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A high-tech future down under
At its headquarters in a high-tech industry hub in Brisbane, Australia, Elexon Electronics is investing in the future of advanced local manufacturing. For CEO Frank Faller, this means finding new
New M2M standard opens the door to Industry 4.0
pcb-assembly Mycronic to chair initiative and roll out Hermes-compatible equipment in 2020 New M2M standard opens the door to Industry 4.0 There’s a new messenger in town and it’s called Hermes.
Open new doors to automated material handling
pcb-assembly Introducing the new dual-terminal MYTower Open new doors to automated material handling If you’re like most manufacturers, repetitive material handling tasks can consume entirely too
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Meet the MYTower family
pcb-assembly A generation of storage for factories of all shapes and sizes Meet the MYTower family Mycronic’s previous SMD Tower set the benchmark for intelligent component storage. After
The false call killer
pcb-assembly — a Q & A with Romain Roux and Nicolas Guillot on DeepReview and the power of AI-driven inspection The false call killer Some call it the “false call killer”: a new Automatic
Cooperation in software development
pcb-assembly Teamwork makes the dreamwork Cooperation in software development In the electronics industry, change is everywhere. With the rising complexity in SMT production comes a greater need
The power of one - MYPro Create
pcb-assembly — empowering multi-machine programming with one dataset, one program and one workflow The power of one For years, Mycronic inspection customers have benefitted from a single
For a rugged world
pcb-assembly MYC60 industrial dispenser Automated industrial dispensing For a rugged world The world is witnessing a massive rollout of heavy-duty boards. Whether for broadband infrastructure,
Taking productivity to new heights
How one aerospace manufacturer saves time and boosts production volumes with Mycronic's material handling storage towers
Exploring pioneering ideas
pcb-assembly Female working in Täby, Sweden Exploring pioneering ideas Exploring pioneering ideas Innovation is in our DNA, and being innovative means daring to enter uncharted territory. In
Flying probe for substrate test
Flying probe for substrate test S3 S3-8 S3-8 The S3 is able to test 10 µm structures while achieving 100 measurements per second. The shuttle of the S3-8 can clamp and tension double sided
MyCare Barebord testing
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Mycronic Sweden HQ
Mycronic Sweden HQ Mycronic headquarter in the winter Mycronic AB Nytorpsvägen 9 Box 3141 183 03 Täby Sweden +46 8 638 52 00 +46 8 638 52 90 Mycronic Täby Yes, please contact me
Why do customer's choose MRSI?
Learn about MRSI Systems capabilities and what helps MRSI stand apart from the competition in die bonder and epoxy dispensing system manufacturing.
Partners
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Testimonials
See what real MRSI Systems customers are saying about our Die Bonding and Epoxy Dispensing systems and how they have helped them succeed.
Prototyping and Training Services
We provide prototyping and small batch die bonding services for our customers to shorten your time to market.
On-site training
MRSI offers a comprehensive set of training programs covering our family of products. Contact MRSI Systems to learn more about On-Site Training.
Optical Components & Transceivers
Learn more about Optical Components and Transceivers from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 40 years.
MRSI Mycronic announces advanced high-speed 1µm die bonder MRSI-LEAP for ultra-high-volume manufacturing of AI optical module applications
MRSI Mycronic is proud to announce the launch of the MRSI-LEAP high-speed 1µm die bonder. This innovative equipment is designed for ultra-high-volume manufacturing of optical modules,
MRSI-S-HVM Submicron Die Bonder won the award for “Infostone 2020 The Most Competitive Optical Communications Product”
MRSI Systems (Mycronic Group), submicron die bonder MRSI-S-HVM won the award for "The Most Competitive Optical Communications Product in 2020." The MRSI-S-HVM submicron die bonder was recognized
MRSI发布为硅光器件、协同封装和晶圆级封装提供亚微米级贴片解决方案
ICC讯 在CIOE 2020,MRSI SYSTEMS将推出一款新产品,高速、灵活的0.5微米 MRSI-S-HVM 贴片机,为硅光器件,协同封装的电子和光子芯片,以及晶圆级封装应用提供解决方案。
MRSI将出席第18届ICCSZ OC市场与技术研讨会,并在CIOE提供贴片演示
MRSI Systems(Mycronic Group)赞助由ICCSZ举办的第18届光纤通讯市场暨技术专题研讨会,研讨会将于9月2日至3日在中国深圳举行。同期,中国国际光电博览会(CIOE)于2019年9月4日至7日在中国深圳隆重召开。
MRSI宣布MRSI-H / HVM系列贴片机精度提升至1.5微米
MRSI Systems(Mycronic Group)很高兴宣布公司MRSI-H / HVM系列产品线的最新进展。MRSI使用行业标准玻璃芯片参考样品测试放置精度,测试结果显示,产品精度从3Sigma的±3微米增强至±1.5微米。该产品从2019年10月1日发货开始,产品名称改为MRSI-H和MRSI-HVM(之前称为MRSI-H3和MRSI-HVM3)。
MRSI Systems Welcomes Dr. Limin Zhou as Senior Director of Strategic Marketing
MRSI Systems, part of the Mycronic Group is pleased to announce the appointment of Dr. Limin Zhou as the Senior Director of Strategic Marketing to expand MRSI’s market presence in China. He will
MRSI launches new Die Bonder with improved throughput for high power laser manufacturers
MRSI Systems (Mycronic Group) is pleased to announce the introduction of MRSI-H-HPLD+, the latest advancement in the MRSI-H/HVM-series product line. This new variant of the successful