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M Y C R O N IC A N N U A L R E P O R T 2 0 16 Annual report 2016 ”We enable innovative production solutions for future electronics” Mask writers for display manufacturing

M Y C R O N IC A N N U A L A N D S U S TA IN A B IL IT Y R E P O R T 2 0 17 SINGAPORE Mycronic Pte., Ltd. 9 Tagore Lane, #02-08/09 9@Tagore Singapore 787472 UNITED KINGDOM

ANNUAL AND SUSTAINABILITY REPORT 2018 The business partner of choice, enabling the future of electronics OVERVIEW Mycronic in brief Overview and strategy Mycronic in brief 1 Mycronic in

ÅRS- OCH HÅLLBARHETSREDOVISNING 2018 The business partner of choice, enabling the future of electronics ÖVERSIKT Mycronic i korthet Översikt och strategi Mycronic i korthet 1 Mycronic

ANNUAL AND SUSTAINABILITY REPORT 2019 Enabling the future of electronics Overview and strategy 1 Mycronic in brief 2 The year in brief 4 CEO comments 6 Strategy: Developments in the

Års- och hållbarhetsredovisning 2020 Bringing tomorrow’s electronics to life Bringing tomorrow’s electronics to life Elektronik berör alla delar av våra liv. På Mycronic drivs

Annual & Sustainability Report 2022 The audited annual and consolidated accounts can be found on pages 18–27, 36–45, 52–100. The report of the directors is a part of the Annual Report and can

Master any mix. Turn up the volume. MYPro A40™ pick-and-place INTUITIVE INTERFACE DESIGN Of course, no modern production environment is complete without the most streamlined user interface. On

Master any mix. Turn up the volume. MYPro series A40™ Placement CHANGE IS IN THE AIR New components. New product mixes. And now, a fast and flexible assembly line that keeps you several steps

8 Test Heads Pneumatic Tension Shuttle for Flex and Inner layer handling Fast 300 mA Kelvin Testing A5 Neo Flying Probe Test System For Rigid and Flexible Boards A5 Neo Technical

16 Test Heads 20 % higer mechanical speed than A7-16 Light weight Carbon Z-Axis Test System for oversized panels up to 1000 mm Fast 300 mA Kelvin Testing A7-16 Pro Flying Probe Test System For

8 Test Heads High Speed Direct Linear Drives for X and Z motion Light weight Carbon Z-Axis Fully Automatic “Lights-out” Operation Tension Shuttle System for thin core product Fast 300 mA

Latest Generation in advanced technology 8 ultra light carbon fiber test heads High performance linear motion Granit base for high accuracy and repeatability A9 plus Flying Probe Test

Latest Generation in advanced technology 8 ultra light carbon fiber test heads High performance linear motion Granit base for high accuracy and repeatability A9 Flying Probe Test System

Latest Generation in advanced technology 8 ultra light carbon fiber test heads Fully Automatic “Lights-out” operation High performance linear motion Granit base for high accuracy and

16 Test Heads Fast Dual Shuttle System High Speed Direct Linear Drives for X and Z motion No Probe Marks Fast 300mA Kelvin Testing S2-16 plus Flying Probe Test System Double Sided Tester for

16 Test Heads Fast Dual Shuttle System High Speed Direct Linear Drives for X and Z motion No Probe Marks Fast 300mA Kelvin Testing S2-16 Flying Probe Test System Double Sided Tester for Server

8 Test Heads Fast Dual Shuttle System High Speed Direct Linear Drives for X and Z motion No Probe Marks Fast 300mA Kelvin Testing S2-8 Flying Probe Test System Double Sided Tester for Packages

Bringing tomorrow's electronics to life Bringing tomorrow's electronics to life MRSI Systems (a part of Mycronic Group) is the leading manufacturer of fully automated, high-speed,

Bringing tomorrow's electronics to life Bringing tomorrow's electronics to life MRSI Systems (a part of Mycronic Group) is the leading manufacturer of fully automated, high-speed,

Training INFORMATION OVERVIEW Training at MRSI Systems MRSI is currently offering training programs on die bonding and epoxy dispensing solutions at our Tewksbury, MA facility. These courses

MRSI-705HF 5 MICRON HIGH FORCE DIE BONDER Assembly Processes • Thermal Compression Bonding • Sintering • Eutectic Bonding • Epoxy Die Attach • In-situ UV Bonding • Flip Chip Assembly All-In-One

MRSI-LEAP ULTRA HIGH SPEED DIE BONDER • Very high throughput • Exceptionally stable, up to ±1μm @ 3σ placement accuracy • Supports multiple wafers and multiple automated tool changes MRSI

射频功率放大器的自动化生产加速 5G无线网络的推广 作者：周利民 Julius R. Ortega 翻译：赵晓明 [MRSI Systerm, Mycronic Group] 5G 无线网络的成功推广，主要是基于超大规模数量基站布局，这些基站的射频（RF）功率 放大器（PA）与上一代 4G 技术相比密度更高。每一个 5G 的基站都具有更多的信道，而每

Challenges and Solutions for Bonding Ultra-Small Ceramic End- Terminated Capacitors Electronic components and packages continue the trend of miniaturization which drives demand for

MRSI 专访丨全球第一台「双精度亚微米全自动贴片机」 是如何诞生的？ MRSI Systems：2021 年，将在深圳科技园建立独立的产品演示与试验中心，助力光 子集成产业化 2021 年 3 月 17 日至 3 月 19 日，一年一度的慕尼黑上海光博会如约 而至。作为光电行业中极具盛名的大型展会，上海光博会吸引了全球 众多知名企业参展。 在本届慕尼黑上海光博会上，

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High precision die bonding for photonics packaging Scott Trask, Khushwant Singh, Newport Corporation, 1821 E. Dyer Road, Santa Ana, CA 92705 Dan Crowley, Peter Cronin Newport MRSI, 101

3030 Chip Scale Review July • August • 2017 [ChipScaleReview.com] High-volume manufacturing (HVM) of chip-on-submount (CoS): challenges and solutions By Daniel F. Crowley, Peter Cronin [