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MRSI-H-HPLD 1.5 micron Die Bonder Won the Award for “Infostone 2022 Outstanding Technology”

MRSI Systems wins 2022 Infostone award for outstanding technology for their world-renowned die bonder!

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Software Video Training Programs for Die Bonding and Epoxy Dispense Systems

These videos help you to discover advanced features of our MRSI machines, which will ensure your production line is optimized.

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Exploring Automotive LiDAR Packaging Trends

In the November/December 2023 issue of Chip Scale Review, MRSI delves into the fascinating world of automotive light detection and ranging (LiDAR) technology. This article explores the parallels

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Join MRSI at the China International Optoelectronic Conference (CIOE)

At the exhibition, MRSI will provide live product demos of the recently launched MRSI-H-HPLD+, a new variant of the successful MRSI-H-HPLD that is tailored for high-power laser die attachment

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Die bonding solution for Chip-on-Submount (CoS) – Excerpt from our LFW article

Excerpt from MRSI’s recent article emphasizes the CoS die bonding process requirements including geometric placement accuracy & void free eutectic bonding.

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Experience MRSI’s latest innovations at the OFC Exhibition

MRSI will be a featured exhibitor at the OFC Exhibition. The OFC Exhibition is a unique and premium opportunity to immerse yourself into the photonics industry.  

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Case Study – Leading Photonic Component Manufacturer Selects MRSI Systems to Produce Photonic Components Faster

The demand for data and bandwidth continues to expand, resulting in the requirement for high volume manufacturing of photonics devices at unprecedented levels.

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Advanced Vision Systems

Increasing demand for data and bandwidth requires high-volume manufacturing of photonics and RF electronics at a level we have never seen before.

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Automated Die Bonding for High Volume Optoelectronics Packaging

As the Optoelectronics market is strong and growing, the technical requirements increase the challenges for manufacturers.

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China International Optoelectronic Expo – September 2017

die-bonding MRSI CYCAD CIOE Booth 2017 China International Optoelectronic Expo – September 2017 MRSI Systems is exhibiting at CIOE with our Chinese Representative CYCAD Century Science and

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Technology Students Experience Local Advanced Technology Manufacturer Up Close

Middlesex Community College technology students recently visited our factory in Billerica, MA.

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International Microwave Symposium 2017

MRSI Systems is exhibiting at IMS (Booth #1847)—the world’s largest Microwave and RF industry trade show in Honolulu, Hawaii June 4-9, 2017.

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Die Bonding Solutions

Having a proven ultra-accurate die bonding system platform that is mechanically and thermally stable, with no cantilevered parts, are essential elements to achieve accurate device placement.

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Interview with MRSI Systems Dr. Limin Zhou: MRSI Die Bonders support the fast growth of the optical communication market

During 2021 CIOE in Shenzhen, China, Infostone, interviewed Dr. Limin Zhou, Senior Strategic Marketing Director of MRSI Systems (Mycronic Group) to discuss MRSI’s latest product developments and

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MRSI-175Ag – A flexible epoxy dispensing solution

The MRSI-175Ag Conductive Epoxy Dispenser handles the most demanding dispensing applications such as semiconductor packaging, Microwave & RF modules, multichip modules, optical modules,

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MRSI Systems (Mycronic Group) delivered a keynote speech at the 2022 CFOL Optical Interconnection Conference and MRSI-H-HPLD+ 1.5 micron Die Bonder won the Award for “2022 CFOL Product Innovation”

Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems (Mycronic Group) and General Manager of MRSI Automation (Shenzhen) Co., Ltd., was invited to participate in the 2022 CFOL

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MRSI presented at the 12th China International Nanotechnology Industry Expo

The 12th China International Nanotechnology Industry Expo was held in Suzhou, Jiangsu Province from October 27th to 29th, 2021. Dr. Limin Zhou, Senior Director of Strategic Marketing, MRSI

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Invitation to MRSI Webinar: MRSI is presenting at the 2022 ATC Webinar on Vehicle LIDAR Manufacturing

Abstract: on March 17th, 2022, Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems (Mycronic group) and General Manager of MRSI Automation (Shenzhen) Co., Ltd., is invited to

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Learn more about how MRSI solves RF PA device manufacturing challenges

MRSI’s fully automated die bonding solutions help RF power amplifier device manufacturers to address manufacturing requirements and challenges. To learn more about how MRSI’s solutions support

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MRSI to exhibit at LASER World of PHOTONICS Munich

die-bonding MRSI Mycronic exhibiting at Laser World of Photonics Munich MRSI to exhibit at LASER World of PHOTONICS Munich MRSI will be exhibiting at LASER World of PHOTONICS, held at Messe

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MRSI is presenting and sponsoring the iMAPS New England 48th Symposium and Expo

The iMAPS New England Symposium and Expo will be held in Boxborough, MA on May 3rd, 2022 at the Boxboro Regency Hotel. Technical sessions include Advanced Packaging, RF& Microwave – 5G

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Join MRSI at SEMICON West 2022

We are excited to announce that MRSI Systems will be exhibiting at SEMICON West from July 12-14th at the Moscone Center in San Francisco! Visit us at booth #2355 to talk with us about topics such

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Year-end Report January-December 2023

Year-end Report January-December 2023 Fourth quarter Order intake amounted to SEK 1,448 (2,529) million, a decrease of 43 percent Net sales increased 31 percent to SEK 1,968 (1,497) million. Based

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Interim Report January–March 2024

Interim Report January–March 2024 First quarter Order intake amounted to SEK 1,645 (1,617) million, an increase of 2 percent Net sales increased 39 percent to SEK 1,692 (1,219) million. Based on

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Management change at Mycronic

As a result of the preparations ahead of a possible listing of Axxon on a stock exchange in China, effective March 19, 2024, Ivan Li leaves Mycronic’s executive management but remains as Head of

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Mycronic receives order for an SLX mask writer

Mycronic AB (publ) has received an order for an SLX mask writer from a new semiconductor customer in Asia. The order value is in the range of USD 7-9 million. Delivery of the system is planned

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Mycronic receives order for an SLX mask writer

Mycronic AB (publ) has received an order for an SLX mask writer from an existing customer in Asia. The order value is in the range of USD 7-9 million. Delivery of the system is planned for the

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Mycronic receives order for an SLX mask writer

Mycronic AB (publ) has received an order for an SLX mask writer from an existing customer in Asia. The order value is in the range of USD 5-7 million. Delivery of the system is planned for the

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Mycronic receives order for a Prexision 80 Evo

Mycronic AB (publ) has received a replacement order for a Prexision 80 Evo from an existing customer in Asia. The order value is in the range of USD 27-30 million. Delivery of the system is

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Mycronic receives order for a Prexision 8 Evo

Mycronic AB (publ) has received a replacement order for a Prexision 8 Evo from an existing customer, for delivery to Asia. The order value is in the range of USD 13-15 million. Delivery of the