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MRSI Systems Welcomes Dr. Limin Zhou as Senior Director of Strategic Marketing
MRSI Systems, part of the Mycronic Group is pleased to announce the appointment of Dr. Limin Zhou as the Senior Director of Strategic Marketing to expand MRSI’s market presence in China. He will
MRSI Systems Announces Chinese Patent Issued Covering Die Placement Head with Turret
Mycronic Global Technologies Business Unit, MRSI Systems announces the recent issuance of utility patent titled “DIE PLACEMENT HEAD WITH TURRET” and numbered ZL 201680048482.5 (PCT/US2016/047135)
MRSI launches new Die Bonder with improved throughput for high power laser manufacturers
MRSI Systems (Mycronic Group) is pleased to announce the introduction of MRSI-H-HPLD+, the latest advancement in the MRSI-H/HVM-series product line. This new variant of the successful
MRSI to present at Automotive LIDAR 2021
MRSI (Mycronic Group) is exhibiting, sponsoring, and presenting at the Automotive LIDAR 2021 Virtual Conference and Exhibition from September 21-23rd, 2021, a leading event in the
MRSI Systems Acquires Die Bonding Business
BILLERICA, MA — January 31, 2014 — MRSI Systems, a developer and manufacturer of turnkey chip placement and dispensing systems, announced today it has completed a leveraged buyout of assets from
MRSI Systems (Mycronic Group) delivered a keynote speech at the 2022 CFOL Optical Interconnection Conference and MRSI-H-HPLD+ 1.5 micron Die Bonder won the Award for “2022 CFOL Product Innovation”
Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems (Mycronic Group) and General Manager of MRSI Automation (Shenzhen) Co., Ltd., was invited to participate in the 2022 CFOL
MRSI will be attending and sponsoring IMAPS Boston 2022
MRSI Systems, Mycronic Group will be exhibiting at the 55th International Symposium on Microelectronics from October 4-5th in Boston Massachusetts at the Hynes Convention Center.
MRSI to present at the 21st Infostone Optical Communication Market and Technology Conference
MRSI will be presenting at the Infostone Optical Communication Market and Technology Conference which will be held at the Hyatt Regency Shenzhen Airport Hotel in Shenzhen, China from September
Join MRSI at the 50th European Conference on Optical Communication
We are pleased to be exhibiting again this year at the 50th ECOC in Frankfurt am Main, Germany.
MRSI is presenting and sponsoring the iMAPS New England 48th Symposium and Expo
The iMAPS New England Symposium and Expo will be held in Boxborough, MA on May 3rd, 2022 at the Boxboro Regency Hotel. Technical sessions include Advanced Packaging, RF& Microwave – 5G
Join MRSI at SPIE Photonics West in San Francisco
die-bonding Join MRSI at SPIE Photonics West in San Francisco Join MRSI at SPIE Photonics West in San Francisco Meet with MRSI Systems, Mycronic Group in San Francisco Booth #5405 MRSI will be
Register for the Laser Focus World Webinar: Gen AI: Catalyst for Optical Module Innovation
die-bonding Register for the Laser Focus World Webinar: Gen AI: Catalyst for Optical Module Innovation Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Mycronic and General Manager
Visit MRSI at the Compound Semiconductor Advanced Technology & Application Conference
Visit us at the CSC Conference in Suzhou, China from August 3-4th to discuss the current and future states of compound semiconductor device technology with us and other industry experts.]
Join MRSI at SEMICON West 2022
We are excited to announce that MRSI Systems will be exhibiting at SEMICON West from July 12-14th at the Moscone Center in San Francisco! Visit us at booth #2355 to talk with us about topics such
Visit MRSI Systems at the European Conference on Optical Communications (ECOC) 2017 — New Die Bonder for High Volume Manufacturing
Over three decades, MRSI Systems has developed a family of high precision eutectic die bonders for high volume manufacturing of optoelectronics.
