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At CIOE 2020 MRSI Systems will introduce a new product, MRSI-S-HVM high-speed, flexible 0.5 micrometer die bonder for silicon photonics, co-packaging.

MRSI Systems(Mycronic Group)赞助由ICCSZ举办的第18届光纤通讯市场暨技术专题研讨会，研讨会将于9月2日至3日在中国深圳举行。同期，中国国际光电博览会(CIOE)于2019年9月4日至7日在中国深圳隆重召开。

ICC讯 在CIOE 2020，MRSI SYSTEMS将推出一款新产品，高速、灵活的0.5微米 MRSI-S-HVM 贴片机，为硅光器件，协同封装的电子和光子芯片，以及晶圆级封装应用提供解决方案。

MRSI Systems（Mycronic Group）很高兴宣布公司MRSI-H / HVM系列产品线的最新进展。MRSI使用行业标准玻璃芯片参考样品测试放置精度，测试结果显示，产品精度从3Sigma的±3微米增强至±1.5微米。该产品从2019年10月1日发货开始，产品名称改为MRSI-H和MRSI-HVM（之前称为MRSI-H3和MRSI-HVM3）。

MRSI Systems, part of the Mycronic Group is pleased to announce the appointment of Dr. Limin Zhou as the Senior Director of Strategic Marketing to expand MRSI’s market presence in China. He will

MRSI Systems (Mycronic Group) is pleased to announce the introduction of MRSI-H-HPLD+, the latest advancement in the MRSI-H/HVM-series product line. This new variant of the successful

BILLERICA, MA — January 31, 2014 — MRSI Systems, a developer and manufacturer of turnkey chip placement and dispensing systems, announced today it has completed a leveraged buyout of assets from

MRSI系统公司（Mycronic集团）推出MRSI－H3TO新型3微米高速贴片机，这是业界第一款可以真正满足多晶片和多流程的要求，可实现行业领先的贴片速度、卓越的灵活性以及为未来产品准备的3微米贴片精度。 MRSI－H3TO专为WDM与EML－TO或其他多晶片多流程TO－can光电器件量身打造，以支持即将普及的5G无线网络。

March will be a busy month for device packaging exhibitions. Please join MRSI Mycronic at these upcoming events. We hope to see you there to discuss our latest new product innovations. Learn more

After over 40 years of a successful capital equipment sales career, Jon Medernach will be hanging up his hat and enjoying retirement at the end of the month. As we bid farewell to Jon, our North

The optical components industry demands highly precise and customized equipment for complex optical assembly processes. We have answered this need with our new active aligner - a high-performance

Excerpt from MRSI’s recent article emphasizes the CoS die bonding process requirements including geometric placement accuracy & void free eutectic bonding.

die-bonding LASER World of PHOTONICS CHINA 2023 MRSI Booth MRSI to exhibit at LASER World of PHOTONICS CHINA 2023 with live demos MRSI will exhibit at LASER World of PHOTONICS CHINA from July

The iMAPS New England Symposium and Expo will be held in Boxborough, MA on May 3rd, 2022 at the Boxboro Regency Hotel. Technical sessions include Advanced Packaging, RF& Microwave – 5G

die-bonding Register for the Laser Focus World Webinar: Gen AI: Catalyst for Optical Module Innovation Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Mycronic and General Manager

Advanced production solutions for printed circuit board assembly, dispensing and chip protection in cellphones, medical, cars, etc. and world-leading laser writers for photomask for displays and

Archive annual meetings Annual General Meeting, May 8 2024, Täby Digital registration for the Annual General Meeting, click here. Digital post voting form, click here. Notice to Annual

Stay updated on the latest news and events from Mycronic, a global company that advances electronics technology with innovative solutions and a diverse work culture.

During Mycronic’s Capital Markets Day you can learn more about our group strategy, financial and sustainability targets, product areas and global technologies.

Mycronic is a leading provider of production solutions for the electronics industries. Learn about our growth and profitability, our goals for net sales, EBIT and Co2, and how we invest in

ID: 80400 | Version: 3 | Published: April 15, 2024 Mycronic group health and safety policy Mycronic is committed to providing a safe, healthy environment for employees, consultants and all those

pcb-assembly The MYPro A40 in brief Two ambitious goals. One powerful mounthead technology. 48% faster throughput Six times larger components All-new graphical user interface A united force of

A flexible full-service PCB assembly partner has been able to expand beyond PCB manufacturing.

pcb-assembly Available in the beginning of 2024 Mycronic’s stencil printing and jet printing platforms combine to produce any board at any speed. Printing without limits Business is growing for

pcb-assembly — how the new MYPro S series brings high-volume performance to high-flex manufacturing User-driven design “Our customers are growing. But they should never outgrow their investment,”

Mycronic, the leading Sweden-based electronics assembly solutions provider, will continue to respond to growing customer demand for high-flexibility, high-productivity solutions for zero-defect

As an innovative European contract manufacturer, DF Elettronica is determined to continually push the limits of automation. Whether it’s inspection, traceability, material transport or process

pcb-assembly With the new MYPro I™ series 3D AOI Programming just got simpler Faster programming. Smarter guidance. Zero false calls. When it comes to advanced 3D AOI, demands are high and

pcb-assembly How smarter human–machine collaboration is making your people more valuable than ever Empowering people through automation Even with all your resources running at full capacity,

pcb-assembly And this time, it’s vertical The connectivity continues Over the past year, Hermes compatibility has been added to a number of Mycronic’s SMT solutions. The next step is to extend