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Video gallery

MRSI Systems Video Gallery - See the latest eutectic bonding, die bonding, epoxy stamping, and epoxy die attach videos.

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Optical Components & Transceivers

Learn more about Optical Components and Transceivers from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 40 years.

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MRSI Systems, Mycronic Group announces a new collaboration to provide LiDAR solutions for the Automotive Industry

MRSI Systems is delighted to announce a new collaboration with Lumentum Operations LLC ("Lumentum", NASDAQ: LITE), a leading global photonic chip and module supplier for the automotive LiDAR

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MRSI receives Laser Focus World Innovators Award for H-TO die bonder

MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2022 Silver Honoree for the

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MRSI Systems欢迎资深光电子专家周利民博士出任战略营销高级总监

2019年2月13日–全球领先的半导体系统设备制造商Mycronic集团的子公司,MRSI Systems今日荣幸宣布,光电子资深专家周利民博士将加入公司团队并担任战略营销高级总监,负责拓展MRSI Systems在中国的市场影响力。周博士在光电子行业拥有的丰富专业知识,以及他在中国市场的知名度将有助于推动MRSISystems市场战略布局,制定清晰的产品路线图,以及增强MRSI

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MRSI receives Laser Focus World Silver Award for MRSI-H-HPLD Die Bonder

MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2022 Silver Honoree for the

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MRSI Systems 宣布“DIE PLACEMENT HEAD WITH TURRET” (集成水平转塔之芯片贴装头)已获得中国专利授权

MRSI Systems宣布“DIE PLACEMENT HEAD WITH TURRET”(集成水平转塔之芯片贴装头)已获得中国专利授权。迈康尼全球技术部的业务部门-MRSI Systems宣布,中华人民共和国国家知识产权局(CNIPA)已于2021年7月30日授权MRSI Systems 申请的“DIE PLACEMENT HEAD WITH

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MRSI宣布MRSI-H / HVM系列贴片机精度提升至1.5微米

MRSI Systems(Mycronic Group)很高兴宣布公司MRSI-H / HVM系列产品线的最新进展。MRSI使用行业标准玻璃芯片参考样品测试放置精度,测试结果显示,产品精度从3Sigma的±3微米增强至±1.5微米。该产品从2019年10月1日发货开始,产品名称改为MRSI-H和MRSI-HVM(之前称为MRSI-H3和MRSI-HVM3)。

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MRSI Systems Welcomes Dr. Limin Zhou as Senior Director of Strategic Marketing

MRSI Systems, part of the Mycronic Group is pleased to announce the appointment of Dr. Limin Zhou as the Senior Director of Strategic Marketing to expand MRSI’s market presence in China. He will

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MRSI Systems Announces Chinese Patent Issued Covering Die Placement Head with Turret

Mycronic Global Technologies Business Unit, MRSI Systems announces the recent issuance of utility patent titled “DIE PLACEMENT HEAD WITH TURRET” and numbered ZL 201680048482.5 (PCT/US2016/047135)

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MRSI launches new Die Bonder with improved throughput for high power laser manufacturers

MRSI Systems (Mycronic Group) is pleased to announce the introduction of MRSI-H-HPLD+, the latest advancement in the MRSI-H/HVM-series product line. This new variant of the successful

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MRSI to present at Automotive LIDAR 2021

MRSI (Mycronic Group) is exhibiting, sponsoring, and presenting at the Automotive LIDAR 2021 Virtual Conference and Exhibition from September 21-23rd, 2021, a leading event in the

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AOC

Learn more about AOC from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 40 years.

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TO-TOSA/ROSA

Learn more about TO-TOSA/ROSA from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 40 years.

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On-site training

MRSI offers a comprehensive set of training programs covering our family of products. Contact MRSI Systems to learn more about On-Site Training.

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Prototyping and Training Services

We provide prototyping and small batch die bonding services for our customers to shorten your time to market.

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Image gallery

Check out the MRSI Systems gallery for images and videos of MRSI die bonding and epoxy dispensing systems available from MRSI Systems in MA.

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ATC Auto Lidar

“Solutions for Mass Production of Vehicle LiDAR.” LiDAR has become a critical sensor for autonomous driving.

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Webinars

die-bonding

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MRSI Systems推出新型MRSI-H3LD高速贴片机

MRSI系统公司(Mycronic集团)推出MRSI-H3LD新型3微米高速贴片机,专用于大功率半导体激光器中的芯片贴片,广泛应用于工业激光器、光纤放大、光源和传感器等先进光电子应用。

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MRSI Announces HVM3 Die Bonding Demonstration Capability in Shenzhen China

STOCKHOLM, Nov 9, 2018 — MRSI Systems (Mycronic Group) announces new demonstration capability at its sister company, Shenzhen Axxon Automation (Mycronic Group) facility in the Longhua district,

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News

News die-bonding

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Products

Mycronic’s jet printing, dispensing, coating and plasma technologies make it possible to solve any dispensing or conformal coating challenge.

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Tabletop dispensing

Precision printing. High-speed jet printer and solder paste PCB printing, surface mount soldering dispenser for a wide range of assembly fluids.

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Welcome to Mycronic

Welcome to Mycronic Solder paste inspection Automated optical inspection PI series 3D SPI. Perfect solder joints made simple. Accurate solder paste inspection with unprecedented simplicity. I

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Contact form SM

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Thank you for contacting us regarding PCB assembly

Thank you for contacting us! We will now read your message and expect to get back to you within 48 hours. Do you want to learn more about us? Please see our news, events and webinars. 

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Best Technology Award Founder

bare-board-testning atg Luther & Maelzer GmbH won the "Best Technology Award" of Founder PCB in 2024 On January 10, 2025, the 2024 Founder PCB Supplier Conference was held in Zhuhai.

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Solutions

Solutions Flying ahead in Michigan with Calumet A9a Mycronic is providing its latest Flying Probe electrical testing system.

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Best Support Award from Bomin

bare-board-testning "Shaping the Future, Igniting New Journeys" atg Luther & Mealzer GmbH Awarded Bomin’s 2025 "Best Support Award" On May 24, 2025, the grand opening ceremony