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Quantum Technologies
Quantum Technologies The Future of Quantum: Powered by Photonic Integration Quantum technologies are poised to revolutionize fields like computing, communication, and sensing. However, this
Space & Defense
Space & Defense Photonic Integration Solutions for Space and Defense The evolution of Space and Defense technologies relies on advanced optical solutions for remote sensing, advanced
AI & Machine Learning
AI & Machine Learning Enabling the AI/ML Revolution with Advanced Photonic Packaging The rapid advancements in Artificial Intelligence (AI) and Machine Learning (ML) are driving demand for
Mycronic share
Learn about share performance, dividends, share capital, largest shareholders, share distribution and insiders. See the latest price, change, volume and historical data for Mycronic’s share.
Financial & sustainability targets
We will double net sales, double profit, reduce CO2 emissions by half. Follow our aims to transite toward a more sustainable electronics industry.
Analysts and consensus estimates
Analysts and consensus estimates The consensus estimates are provided by Modular Finance and are based on forecasts from analysts following Mycronic. The analysts’ opinions, forecasts, and
Shareholders
Who are the largest shareholders at Mycronic? How does the ownership structure and geographic distribution looks like?
Information about the share
Information about the share
Fully Automated Die Bonding Systems — The Importance of Proper Lighting
Lighting is an important component of any vision recognition system. When it comes to lighting, it is not a case of “one size fits all.”
SEMICON West 2018 – MRSI Systems’ Advanced Packaging Solutions
All major optical communication component manufacturers, data center transceiver suppliers, optical network technology groups and, in general, the world of photonics packaging have been facing an
MRSI Systems—New Process Pages
These Die Bonding process pages explain the central role that die bonding continues to play in the photonics, sensors and semiconductor industries.
Automated Die Bonding for High Volume Optoelectronics Packaging
As the Optoelectronics market is strong and growing, the technical requirements increase the challenges for manufacturers.
Featured Article Laser Focus World: Challenges for photonics manufacturing in the new data center era
MRSI’s latest article in Laser Focus World’s August Issue Challenges for photonics manufacturing in the new data center era, discusses the high volume and high mix nature of photonics
China International Optoelectronic Expo – September 2017
die-bonding MRSI CYCAD CIOE Booth 2017 China International Optoelectronic Expo – September 2017 MRSI Systems is exhibiting at CIOE with our Chinese Representative CYCAD Century Science and
MRSI Systems Supports “Advancing Innovation in Photonics”
die-bonding MRSI Systems Supports “Advancing Innovation in Photonics” Background MRSI Systems is a community member of AIM (American Institute of Manufacturing) Photonics and the local Photonics
Join MRSI Systems at OFC!
MRSI is exhibiting at the Optical Fiber Communication Conference and Exhibition (OFC) March 21-23, at the Los Angeles Convention Center (Booth 1728). We invite you to explore MRSI’s product
Technology Students Experience Local Advanced Technology Manufacturer Up Close
Middlesex Community College technology students recently visited our factory in Billerica, MA.
International Microwave Symposium 2017
MRSI Systems is exhibiting at IMS (Booth #1847)—the world’s largest Microwave and RF industry trade show in Honolulu, Hawaii June 4-9, 2017.
Newsletters archive
Find and download archives of the MRSI Newsletter. Find great stories, articles and more or catch up on previous articles.
MRSI Systems Wins Years-Long Litigation Against Palomar Technologies By Invalidating Palomar’s “Double Pick” Patent
Chief Judge of federal court in Boston knocks out Palomar’s claim of infringement for its “double pick” patent allegedly covering a manufacturing process; court rules that claimed method is “so
Magnetic Test
Enabling the next generation of spintronic devices Magnetic Automated Test Equipment for Memory and Sensors Hprobe, part of Mycronic’s Global Technologies division, delivers advanced Magnetic
Visit MRSI Systems at the European Conference on Optical Communications (ECOC) 2017 — New Die Bonder for High Volume Manufacturing
Over three decades, MRSI Systems has developed a family of high precision eutectic die bonders for high volume manufacturing of optoelectronics.
Die Bonder
Choosing a die bonder is important, and we advise considering all options before making a purchase. With MRSI Systems, you can find exactly what you need.
Contact us
Contact MRSI Systems in Massachusetts for product information, technical support and more. Contact MRSI Systems today for more information!
Meet with MRSI
Meet with MRSI
MRSI North America
MRSI is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems.
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MRSI receives Laser Focus World Innovators Award for H-TO die bonder
MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2022 Silver Honoree for the
MRSI receives Laser Focus World Silver Award for MRSI-H-HPLD Die Bonder
MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2022 Silver Honoree for the
MRSI opens a new Product Demo Center in China, will present at the Infostone Conference and attend CIOE with live demos
MRSI Systems (Mycronic Group) will exhibit at the 23rd China International Optoelectronic Exposition (CIOE) at the Shenzhen World Exhibition & Convention Center from September 16-18, 2021. MRSI