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MRSI Systems Acquires Die Bonding Business
BILLERICA, MA — January 31, 2014 — MRSI Systems, a developer and manufacturer of turnkey chip placement and dispensing systems, announced today it has completed a leveraged buyout of assets from
MRSI Systems Wins Years-Long Litigation Against Palomar Technologies By Invalidating Palomar’s “Double Pick” Patent
Chief Judge of federal court in Boston knocks out Palomar’s claim of infringement for its “double pick” patent allegedly covering a manufacturing process; court rules that claimed method is “so
MRSI Files Patent Infringement Lawsuit Against Palomar Technologies
Taking action against what it asserts is pervasive and repeated infringement of four separate U.S. patents it owns, leading precision manufacturer MRSI Systems LLC has filed a patent infringement
MRSI发布为硅光器件、协同封装和晶圆级封装提供亚微米级贴片解决方案
ICC讯 在CIOE 2020,MRSI SYSTEMS将推出一款新产品,高速、灵活的0.5微米 MRSI-S-HVM 贴片机,为硅光器件,协同封装的电子和光子芯片,以及晶圆级封装应用提供解决方案。
MRSI to present at 18th ICCSZ OC Market and Technology Seminar and offer die bonder demonstrations at CIOE
MRSI Systems and CYCAD Century Science and Technology will partner together at the 21st China International Optoelectronic Exposition (CIOE). Product demos will be offered at Cycad’s booth #1C86.
MRSI推出升级版MRSI-705贴片机 助力大批量制造
ICC讯 在IMAPS 2020上,MRSI Systems推出了新型5微米贴片机产品,面向量产配置的MRSI-705。MRSI-705于2012年首次推出,在贴片机行业中处于领先地位,可在一台机器上为客户提供多种应用解决方案。MRSI-705新的配置提供了创新的水平转塔功能,可以在不牺牲灵活性,准确性和可靠性的前提下,显著提高机器的速度和生产率。
MRSI HVM系列贴片机荣获Laser Focus World创新者奖
ICCSZ讯 近期,全自动,高精度,高速贴贴片与点胶系统的领先制造商MRSI Systems(Mycronic Group)被授予2019年Laser Focus World 创新者奖的光电子器件制造设备类银奖。
MRSI launches MRSI-705 high-volume configuration
At IMAPS 2020 MRSI Systems will introduce a new 5 micrometer die bonder product, MRSI-705 high-volume configuration. The MRSI-705 was first introduced in 2012 and has enjoyed a dominant position
MRSI to offer die bonding demonstrations at Productronica
MRSI Systems (Mycronic Group) will be exhibiting with Mycronic at Productronica. Product demos will be offered at the Mycronic Booth #341 in Hall A3 (SMT Cluster). The exhibition will be held at
Challenges and Solutions in the Photonics Packaging Industry
This increased demand for photonics components is driven by the growth in optical networks. Learn more about Photonics Packaging by reading more from MRSI Systems!
Die Bonding Solutions
Having a proven ultra-accurate die bonding system platform that is mechanically and thermally stable, with no cantilevered parts, are essential elements to achieve accurate device placement.
Mycronic technology essential in 5G development
die-bonding Mycronic technology essential in 5G development Die bonding systems are required for the groundbreaking digital transition Mycronic technology essential in 5G development 5G is
Die Bonding Process Pages – Highlights
Various die bonding approaches have been, and still are, developed to meet the ever-evolving product requirements.
How Does MRSI Systems Manufacture to Customer’s Specification?
MRSI Systems thinks from the customer’s perspective and upholds strict protocols to ensure your desired configuration, has been built to proper specification. MRSI’s core value of acting like an
Software Video Training Programs for Die Bonding and Epoxy Dispense Systems
These videos help you to discover advanced features of our MRSI machines, which will ensure your production line is optimized.
Join MRSI at the 50th European Conference on Optical Communication
We are pleased to be exhibiting again this year at the 50th ECOC in Frankfurt am Main, Germany.
Mycronic Saint-Egrève
Mycronic Saint-Egrève Mycronic France, Saint-Egrève Rue Albert Einstein BATIMENT 8 38120 Saint-Egrève France +33 4 7675 8565 Mycronic, Saint-Egrève, France Yes, please contact
Thinking outside the line
Mr. Liu Haifeng has never been one to stick with the status quo. As General Manager of Wuxi Good Electronics Co., Ltd., he is always on the hunt for the latest production technologies, new
Innovation overdrive
Accelerating R&D cycles and expanding product mix in China
Jetting to success on Norway’s Electronic Coast
pcb-assembly A strong 30-year partnership Two-in-one solution for precision and efficiency Zero downtime, 30% reduction in rework Ease of installation and programming A technological marvel
Design freedom at jet speed
pcb-assembly ESCATEC in brief How ESCATEC accelerates new product cycles and boosts yields with the MY700 Design freedom at jet speed At the ESCATEC facility in Switzerland, new products are
Meet the MYTower family
pcb-assembly A generation of storage for factories of all shapes and sizes Meet the MYTower family Mycronic’s previous SMD Tower set the benchmark for intelligent component storage. After
From ping-pong to perfection
pcb-assembly Escape tracker Enhancing the art of inspection programming with Escape Tracker From ping-pong to perfection It’s sometimes called the ping-pong effect: the back-and-forth task of
专访MRSI SYSTEMS周利民:MRSI-HVM-p系列贴片机助力光通讯产业高速发展
摘要:9月16-18日,CIOE 2021期间,MRSI SYSTEMS携携最新的MRSI-HVM带轨道双机头固晶机精彩亮相。在4B79展台,讯石以现场视频直播方式走进MRSI SYSTEMS展台参观了正在进行演示的产品,MRSI SYSTEMS战略营销高级总监周利民博士向观众介绍本次参展的新产品。
Interview with MRSI Systems Dr. Limin Zhou: MRSI Die Bonders support the fast growth of the optical communication market
During 2021 CIOE in Shenzhen, China, Infostone, interviewed Dr. Limin Zhou, Senior Strategic Marketing Director of MRSI Systems (Mycronic Group) to discuss MRSI’s latest product developments and
MRSI Named in the 2019 Infostone Top Honors List in China, with the MRSI-HVM Series Receiving the Award for the Most Competitive Product for Optical Communications
MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed die bonding and dispensing systems, has been recognized in the list of 2019 Infostone top
Advanced Photonics Applications – MRSI-H-LD
Designed for high-volume manufacturing of advanced photonics and RF / Microwave devices the MRSI-H-LD 1.5 micron die bonder delivers industry-leading speed without sacrificing ultra-high
MRSI to present at IFOC and Exhibit at CIOE in September in Shenzhen including live product demos
MRSI Systems will present at the 19th Infostone Optical Communications Conference(IFOC), organized by Infostone Communication Consultant. The event will take place in Shenzhen, China from September
LASER World of PHOTONICS CHINA 2020
MRSI will exhibit at LASER World of PHOTONICS CHINA 2020 from July 3-5, 2020 in Hall 8, Booth #8.1E416 of the National Exhibition and Convention Center (NECC), in Shanghai, China. There will be
MRSI’s August 2020 Laser Focus World Featured Article: Assembly solution addresses TO-can photonic device manufacturing challenges
In this week’s blog post we highlight our recent Laser Focus World published article on the challenges of new TO-can photonic device manufacturing.