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Highlights of the new mounthead technology include Engineering a new generation of high-speed assembly Flexibility. Turbocharged. The new MX7 mounthead Higher throughput The MX7 enables top

Mycronic 4.0 is a complete, agile manufacturing solution that masters the complexity of modern electronics production – a highly automated, intelligent factory for just-in-time production, with

Mycronic South Korea Mycronic South Korea Mycronic Co. Ltd. 3rd Floor, Jung-San, Bldg. 1026-8, Sanbon-Dong, Gunpo-Si 15808 Gyeonggi-Do South Korea +82 31 387 5111 +82 31 388 0087 Mycronic,

Mycronic Japan Fukuoka Mycronic Assembly Solutions Co.,Ltd 1-9-25, Enokida, Hakata-ku 812-0004 Fukuoka Japan +81 92 260 7009 +81 92 260 7019 Mycronic, Fukuoka, Japan

Manual flying probe for PCB test A5 Neo A7 Pro A7-16 Pro A7XW Pro A9 A9 plus A9L A5 Neo A7 Pro The A5 Neo Flying Probe PCB tester combines affordable technology with all of the enhanced

5 reasons to join Mycronic Why work at Mycronic? In our open and collaborative workplace, you’ll give and get inspiration in equal measure. 1. Bring tomorrow’s electronics to life For over 40

Contact us Visit our contact page for contact details for our sales and support departments.

Service solutions Bareboard testing With regular inspections and maintenance, you ensure an optimal operating condition of your test system over its entire lifetime.  We support you with many

photomask-equipment Read our latest news here.

Deliver extremely precise paste volume measurement on even the smallest pads with PI series 3D SPI. Easy and smart auto-programming functions that ensure high-quality inspection within line takt

pcb-assembly Frequently asked questions about AI is raising the bar in inspection technology New advances in machine learning In the SMT industry, we’re seeing how AI and machine learning are

How intelligent material handling can win customers and grow your business

A magazine from Mycronic MYNews MYNews is a magazine from Mycronic that provides readers with information about the latest products, technologies, and trends in the PCB assembly industry. It

Photomask solutions Large area measurement meet the world's most accurate metrology system New increasing demands on LCD displays Making every pixel count in smartphone display Large area

pcb-assembly Stretching the limits of wearable electronics Deep in the snow-capped mountains of Sweden, the national cross-country ski team will soon not only be pushing their limits in the

pcb-assembly SINTEC - Soft Intelligence Epidermal Communication Platform Stretchable electronics for quantified body functions In the visionary project European Horizon 2020 research project

pcb-assembly - that can monitor your heart rate Feather-light band-aid sensor SINTEC, AN EU-FINANCED PROJECT FOCUSED ON DEVELOPING SOFT STRETCHABLE ELECTRONICS, CAN NOW PRESENT ITS LATEST

Meet the world's most accurate metrology system Large area measurement Challenge The crucial component in today’s high-quality displays is their set of photomasks, which must match each other

Learn more about MRSI's training services including on-site training and software training videos. Contact Us.

MRSI Systems has been a leading supplier to manufacturers of advanced optical packaging assembly for over 30 years. This has enabled MRSI to build unmatched expertise in the assembly technologies

Customers require an application-specific specialized die bonder for HVM of CoS that is able to deliver high speeds while maintaining flexibility.

When it comes to epoxy dispensing your vendor system must offer the ultimate flexible platform for demanding environments. The epoxy dispenser should meet the highest standards of reliability and

On December 28, 2023, MRSI (Mycronic Group) received the “Infostone 2023 Optical Communication Most Competitive Equipment” award for the MRSI-705HF 5 micron high force die bonder at the First

The MRSI-705 features an innovative design with a versatile thirteen-position tool bank for quick, automatic tool changes. Enhanced functionality is achieved with additional tool change banks,

The International Microwave Symposium (IMS) is an annual conference that brings together the brightest minds in the microwave and RF industry. This year's event will take place in San Diego, CA,

Experience MRSI Systems at the IMAPS device packaging conference in Fountain Hills, Arizona. MRSI excitedly sponsors the 19th Annual Device Packaging Conference that will be held March 13th-16th

Achieving precise and reliable die bonding is crucial in numerous industries, especially when demanding a high degree of parallelism between bonding surfaces.

The MRSI-705 5-micron flip-chip die bonder has the largest installed base in photonics packaging, microwave modules, RF power amplifiers, infrared sensors, and medical devices.

LiDAR is an integrated optical detection and measurement system. Compared with typical radar, LiDAR can provide high-resolution distance, velocity, and geometric images, which were originally used

On November 2, 2016, MRSI Systems participated in the Commercial and Business Opportunities panel discussions at Massachusetts (MA) Integrated Photonics Manufacturing Supply Chain Meeting at MIT.