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Mycronic receives order for an SLX mask writer
Mycronic AB (publ) has received an order for an SLX mask writer from an existing customer in Asia. The order value is in the range of USD 5-7 million. Delivery of the system is planned for the
Imprint
Imprint atg Mycronic GmbH Karl-Carstens-Strasse 19 97877 Wertheim Phone: +49 9342 291 0 Email: info.atg@mycronic.com Managing Director: Dr. Jochen Kleinertz; Pierre Brorsson Trade register entry:
Flying probe for substrate test
Flying probe for substrate test S3 S3-8 S3-8 The S3 is able to test 10 µm structures while achieving 100 measurements per second. The shuttle of the S3-8 can clamp and tension double sided
Solutions
Solutions Flying ahead in Michigan with Calumet A9a Mycronic is providing its latest Flying Probe electrical testing system. atg Mycronic Solutions
Excellent Partner Award from SCC
bare-board-testning Excellent Partner Award from SCC atg Luther & Maelzer's Chinese unit, Test Solutions (Suzhou) Co (TSL), was invited to the supplier meeting in Guangzhou by its customer
Exhibit at IPC Apex 2024
bare-board-testning atg Luther & Maelzer exhibit at IPC Apex 2024 atg Luther Maelzer (a Mycronic company) will showcase their latest technology, the A9 with Automation (A9aL), at the upcoming
Exhibit at IPC Apex 2023
bare-board-testning atg Luther & Maelzer exhibit at IPC Apex 2023 This years IPC Apex show was held for the last time in sunny San Diego. The overall attendance over three days was approximately
Exhibit at CPCA 2024
bare-board-testning atg Luther & Maelzer exhibit at CPCA 2024 This year's CPCA trade fair took place from 13 to 15 May 2024 at the National Exhibition Center in Shanghai. More than 700
MyCare Barebord testing
ATC Auto Lidar
“Solutions for Mass Production of Vehicle LiDAR.” LiDAR has become a critical sensor for autonomous driving.
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Die bonding solutions
Fully automatic high accuracy die bonders that are capable of epoxy and eutectic die bonding are the lifeblood of the modern semiconductor industry.
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1 Micron Die Bonders
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High Precision Flip-chip Die Bonders
Learn more about MRSI's high precision flip chip die bonders.
About us
Under the MRSI brand, we leverage over 40 years of industry expertise in high-accuracy die bonders, active aligners, and fluid dispensers to deliver unparalleled reliability and precision for
History
Learn about MRSI Systems, a MA die bonding and epoxy dispensing system manufacturer in MA.
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Learn about MRSI Systems capabilities and what helps MRSI stand apart from the competition in die bonder and epoxy dispensing system manufacturing.
Thank you for contacting us regarding die bonding
Thank you for contacting us regarding die bonding
Mycronic Sweden HQ
Mycronic Sweden HQ Mycronic headquarter in the winter Mycronic AB Nytorpsvägen 9 Box 3141 183 03 Täby Sweden +46 8 638 52 00 +46 8 638 52 90 Mycronic Täby Yes, please contact me
Join us in March!
March will be a busy month for device packaging exhibitions. Please join MRSI Mycronic at these upcoming events. We hope to see you there to discuss our latest new product innovations. Learn more
Advanced Packaging for Heterogeneous Integration
Advanced heterogeneous integration for 3-D IC packaging, e.g., chiplet, and optoelectronics packaging requires high-precision die bonders that can perform many different processes, such as
Meet the MRSI-705: Your Essential Tool for Precision and Reliability in Critical Applications
The MRSI-705 has established itself as a reliable tool in the aerospace, defense, and medical industries, playing a crucial role in mission-critical tasks due to its performance, adaptability,
The High-Performance and Flexible MRSI A-L for Optical Assembly
The optical components industry demands highly precise and customized equipment for complex optical assembly processes. We have answered this need with our new active aligner - a high-performance
Exploring Automotive LiDAR Packaging Trends
In the November/December 2023 issue of Chip Scale Review, MRSI delves into the fascinating world of automotive light detection and ranging (LiDAR) technology. This article explores the parallels
MRSI shines at May events: showcased and featured
In the bustling world of technology, May was a month marked by significant events, and MRSI was at the forefront. With appearances at IMAPS New England in Boxborough, MA, and the 2024
Precision and Reliability in Defense Electronics: Exploring MRSI’s Industry-Leading Solutions
Designing and manufacturing electronic components destined for defense applications entails navigating a landscape of exacting standards. These standards demand unparalleled reliability, minimal
MRSI New Solution: Tape Holder
If you are looking to pick from tape and do not have a tape and real feature on your machine, then we have a solution for you. The two inch metal tape holder can accommodate four two-inch strips
The MRSI-H1 Family: Unleashing Precision and Agility
The MRSI-H1 family of 1-micron flip-chip die bonders stands out as an advanced ultra-precision solution.