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New advances in machine learning
pcb-assembly Frequently asked questions about AI is raising the bar in inspection technology New advances in machine learning In the SMT industry, we’re seeing how AI and machine learning are
A showcase stockroom
How intelligent material handling can win customers and grow your business
Feather-light band-aid sensor
pcb-assembly - that can monitor your heart rate Feather-light band-aid sensor SINTEC, AN EU-FINANCED PROJECT FOCUSED ON DEVELOPING SOFT STRETCHABLE ELECTRONICS, CAN NOW PRESENT ITS LATEST
Mycronic South Korea
Mycronic South Korea Mycronic South Korea Mycronic Co. Ltd. 3rd Floor, Jung-San, Bldg. 1026-8, Sanbon-Dong, Gunpo-Si 15808 Gyeonggi-Do South Korea +82 31 387 5111 +82 31 388 0087 Mycronic,
Mycronic Japan Fukuoka
Mycronic Japan Fukuoka Mycronic Assembly Solutions Co.,Ltd 1-9-25, Enokida, Hakata-ku 812-0004 Fukuoka Japan +81 92 260 7009 +81 92 260 7019 Mycronic, Fukuoka, Japan
Why work at Mycronic?
5 reasons to join Mycronic Why work at Mycronic? In our open and collaborative workplace, you’ll give and get inspiration in equal measure. 1. Bring tomorrow’s electronics to life For over 40
MYNews magazine
A magazine from Mycronic MYNews MYNews is a magazine from Mycronic that provides readers with information about the latest products, technologies, and trends in the PCB assembly industry. It
Solutions
Photomask solutions Large area measurement meet the world's most accurate metrology system New increasing demands on LCD displays Making every pixel count in smartphone display Large area
Stretching the limits of wearable electronics
pcb-assembly Stretching the limits of wearable electronics Deep in the snow-capped mountains of Sweden, the national cross-country ski team will soon not only be pushing their limits in the
Stretchable electronics for quantified body functions
pcb-assembly SINTEC - Soft Intelligence Epidermal Communication Platform Stretchable electronics for quantified body functions In the visionary project European Horizon 2020 research project
Large area measurement
Meet the world's most accurate metrology system Large area measurement Challenge The crucial component in today’s high-quality displays is their set of photomasks, which must match each other
Contact us
Contact us Visit our contact page for contact details for our sales and support departments.
Contact us
Contact us Visit our contact page for contact details.
News
photomask-equipment Read our latest news here.
Manual flying probe for PCB test
Manual flying probe for PCB test A5 Neo A7 Pro A7-16 Pro A7XW Pro A9 A9 plus A9L A9XL A5 Neo A7 Pro The A5 Neo Flying Probe PCB tester combines affordable technology with all of the enhanced
Mycronic receives order for an FPS Evo
Mycronic AB (publ) has received an order for an FPS Evo from an existing customer in Asia. The order value is in the range of USD 11-13 million. Delivery of the system is planned for the first
MRSI Systems Provides MRSI-M3 Die Bonding Assembly Work Cell to Fabrinet in Silicon Valley for Fast Prototyping and New Product Introduction
North Billerica, MA, USA, May 24, 2016 — MRSI Systems, a leading provider of fully automated, ultra-precision die bonding and epoxy dispensing systems, today announces supply of its flagship
MRSI Systems’ New Product MRSI-HVM3 Die Bonder Has Entered Volume Production Driven by Fast and Wide Customer Adoptions
NORTH BILLERICA, Mass., March 6, 2018 – MRSI Systems, a leading provider of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems is pleased to announce that our
MRSI Systems Receives Funding from State of Massachusetts for Advanced Manufacturing Initiative
Billerica, Mass., Oct, 6, 2017 – MRSI Systems, a leading manufacturer of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems, has been awarded new funding by the
MRSI Systems welcomes Hendry He as China Country Sales Director
MRSI Systems (Mycronic Group) is pleased to announce our new China Country Sales Director, Hendry He. He will be working alongside the existing sales team and representatives in the region and is
MRSI Systems wins Silver Honoree for Laser Focus World Innovators Award 2023
die-bonding Laser Focus World Innovators Award 2023 MRSI Systems wins Silver Honoree for Laser Focus World Innovators Award 2023 MRSI Systems, a part of Mycronic Group, a leading manufacturer of
MRSI Launches New MRSI-H3LD Die Bonder Targeted at the High Power Diode Laser Market
MRSI Systems (Mycronic Group), is launching the MRSI-H3LD, a new 3 micrometer high speed die bonder, optimized for bonding large dies for high power diode lasers, that are used in advanced
MRSI Mycronic to Sponsor and Exhibit at the 2025 Chiplet Summit
In January 2025, MRSI Mycronic will sponsor and exhibit at the prestigious Chiplet Summit. This event gathers global leaders in semiconductor technology to discuss innovations in chiplet design
Optoelectronics Packaging
MRSI Systems has been a leading supplier to manufacturers of advanced optical packaging assembly for over 30 years. This has enabled MRSI to build unmatched expertise in the assembly technologies
How to Choose an Epoxy Dispenser
When it comes to epoxy dispensing your vendor system must offer the ultimate flexible platform for demanding environments. The epoxy dispenser should meet the highest standards of reliability and
MRSI-705HF 5 micron high force die bonder won the award for “Infostone 2023 Optical Communication Most Competitive Equipment
On December 28, 2023, MRSI (Mycronic Group) received the “Infostone 2023 Optical Communication Most Competitive Equipment” award for the MRSI-705HF 5 micron high force die bonder at the First
MRSI Support for Application Specific Pickup Tip Designs
The MRSI-705 features an innovative design with a versatile thirteen-position tool bank for quick, automatic tool changes. Enhanced functionality is achieved with additional tool change banks,
Join MRSI at IMS in San Diego
The International Microwave Symposium (IMS) is an annual conference that brings together the brightest minds in the microwave and RF industry. This year's event will take place in San Diego, CA,
Join MRSI Systems at IMAPS Device Packaging Conference this spring!
Experience MRSI Systems at the IMAPS device packaging conference in Fountain Hills, Arizona. MRSI excitedly sponsors the 19th Annual Device Packaging Conference that will be held March 13th-16th
Optimizing Die Bonding with Planarity Control: Ensuring Precision in Device Attachment Across Industries
Achieving precise and reliable die bonding is crucial in numerous industries, especially when demanding a high degree of parallelism between bonding surfaces.