High Volume Manufacturing of Photonic Devices: Assembly Starts with Design
The explosive growth of internet traffic demands higher bandwidth in data communications. High volume manufacturing of photonic devices is crucial.
International Microwave Symposium 2018
MRSI Systems is exhibiting at IMS (Booth #448)—the world’s largest Microwave and RF industry event in Philadelphia, PA at the Pennsylvania Convention Center June 10-15, 2018.
Fully Automated Die Bonding Systems — The Importance of Proper Lighting
Lighting is an important component of any vision recognition system. When it comes to lighting, it is not a case of “one size fits all.”
China International Optoelectronic Expo – September 2017
die-bonding MRSI CYCAD CIOE Booth 2017 China International Optoelectronic Expo – September 2017 MRSI Systems is exhibiting at CIOE with our Chinese Representative CYCAD Century Science and
MRSI Systems Supports “Advancing Innovation in Photonics”
die-bonding MRSI Systems Supports “Advancing Innovation in Photonics” Background MRSI Systems is a community member of AIM (American Institute of Manufacturing) Photonics and the local Photonics
Join MRSI Systems at OFC!
MRSI is exhibiting at the Optical Fiber Communication Conference and Exhibition (OFC) March 21-23, at the Los Angeles Convention Center (Booth 1728). We invite you to explore MRSI’s product
Technology Students Experience Local Advanced Technology Manufacturer Up Close
Middlesex Community College technology students recently visited our factory in Billerica, MA.
International Microwave Symposium 2017
MRSI Systems is exhibiting at IMS (Booth #1847)—the world’s largest Microwave and RF industry trade show in Honolulu, Hawaii June 4-9, 2017.
Dr. Yi Qian, MRSI Systems: Automated Die Bonding Trends in the 5G Era
9月4日-7日,全球极具规模及影响力的光电产业综合性展会——第21届中国国际光电博览会(简称光博会/CIOE)在深圳会展中心举办。作为全球光电器件自动化贴片封装设备的领军企业,MRSI Systems(Mycronic Group)与CYCAD Century Science and Technology携手亮相本次光博会,并重点展出MRSI-H、MRSI-HVM等系列产品与最新技术。
Visit MRSI Systems Demonstration Center in Shenzhen – Mycronic Facility
MRSI Systems, a leading manufacturer of fully automatic, high-speed, high-precision, flexible and multi-functional die bonding systems, demonstration capability was officially opened at the
Dr. Yi Qian, MRSI Systems: Automated Die Bonding Trends in the 5G Era
The arrival of 5G marks a new era for the manufacturing supply chain. This transformation presents new challenges for die bonding and packaging processes. As a leader in the automated packaging
Visit MRSI Systems Demonstration Center in Shenzhen – Mycronic Facility(2)
ICCSZ讯 近日,全自动,高速,高精度,灵活多功能的贴片系统的领先制造商MRSI Systems在中国深圳南山绿创云谷大厦的Mycronic展示中心正式开放。在MRSI Systems战略营销高级总监周利民博士的带领下,讯石人员参观了演示中心全貌并了解MRSI Systems的现状及MRSI-HVM3贴片设备的应用。
MRSI Named in the 2019 Infostone Top Honors List in China, with the MRSI-HVM Series Receiving the Award for the Most Competitive Product for Optical Communications
MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed die bonding and dispensing systems, has been recognized in the list of 2019 Infostone top
MRSI Systems to Exhibit MRSI-H-LD at Productronica
MRSI Systems is a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems, and will be exhibiting at Productronica from November 12-15, 2019
MRSI is Presenting at ICCSZ OC Market and Technology Seminar and Offering Die Bonder Demonstrations at CIOE
MRSI Systems and CYCAD Century Science and Technology will partner at the 21st China International Optoelectronic Exposition (CIOE). Product demos will be offered at Cycad’s booth #1C86. The show