certification according to the EDGE

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Interim Report January–September 2019

Strong order intake and launches for the future “Order intake increased by 52 percent, with strong contributions from both Assembly Solutions and Pattern Generators. The third quarter signaled

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Mycronic to showcase its latest line automation, dispensing and inspection solutions at APEX 2018

Mycronic to showcase its latest line automation, dispensing and inspection solutions at APEX 2018 Täby, 22 February, 2018 – Mycronic AB (publ) will demonstrate its growing range of

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Mycronic’s expanded portfolio demonstrates broader vision to Productronica visitors

For the first time since multiple acquisitions in recent years, Mycronic AB (publ) will demonstrate its full portfolio of electronics assembly solutions at Productronica in Munich, November

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Mycronic to introduce a new high-capacity, small-footprint storage system at APEX 2018

Mycronic to introduce a new high-capacity, small-footprint storage system at APEX 2018 Täby, 22 February, 2018 – Mycronic AB (publ) will launch its new high-capacity SMD Tower 8000 storage system

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Mycronic launches Evo, a new control platform for mask writers

Mycronic launches Evo, a new control platform for mask writers Mycronic AB (publ) launches Evo, a new control platform for mask writers. Evo is based on the latest technology and designed to

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Mycronic receives order for two Prexision Lite 8 Evo mask writers

Mycronic receives order for two Prexision Lite 8 Evo mask writers Mycronic AB (publ) has received an order for Prexision-series mask writers for display applications from Photronics Inc, for

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Mycronic receives order for an upgrade of a Prexision system

Mycronic receives order for an upgrade of a Prexision system Mycronic AB (publ) has received an order to upgrade a system to a full-scale Prexision 8. The upgrade will be implemented on a

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Mycronic’s Nomination Committee appointed

Mycronic’s Nomination Committee appointed The Nomination Committee for Mycronic’s 2020 AGM has been appointed. In accordance with the AGM’s decision, Mycronic’s Nomination Committee shall consist

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Mycronic publishes Annual and Sustainability Report 2021

Mycronic publishes Annual and Sustainability Report 2021 Mycronic AB (publ) today publishes its Annual and Sustainability Report 2021, which can be downloaded as a PDF from the company’s website

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MRSI Mycronic to showcase high-speed assembly solutions at CIOE 2025

die-bonding MRSI Mycronic CIOE Booth 2025 MRSI Mycronic to showcase high-speed assembly solutions at CIOE 2025 MRSI Mycronic, part of the Mycronic Group, will present advanced assembly solutions

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MRSI中国新产品演示中心开业,将出席讯石研讨会,参加CIOE展会并提供现场演示

die-bonding MRSI中国新产品演示中心开业,将出席讯石研讨会,参加CIOE展会并提供现场演示 摘要:第23届中国国际光电博览会(CIOE)将于2021年9月16-18日在深圳国际会展中心举办。MRSI Systems (Mycronic Group)届时将携最新的MRSI-HVM带轨道双机头固晶机参展,MRSI将在展位#4B79进行现场演示。MRSI

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MRSI introduces innovative MRSI-A-L Active Aligner for optical packaging solutions

MRSI Systems (a part of Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, proudly introduces the MRSI-A-L

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MRSI introduces 705HF High Force Die Bonder for power devices and advanced chip packaging

MRSI Systems (a part of Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, has launched the MRSI-705HF high

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MRSI Mycronic to showcase and present innovative die bonder solutions at CIOE 2023

die-bonding CIOE 2023 MRSI Booth MRSI Mycronic to showcase and present innovative die bonder solutions at CIOE 2023 MRSI, a part of Mycronic Group, will exhibit our family of die bonders and

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MRSI Systems Launches High Speed Die Bonder for Photonics High Volume Manufacturing

BILLERICA, Mass., August 14, 2017 – MRSI Systems, a leading manufacturer of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems, is launching a new High Speed

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MRSI launches submicron die bonding solution for silicon photonics, co-packaging, and wafer-level packaging

At CIOE 2020 MRSI Systems will introduce a new product, MRSI-S-HVM high-speed, flexible 0.5 micrometer die bonder for silicon photonics, co-packaging.

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MRSI receives Laser Focus World Silver Award for MRSI-H-HPLD Die Bonder

MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2022 Silver Honoree for the

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MRSI Systems Announces Chinese Patent Issued Covering Die Placement Head with Turret

Mycronic Global Technologies Business Unit, MRSI Systems announces the recent issuance of utility patent titled “DIE PLACEMENT HEAD WITH TURRET” and numbered ZL 201680048482.5 (PCT/US2016/047135)

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MRSI launches new Die Bonder with improved throughput for high power laser manufacturers

MRSI Systems (Mycronic Group) is pleased to announce the introduction of MRSI-H-HPLD+, the latest advancement in the MRSI-H/HVM-series product line. This new variant of the successful