Search

Contact us Visit our contact page for contact details for our sales and support departments.

photomask-equipment Read our latest news here.

How intelligent material handling can win customers and grow your business

A magazine from Mycronic MYNews MYNews is a magazine from Mycronic that provides readers with information about the latest products, technologies, and trends in the PCB assembly industry. It

pcb-assembly Stretching the limits of wearable electronics Deep in the snow-capped mountains of Sweden, the national cross-country ski team will soon not only be pushing their limits in the

pcb-assembly SINTEC - Soft Intelligence Epidermal Communication Platform Stretchable electronics for quantified body functions In the visionary project European Horizon 2020 research project

pcb-assembly - that can monitor your heart rate Feather-light band-aid sensor SINTEC, AN EU-FINANCED PROJECT FOCUSED ON DEVELOPING SOFT STRETCHABLE ELECTRONICS, CAN NOW PRESENT ITS LATEST

Mycronic South Korea Mycronic South Korea Mycronic Co. Ltd. 3rd Floor, Jung-San, Bldg. 1026-8, Sanbon-Dong, Gunpo-Si 15808 Gyeonggi-Do South Korea +82 31 387 5111 +82 31 388 0087 Mycronic,

Mycronic Japan Fukuoka Mycronic Assembly Solutions Co.,Ltd 1-9-25, Enokida, Hakata-ku 812-0004 Fukuoka Japan +81 92 260 7009 +81 92 260 7019 Mycronic, Fukuoka, Japan

Service solutions Bareboard testing With regular inspections and maintenance, you ensure an optimal operating condition of your test system over its entire lifetime.  We support you with many

atg Luther & Maelzer Asia Ltd. Mycronic, Taiwan, Taoyuan City atg Luther & Maelzer Asia Ltd. 4F., No. 136, Changchun 2nd Rd., Zhongli Dist., Taoyuan City 320, China Taiwan Taiwan +886 3

ID: 80388 | Version: 1 | Published: 2023-02-06 Whistleblower policy Mycronic AB provides a special reporting channel where employees within the Mycronic Group may report serious wrongdoing within

Innovation and new market factors are driving advanced packaging. In this post, we highlight some of the trending topics propelling advanced packaging.

In March 2017, MRSI Systems participated in The MIT Microphotonics Center and AIM Photonics Spring Meeting for Integrated Photonics Manufacturing Meeting.

die-bonding Hybrid Electronics Technology for Printed Lighting Several members of the MRSI Systems’ team attended the February iMAPS New England-SMTA Boston Technical presentation by Dr. Adam

die-bonding 2017 Optical Fiber Communication Conference and Exhibition (OFC) Highlights MRSI Systems is a frequent participant at OFC. OFC gave us an opportunity to meet with our customers and

MRSI Systems (Mycronic Group), is launching the MRSI-H3LD, a new 3 micrometer high speed die bonder, optimized for bonding large dies for high power diode lasers, that are used in advanced

On December 28, 2023, MRSI (Mycronic Group) received the “Infostone 2023 Optical Communication Most Competitive Equipment” award for the MRSI-705HF 5 micron high force die bonder at the First

The MRSI-705 features an innovative design with a versatile thirteen-position tool bank for quick, automatic tool changes. Enhanced functionality is achieved with additional tool change banks,

In January 2025, MRSI Mycronic will sponsor and exhibit at the prestigious Chiplet Summit. This event gathers global leaders in semiconductor technology to discuss innovations in chiplet design

The International Microwave Symposium (IMS) is an annual conference that brings together the brightest minds in the microwave and RF industry. This year's event will take place in San Diego, CA,

MRSI Systems (Mycronic Group) has opened the doors to their new “Product Demo Center” in Shenzhen, China. The new demo center is in the Huahan Innovation Office Park in the Nanshan District of

Experience MRSI Systems at the IMAPS device packaging conference in Fountain Hills, Arizona. MRSI excitedly sponsors the 19th Annual Device Packaging Conference that will be held March 13th-16th

Achieving precise and reliable die bonding is crucial in numerous industries, especially when demanding a high degree of parallelism between bonding surfaces.

The MRSI-705 5-micron flip-chip die bonder has the largest installed base in photonics packaging, microwave modules, RF power amplifiers, infrared sensors, and medical devices.

MRSI Systems has been a leading supplier to manufacturers of advanced optical packaging assembly for over 30 years. This has enabled MRSI to build unmatched expertise in the assembly technologies

Customers require an application-specific specialized die bonder for HVM of CoS that is able to deliver high speeds while maintaining flexibility.

When it comes to epoxy dispensing your vendor system must offer the ultimate flexible platform for demanding environments. The epoxy dispenser should meet the highest standards of reliability and

摘要：（第三届）激光雷达前瞻技术展示交流会于2021年12月14日-12月15日在江苏苏州举办。MRSI Systems战略市场高级总监，周利民博士出席2021（第三届）激光雷达前瞻技术展示交流会并发表“车载激光雷达光器件封装的挑战与解决方案”的演讲。

NORTH BILLERICA, Mass., March 6, 2018 – MRSI Systems, a leading provider of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems is pleased to announce that our