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die-bonding MRSI Systems’ Exceptional Customer Support After the sale, the real test of a quality business is what happens next. What happens if I have a problem? Can you reach a human being

Customers appreciate the extensive product knowledge that the team has and that they are able to talk to a person that knows them and their machine.

die-bonding IMS 2019 Boston The International Microwave Symposium was held at the Pennsylvania Convention Center in Philadelphia last month. The event was well attended with over 8,400

The 50th Annual International Symposium on Microelectronics will be held October 9-12, 2017, in Raleigh, North Carolina. MRSI Systems will be exhibiting.

Innovation in wireless technology leads to faster and smarter networks. 5G and the Internet of Things (IoT) have the capacity to connect everyone & devices.

die-bonding Hybrid Electronics Technology for Printed Lighting Several members of the MRSI Systems’ team attended the February iMAPS New England-SMTA Boston Technical presentation by Dr. Adam

die-bonding 2017 Optical Fiber Communication Conference and Exhibition (OFC) Highlights MRSI Systems is a frequent participant at OFC. OFC gave us an opportunity to meet with our customers and

Jon is a strong proponent of relationship selling and believes in the importance of customer advocacy within MRSI by providing the customer a voice.

The International Microelectronics Assembly and Packaging Society New England Chapter’s Symposium will be held in Boxborough, MA on May 2nd, 2017.

“MRSI Systems was glad to exhibit at the Technology Corner, attend the technical conference, and meet customers at ECTC this year again."

Thank you to all who stopped by the MRSI booth at the International Microwave Symposium to discuss microwave RF package applications.

MRSI Mycronic received the "Optical Communication Innovation Product Award" at the CFCF2025 Optical Connectivity Conference. Our MRSI-LEAP High-Speed die bonder was recognized for its precision

On December 6, 2024, Infostone successfully held its 2024 Annual Summary and the 11th Heroes List Award live conference. Awards presented included "The Most Competitive Products of Optical

Fluxless soldering, especially with 80/20 Au/Sn ribbon and preforms, is a critical process in advanced electronic packaging where reliability and cleanliness are paramount. While soldering

The MRSI-705 features an innovative design with a versatile thirteen-position tool bank for quick, automatic tool changes. Enhanced functionality is achieved with additional tool change banks,

At the IMAPS New England Symposium, MRSI will showcase our latest innovations.

Join MRSI at the upcoming Compound Semiconductor Advanced Technology and Application Conference (CSC) taking place on May 22-23, 2024, in Suzhou, China.

Achieving precise and reliable die bonding is crucial in numerous industries, especially when demanding a high degree of parallelism between bonding surfaces.

Handling delicate, large aspect ratio, and thin dies is essential across various applications, including RF Power, Optical, and MEMS. These devices have aspect ratios exceeding 45 to 1,

Ultra-high-speed die bonding technology is pivotal in modern manufacturing, particularly for optical modules production. The MRSI-LEAP Ultra-High-Speed Die Bonders exemplify this advancement,

March is gearing up to be an exciting month as our team is travelling to attend several major events and exhibitions. We’re excited to present our newest innovations and connect with the community

The Innovation Conference on CPO and Heterogeneous Integration Technology will take place September 4-6, 2025, in Wuxi, China. During the conference, Dr. Limin Zhou will discuss recent and

die-bonding MRSI Mycronic IMAPS New England 2025 Join MRSI Mycronic at IMAPS New England in May! MRSI Mycronic will be exhibiting, sponsoring, and presenting at the IMAPS New England event on May

In January 2025, MRSI Mycronic will sponsor and exhibit at the prestigious Chiplet Summit. This event gathers global leaders in semiconductor technology to discuss innovations in chiplet design

At the recent IMAPS Conference in Arizona, co-planarity in die bonding was a key topic due to its importance in 2.5 and 3D chip stacking.

We are excited to participate in IMAPS CHIPcon, the premier event for Chiplet and Heterogeneous Integration Packaging (CHIP) technology, from July 7–10, 2025, in San Jose, CA. This conference

We are pleased to announce we are exhibiting with our distributor PREM at NEPCON Thailand, scheduled from June 18-21, 2025, at BITEC in Bangkok.

Plan now to visit our booth #5407 at SPIE Photonics West, January 28–30, 2025 in San Francisco, CA. Discover our latest technologies, including newly released active alignment solutions and the

LiDAR is an integrated optical detection and measurement system. Compared with typical radar, LiDAR can provide high-resolution distance, velocity, and geometric images, which were originally used

The 21st China International Optoelectronic Expo (CIOE) was held at the Shenzhen Convention and Exhibition Center from September 4-7th, 2019. As the world leader in optoelectronic device