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The annual general meeting of Mycronic AB (publ) held on May 7, 2025, resolved to increase the number of shares by a share split, whereby one (1) existing share will be split into two (2) shares.

Mycronic AB (publ) has received an order for an SLX mask writer from an existing customer in Asia. The order value is in the range of USD 3-5 million. Net sales for the system will be recognized

Mycronic’s Global Technologies division has acquired RoBAT, a company headquartered in the United Kingdom, which has developed a technology for fast and reliable tests of signal quality on PCBs.

Mycronic’s Global Technologies division has acquired ETZ, a company based in Germany, which manufactures test probes.

Apprenticeship program Are you interested in an apprenticeship in an international company? At atg Mycronic in Wertheim, we offer apprenticeship programs for future industrial clerks and

Mycronic Sweden HQ Mycronic headquarter in the winter Mycronic AB Nytorpsvägen 9 Box 3141 183 03 Täby Sweden +46 8 638 52 00 +46 8 638 52 90 Mycronic Täby Yes, please contact me

Test Solution (Suzhou) Co. Ltd. Mycronic atg Luther & Maelzer China, Suzhou Industrial Park Test Solution (Suzhou) Co. Ltd. Block 5 # 301, No.5 Xinghan Street Suzhou Industrial Park China +86

Fully automatic high accuracy die bonders that are capable of epoxy and eutectic die bonding are the lifeblood of the modern semiconductor industry.

Stellenanzeigen Here you will find the right job!

Learn more about MRSI's 5 micron die bonders.

MRSI offers a comprehensive set of training programs covering our family of products. Contact MRSI Systems to learn more about On-Site Training.

We provide prototyping and small batch die bonding services for our customers to shorten your time to market.

The MRSI-705 has established itself as a reliable tool in the aerospace, defense, and medical industries, playing a crucial role in mission-critical tasks due to its performance, adaptability,

The optical components industry demands highly precise and customized equipment for complex optical assembly processes. We have answered this need with our new active aligner - a high-performance

In the November/December 2023 issue of Chip Scale Review, MRSI delves into the fascinating world of automotive light detection and ranging (LiDAR) technology. This article explores the parallels

In the bustling world of technology, May was a month marked by significant events, and MRSI was at the forefront. With appearances at IMAPS New England in Boxborough, MA, and the 2024

die-bonding Epoxy Dispenser The Next Generation MRSI-175Ag Epoxy Dispenser is now available In the fast-paced world of advanced packaging and semiconductor manufacturing, precision and efficiency

Designing and manufacturing electronic components destined for defense applications entails navigating a landscape of exacting standards. These standards demand unparalleled reliability, minimal

MRSI Mycronic is proud to sponsor the 7th Annual Automotive LIDAR Conference, taking place online from November 20-21, 2024.

MRSI’s die bonding systems are designed to address the challenges of chip packaging with a focus on efficiency, precision, and productivity. These systems feature an advanced, patented

Last year, MRSI Systems launched the MRSI-705HF high force die bonder, a new version of the trusted MRSI-705 that is perfect for sintering and thermocompression bonding applications.

die-bonding MRSI-705 with wafer, conveyor Versatile package handling capabilities: dewar and beyond In today's fast-paced production environments, efficiency and versatility are key. The MRSI-705

March will be a busy month for device packaging exhibitions. Please join MRSI Mycronic at these upcoming events. We hope to see you there to discuss our latest new product innovations. Learn more

Advanced heterogeneous integration for 3-D IC packaging, e.g., chiplet, and optoelectronics packaging requires high-precision die bonders that can perform many different processes, such as

At the exhibition, MRSI will provide live product demos of the recently launched MRSI-H-HPLD+, a new variant of the successful MRSI-H-HPLD that is tailored for high-power laser die attachment

In the world of chip packaging and advanced die bonding, the pursuit of efficiency, accuracy, and productivity is a continuous endeavor. MRSI’s die bonding systems offer a cutting-edge patented

If you are looking to pick from tape and do not have a tape and real feature on your machine, then we have a solution for you. The two inch metal tape holder can accommodate four two-inch strips

The MRSI-H1 family of 1-micron flip-chip die bonders stands out as an advanced ultra-precision solution.

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Quantum Technologies The Future of Quantum: Powered by Photonic Integration Quantum technologies are poised to revolutionize fields like computing, communication, and sensing. However, this