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Mycronic AB wins European Business Awards 2015/16 in the category Import/Export

Mycronic AB wins European Business Awards 2015/16 in the category Import/Export Täby, 21 June, 2016 - After a 15-month long competition period, Mycronic AB (publ) has taken first place in the

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Communiqué from the AGM of Mycronic AB (publ)

Communiqué from the AGM of Mycronic AB (publ) Täby, 4 May, 2016 – The Annual General Meeting (AGM) of Mycronic AB (publ) on 3 May, 2016 dealt with the following items among others: Election

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Mycronic introduces industry's fastest jet dispensing platform at IPC APEX

Mycronic introduces industry's fastest jet dispensing platform at IPC APEX Täby, 4 March, 2016 - Mycronic, the leading Sweden-based SMT solutions provider, is expanding the capabilities of

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Mycronic AB (publ), Interim report first quarter January-March 2016

Mycronic AB (publ), Interim report first quarter January-March 2016 First quarter – strong demand for mask writers but weaker start for SMT equipment Mycronic reports today an increased order

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Mycronic receives one more order for a replacement mask writer

Mycronic receives one more order for a replacement mask writer Täby, 2 May, 2016 - Mycronic AB (publ), has received yet another order for a mask writer, replacing an older system for manufacturing

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Mycronic publishes the 2015 Annual report

Mycronic publishes the 2015 Annual report Täby, 31 March, 2016 – Mycronic AB (publ) today publishes the 2015 Annual report. The 2015 Annual report is available on the company web site as a PDF

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Die bonding solutions

Fully automatic high accuracy die bonders that are capable of epoxy and eutectic die bonding are the lifeblood of the modern semiconductor industry.

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Testimonials

See what real MRSI Systems customers are saying about our Die Bonding and Epoxy Dispensing systems and how they have helped them succeed.

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1 Micron Die Bonders

Learn more about MRSI's 1 micron die bonders.

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High Precision Flip-chip Die Bonders

Learn more about MRSI's high precision flip chip die bonders.

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About us

Under the MRSI brand, we leverage over 40 years of industry expertise in high-accuracy die bonders, active aligners, and fluid dispensers to deliver unparalleled reliability and precision for

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History

Learn about MRSI Systems, a MA die bonding and epoxy dispensing system manufacturer in MA.

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Why do customer's choose MRSI?

Learn about MRSI Systems capabilities and what helps MRSI stand apart from the competition in die bonder and epoxy dispensing system manufacturing.

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Thank you for contacting us regarding die bonding

Thank you for contacting us regarding die bonding

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ATC Auto Lidar

“Solutions for Mass Production of Vehicle LiDAR.” LiDAR has become a critical sensor for autonomous driving.

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MRSI-S-HVM Submicron Die Bonder won the award for “Infostone 2020 The Most Competitive Optical Communications Product”

MRSI Systems (Mycronic Group), submicron die bonder MRSI-S-HVM won the award for "The Most Competitive Optical Communications Product in 2020." The MRSI-S-HVM submicron die bonder was recognized

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MRSI opens a new Product Demo Center in China, will present at the Infostone Conference and attend CIOE with live demos

MRSI Systems (Mycronic Group) will exhibit at the 23rd China International Optoelectronic Exposition (CIOE) at the Shenzhen World Exhibition & Convention Center from September 16-18, 2021. MRSI

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MRSI发布为硅光器件、协同封装和晶圆级封装提供亚微米级贴片解决方案

ICC讯 在CIOE 2020,MRSI SYSTEMS将推出一款新产品,高速、灵活的0.5微米 MRSI-S-HVM 贴片机,为硅光器件,协同封装的电子和光子芯片,以及晶圆级封装应用提供解决方案。

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MRSI推出升级版MRSI-705贴片机 助力大批量制造

ICC讯 在IMAPS 2020上,MRSI Systems推出了新型5微米贴片机产品,面向量产配置的MRSI-705。MRSI-705于2012年首次推出,在贴片机行业中处于领先地位,可在一台机器上为客户提供多种应用解决方案。MRSI-705新的配置提供了创新的水平转塔功能,可以在不牺牲灵活性,准确性和可靠性的前提下,显著提高机器的速度和生产率。

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MRSI launches MRSI-705 high-volume configuration

At IMAPS 2020 MRSI Systems will introduce a new 5 micrometer die bonder product, MRSI-705 high-volume configuration. The MRSI-705 was first introduced in 2012 and has enjoyed a dominant position

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MRSI to exhibit with live demonstrations and present at the China International Optoelectronic Expo

die-bonding MRSI to exhibit with live demonstrations and present at the China International Optoelectronic Expo We are proud to announce that MRSI, Mycronic Group will be exhibiting at the 24th

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MRSI to Offer Live Die Bonding Demos at Laser World of Photonics, March 17-19, 2021

MRSI Systems (Mycronic Group) will offer live product demonstrations at Laser World of Photonics held at the Shanghai New International Expo Center (Booth #W2.2587) in Shanghai, China March

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MRSI Systems and Palomar Technologies Reach Agreement in Intellectual Property Dispute

Boston, MA – December 10, 2020 – MRSI Systems, LLC and Palomar Technologies, Inc. jointly announce they have reached a confidential agreement that settles all litigation currently pending between

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MRSI Mycronic announces advanced high-speed 1µm die bonder MRSI-LEAP for ultra-high-volume manufacturing of AI optical module applications

MRSI Mycronic is proud to announce the launch of the MRSI-LEAP high-speed 1µm die bonder. This innovative equipment is designed for ultra-high-volume manufacturing of optical modules,

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MRSI Mycronic to showcase high-speed assembly solutions at CIOE 2025

die-bonding MRSI Mycronic CIOE Booth 2025 MRSI Mycronic to showcase high-speed assembly solutions at CIOE 2025 MRSI Mycronic, part of the Mycronic Group, will present advanced assembly solutions

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MRSI中国新产品演示中心开业,将出席讯石研讨会,参加CIOE展会并提供现场演示

die-bonding MRSI中国新产品演示中心开业,将出席讯石研讨会,参加CIOE展会并提供现场演示 摘要:第23届中国国际光电博览会(CIOE)将于2021年9月16-18日在深圳国际会展中心举办。MRSI Systems (Mycronic Group)届时将携最新的MRSI-HVM带轨道双机头固晶机参展,MRSI将在展位#4B79进行现场演示。MRSI

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MRSI introduces innovative MRSI-A-L Active Aligner for optical packaging solutions

MRSI Systems (a part of Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, proudly introduces the MRSI-A-L

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MRSI introduces 705HF High Force Die Bonder for power devices and advanced chip packaging

MRSI Systems (a part of Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, has launched the MRSI-705HF high

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MRSI Mycronic to showcase and present innovative die bonder solutions at CIOE 2023

die-bonding CIOE 2023 MRSI Booth MRSI Mycronic to showcase and present innovative die bonder solutions at CIOE 2023 MRSI, a part of Mycronic Group, will exhibit our family of die bonders and

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Webinars

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