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MRSI Mycronic announces advanced high-speed 1µm die bonder MRSI-LEAP for ultra-high-volume manufacturing of AI optical module applications

MRSI Mycronic is proud to announce the launch of the MRSI-LEAP high-speed 1µm die bonder. This innovative equipment is designed for ultra-high-volume manufacturing of optical modules,

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MRSI发布为硅光器件、协同封装和晶圆级封装提供亚微米级贴片解决方案

ICC讯 在CIOE 2020,MRSI SYSTEMS将推出一款新产品,高速、灵活的0.5微米 MRSI-S-HVM 贴片机,为硅光器件,协同封装的电子和光子芯片,以及晶圆级封装应用提供解决方案。

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MRSI宣布MRSI-H / HVM系列贴片机精度提升至1.5微米

MRSI Systems(Mycronic Group)很高兴宣布公司MRSI-H / HVM系列产品线的最新进展。MRSI使用行业标准玻璃芯片参考样品测试放置精度,测试结果显示,产品精度从3Sigma的±3微米增强至±1.5微米。该产品从2019年10月1日发货开始,产品名称改为MRSI-H和MRSI-HVM(之前称为MRSI-H3和MRSI-HVM3)。

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MRSI Systems Welcomes Dr. Limin Zhou as Senior Director of Strategic Marketing

MRSI Systems, part of the Mycronic Group is pleased to announce the appointment of Dr. Limin Zhou as the Senior Director of Strategic Marketing to expand MRSI’s market presence in China. He will

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MRSI launches new Die Bonder with improved throughput for high power laser manufacturers

MRSI Systems (Mycronic Group) is pleased to announce the introduction of MRSI-H-HPLD+, the latest advancement in the MRSI-H/HVM-series product line. This new variant of the successful

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MRSI Systems Acquires Die Bonding Business

BILLERICA, MA — January 31, 2014 — MRSI Systems, a developer and manufacturer of turnkey chip placement and dispensing systems, announced today it has completed a leveraged buyout of assets from

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MRSI为5G无线网络光电器件推出新型MRSI-H3TO贴片机产品

MRSI系统公司(Mycronic集团)推出MRSI-H3TO新型3微米高速贴片机,这是业界第一款可以真正满足多晶片和多流程的要求,可实现行业领先的贴片速度、卓越的灵活性以及为未来产品准备的3微米贴片精度。 MRSI-H3TO专为WDM与EML-TO或其他多晶片多流程TO-can光电器件量身打造,以支持即将普及的5G无线网络。

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Join us in March!

March will be a busy month for device packaging exhibitions. Please join MRSI Mycronic at these upcoming events. We hope to see you there to discuss our latest new product innovations. Learn more

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Jon Medernach to retire after a triumphant twenty years at MRSI Systems

After over 40 years of a successful capital equipment sales career, Jon Medernach will be hanging up his hat and enjoying retirement at the end of the month. As we bid farewell to Jon, our North

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The High-Performance and Flexible MRSI A-L for Optical Assembly

The optical components industry demands highly precise and customized equipment for complex optical assembly processes. We have answered this need with our new active aligner - a high-performance

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Die bonding solution for Chip-on-Submount (CoS) – Excerpt from our LFW article

Excerpt from MRSI’s recent article emphasizes the CoS die bonding process requirements including geometric placement accuracy & void free eutectic bonding.

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MRSI to exhibit at LASER World of PHOTONICS CHINA 2023 with live demos

die-bonding LASER World of PHOTONICS CHINA 2023 MRSI Booth MRSI to exhibit at LASER World of PHOTONICS CHINA 2023 with live demos MRSI will exhibit at LASER World of PHOTONICS CHINA from July

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Register for the Laser Focus World Webinar: Gen AI: Catalyst for Optical Module Innovation

die-bonding Register for the Laser Focus World Webinar: Gen AI: Catalyst for Optical Module Innovation Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Mycronic and General Manager

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Meet the MYTower family

pcb-assembly A generation of storage for factories of all shapes and sizes Meet the MYTower family Mycronic’s previous SMD Tower set the benchmark for intelligent component storage. After

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The false call killer

pcb-assembly — a Q & A with Romain Roux and Nicolas Guillot on DeepReview and the power of AI-driven inspection The false call killer Some call it the “false call killer”: a new Automatic

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Cooperation in software development

pcb-assembly Teamwork makes the dreamwork Cooperation in software development In the electronics industry, change is everywhere. With the rising complexity in SMT production comes a greater need

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The power of one - MYPro Create

pcb-assembly — empowering multi-machine programming with one dataset, one program and one workflow The power of one For years, Mycronic inspection customers have benefitted from a single

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For a rugged world

pcb-assembly MYC60 industrial dispenser Automated industrial dispensing For a rugged world The world is witnessing a massive rollout of heavy-duty boards. Whether for broadband infrastructure,

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Taking productivity to new heights

How one aerospace manufacturer saves time and boosts production volumes with Mycronic's material handling storage towers

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Exploring pioneering ideas

pcb-assembly Female working in Täby, Sweden Exploring pioneering ideas Exploring pioneering ideas Innovation is in our DNA, and being innovative means daring to enter uncharted territory. In

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Open new doors to automated material handling

pcb-assembly Introducing the new dual-terminal MYTower Open new doors to automated material handling If you’re like most manufacturers, repetitive material handling tasks can consume entirely too

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User-driven design

Introducing the all-new pick-and-place graphical user interface User-driven design An all-new pick-and-place graphical user interface (GUI) raises the visibility of vital process data while

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Live events

Live events pcb-assembly

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Mycronic Germany

Mycronic Germany Mycronic, Germany, Munich Mycronic GmbH Inselkammerstraße 10 D-82008 Unterhaching bei München +49 89 45 24 24 8 - 0 +49 89 45 24 24 8 - 80 Mycronic, Unterhaching, Germany

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Mycronic France

Mycronic France Mycronic France Mycronic S.A.S 1 rue de Traversière 94513 Rungis Cedex 1 France +33 1 41 80 15 80 +33 1 46 86 77 89 Mycronic, Rungis , France Yes, please contact me

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Evolution of a coater

pcb-assembly Offline programming From high volume coating machine to flexible, full featured, easy to program coating system Evolution of a coater MYCRONIC INTRODUCED the MYC50 conformal coating

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A high-tech future down under

At its headquarters in a high-tech industry hub in Brisbane, Australia, Elexon Electronics is investing in the future of advanced local manufacturing. For CEO Frank Faller, this means finding new

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Mycronic promises to eliminate majority of false calls with new deep learning system for 3D AOI

Mycronic, the leading Sweden-based electronics assembly solutions provider, has announced the launch of DeepReview, a new Automatic Defect Classification system that leverages the power of AI to

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New M2M standard opens the door to Industry 4.0

pcb-assembly Mycronic to chair initiative and roll out Hermes-compatible equipment in 2020 New M2M standard opens the door to Industry 4.0 There’s a new messenger in town and it’s called Hermes.

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Mycronic to showcase its full-line solution at IPC APEX EXPO 2025

Mycronic, the leading Sweden-based electronics assembly solutions provider, continues to respond to growing customer demand by offering high-flexibility and high-productivity solutions.