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Ten key SMT trends you need to know
pcb-assembly Ten key SMT trends you need to know The ten trends to keep an eye out for; automation, big data, AI, robotics, two global ecosystems, shorter production cycles, the full line's
Agilis Smart Bin
pcb-assembly Paperless productivity – changeover guidance with Agilis Smart Bin. Agilis Smart Bin MISSING COMPONENTS. Sticky notes falling off. Hunting for information. The list of reasons for
How to achieve zero stencil defects
pcb-assembly Controlled paset deposition How to achieve zero stencil defects Through Mycronic’s fully integrated 3D solder paste inspection and jet printing solution, you can automatically
Evolution of a coater
pcb-assembly Offline programming From high volume coating machine to flexible, full featured, easy to program coating system Evolution of a coater MYCRONIC INTRODUCED the MYC50 conformal coating
Mycronic introduces the MYPro A40: an evolutionary high-speed, high-flexibility pick-and-place platform
Mycronic, the leading Sweden-based electronics assembly solutions provider, is introducing its next-generation MYPro A40 pick-and-place solution, equipped with an all-new MX7 high-speed mounthead
Mycronic promises to eliminate majority of false calls with new deep learning system for 3D AOI
Mycronic, the leading Sweden-based electronics assembly solutions provider, has announced the launch of DeepReview, a new Automatic Defect Classification system that leverages the power of AI to
Products
Mycronic’s jet printing, dispensing, coating and plasma technologies make it possible to solve any dispensing or conformal coating challenge.
Mycronic to showcase its full-line solution at IPC APEX EXPO 2025
Mycronic, the leading Sweden-based electronics assembly solutions provider, continues to respond to growing customer demand by offering high-flexibility and high-productivity solutions.
Tabletop dispensing
Precision printing. High-speed jet printer and solder paste PCB printing, surface mount soldering dispenser for a wide range of assembly fluids.
Welcome to Mycronic
Welcome to Mycronic Solder paste inspection Automated optical inspection PI series 3D SPI. Perfect solder joints made simple. Accurate solder paste inspection with unprecedented simplicity. I
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Thank you for contacting us regarding PCB assembly
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Conformal coating
Protecting electronics assemblies are growing in complexity. Capability, versatility and precision are key.
Inspection
Career
Career Available jobs About us Apprenticeship program See your future opportunities here See your future opportunities here. What we offer. Education for future industrial clerks, technical
Jetting to success on Norway’s Electronic Coast
pcb-assembly A strong 30-year partnership Two-in-one solution for precision and efficiency Zero downtime, 30% reduction in rework Ease of installation and programming A technological marvel
Photomask equipment
Photomask equipment Photomask equipment Our photomask products Our solutions Production solutions for advanced photomasks Large area measurement meet the world's most accurate metrology system
Products
Photomask equipment products Display mask writer Semiconductor mask writer Multi-purpose mask writer Display mask metrology system Semiconductor mask metrology system Digitalization of photomask
Axxon
The right platform for your process Valves for each application Axxon creates coating systems Axxon is a leading, global supplier of innovative and production-ready, dispense and conformal
About us
About us Axxon Automation Co., Ltd. Axxon, founded in 2008, is a Chinese manufacturer in the field of fluid automation, focusing on providing precision dispensing, coating, industrial dispensing
Axxon China
Axxon China Shenzhen, China Axxon Automation Co.,Ltd. A14, Silicon Valley Power Automotive Innovation Park 334 Guanlan Shenzhen China +86 755 8358 6066
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Die bonding solutions
Fully automatic high accuracy die bonders that are capable of epoxy and eutectic die bonding are the lifeblood of the modern semiconductor industry.
MRSI Launches New MRSI-H3TO Die Bonding Product Family Targeted at the 5G Wireless Network Supply Chain
STOCKHOLM, Aug 29, 2018 — MRSI Systems (Mycronic Group) is launching the MRSI-H3TO, a new 3 micrometer high speed die bonder which will be the first of its kind to address the multi-die and
MRSI Announces HVM3 Die Bonding Demonstration Capability in Shenzhen China
STOCKHOLM, Nov 9, 2018 — MRSI Systems (Mycronic Group) announces new demonstration capability at its sister company, Shenzhen Axxon Automation (Mycronic Group) facility in the Longhua district,
MRSI at CIOE 2025: Showcasing the MRSI-LEAP Die Bonder
MRSI is pleased to announce the presentation of its latest innovation, the MRSI-LEAP Die Bonder, at the China International Optoelectronic Expo (CIOE) in Shenzhen, taking place from September 10th
Join MRSI at the International Microwave Symposium in San Francisco
The International Microwave Symposium (IMS) is an annual conference for professionals in the microwave and RF industry.
Dr. Limin Zhou to present at the Semiconductor Advanced Technology Innovation Development and Opportunities Conference
The rapid adoption of artificial intelligence is driving advancements in optical interconnect technology, resulting in notable improvements in speed, power efficiency, and cost reduction. This
Learn more about our active alignment solutions
The MRSI-A-L machine is a versatile optical active alignment platform suitable for a wide range of applications, including lens, fiber and other optical components active alignment.