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Global industrie 2024

pcb-assembly FR fr Paris Nord Villepinte Global industrie

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NEPCON Thailand 2025

MRSI is exhibiting with our distributor PREM at NEPCON Thailand, scheduled from June 18-21, 2025, at BITEC in Bangkok.

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Optica Executive Forum at OFC 2025

die-bonding US en San Francisco, CA USA Optica Executive Forum at OFC 2025 Optica Executive Forum at OFC 2025 MRSI Mycronic is sponsoring the Optica Executive Forum at OFC 2025. Executive Forum -

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The Innovation Conference on CPO (Co-Packaged Optics)and Heterogeneous Integration Technology

Dr. Limin Zhou to present AI-Driven High-Speed Optical Module Packaging Tech Trends at The Innovation Conference on CPO (Co-Packaged Optics) and Heterogeneous Integration Technology.

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Wafer-Level Packaging Symposium 2025

die-bonding US en San Francisco, CA, USA Wafer-Level Packaging Symposium Wafer-Level Packaging Symposium 2025 The Wafer-Level Packaging Symposium will be held in San Francisco, CA from February

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MRSI Systems – ATC Auto Lidar Webinar

die-bonding CN zh-Hans MRSI Systems – ATC Auto Lidar Webinar On March 17th, 2022, Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems (Mycronic group) and General Manager of

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China International Optoelectronic Expo Conference

die-bonding CN en Shenzhen, China CIOE Conference CIOE Conference Location: Shenzhen, China Dr. Limin Zhou will present “The Evolution and Trends of Optoelectronic Chip Packaging in the AI Era”

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Massachusetts Manufacturing Mash-Up

die-bonding US en Gillette Stadium, Foxborough, MA Massachusetts Manufacturing Mash-Up Join us at the 2024 Massachusetts Manufacturing Mash-Up.

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OFC 2024

die-bonding US en San Diego, CA USA Optical Fiber Communication Conference® and Exposition 2024 Optical Fiber Communication Conference® and Exposition MRSI Booth #1800

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TPCA Show 2023

bare-board-testning TW en Nangang Exhibition Hall, Taipei / Taiwan TPCA Show 2023 TPCA Show 2023 PCB Expo Taiwan 1. PCB Manufacturing: manufacture of single-layer PCB, double-layer PCB,

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JPCA Show 2023

bare-board-testning JP en JPCA Show 2023 Location: Tokyo International Exhibition Center, Tokyo, Japan All-day event

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Productronica 2023

bare-board-testning DE de Location: Munich, Germany Productronica 2023 Productronica 2023

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HKPCA 2024

bare-board-testning CN en at Shenzhen World Convention & Exhibition Center (Baoan), Shenzhen HKPCA 2024

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JPCA 2024

bare-board-testning JP en at Tokyo International Exhibition Center, Tokyo JPCA 2024

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KPCA 2025

bare-board-testning KR en at Songdo Convensia Convention Center, Incheon KPCA 2025

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IPC 2026

bare-board-testning US en at Anaheim Convention Center, California IPC Apex 2026

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TPCA 2024

bare-board-testning TW en at Nangang Exhibition Hall, Taipei TPCA 2024

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IPC 2024

bare-board-testning US en at Anaheim Convention Center, California IPC 2024

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TPCA 2025

bare-board-testning TW en at Nangang Exhibition Hall, Taipei TPCA 2025

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SEMICON Southeast Asia 2026

die-bonding MY en MITEC, Kuala Lampur, Malaysia SEMICON Southeast Asia 2026 SEMICON Southeast Asia 2026 We are happy to be exhibiting at SEMICON Southeast Asia. Visit MRSI Mycronic Booth #2119.

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IMS - International Microwave Symposium 2026

MRSI to exhibit at the International Microwave Symposium 2026.

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IMAPS Device Packaging Conference 2025

die-bonding US en Phoenix, AZ, USA IMAPS Device Packaging 2025 IMAPS Device Packaging 2025 The 21st Annual Device Packaging Conference (DPC 2025) will be held in Phoenix, Arizona, on March 3-6,

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China International Optoelectronic Conference 2024

die-bonding CN en Shenzhen, China CIOE Conference CIOE Conference Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems, Mycronic Group, and General Manager of MRSI Automation (

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EPIC (European Photonics Industry Consortium) TechWatch at CIOE

die-bonding CN en Shenzhen, China EPIC (European Photonics Industry Consortium) TechWatch at CIOE On September 11th, 2024, Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems,

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CIOE – China International Optoelectronic Expo 2024

die-bonding CN en Shenzhen, China CIOE Logo 2024 China International Optoelectronic Exposition (CIOE) 2024 CIOE is the world’s largest optoelectronics event. Location: Shenzhen World Convention

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Compound Semiconductor Conference

die-bonding US en Suzhou, China Compound Semiconductor Conference Banner Compound Semiconductor Conference Dr. Limin Zhou to present “A New Engine for the Development of Photonics Industry –

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IMAPS Boston 2024

die-bonding US en Boston, MA, USA IMAPS Boston 2024 International Microelectronics Assembly and Packaging Society (IMAPS) Boston 2024 The International Symposium on Microelectronics is focused on

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Asia Photonics Expo 2025

die-bonding SG en Marina Bay Sands Singapore Asia Photonics Expo 2025 Asia Photonics Expo 2025 MRSI Mycronic will exhibit at the Asia Photonics Expo 2025. Stand No.: B111

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SEMICON West

die-bonding US en San Francisco, CA USA SEMICON West includes the extended microelectronics industry supply chain. Booth: South Hall #762

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Productronica 2025

Mycronic PCB Assembly 2025 Events