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BILLERICA, MA — August 12, 2015 — MRSI Systems, a developer and manufacturer of turnkey die bonding and dispensing systems, announced today the introduction of a new automated in-line material

Ultra-high-speed die bonding technology is pivotal in modern manufacturing, particularly for optical modules production. The MRSI-LEAP Ultra-High-Speed Die Bonders exemplify this advancement,

The annual Infostone Optical Communication and Market Technology Conference (IFOC 2025) is scheduled for September 8-9, 2025, at the InterContinental Hotel within the Shenzhen World Exhibition

The Innovation Conference on CPO and Heterogeneous Integration Technology will take place September 4-6, 2025, in Wuxi, China. During the conference, Dr. Limin Zhou will discuss recent and

MRSI is thrilled to announce our participation at the ECOC Exhibition in Copenhagen, Denmark, taking place from September 29 to October 1, 2025. As a global leader in advanced packaging solutions,

MRSI is pleased to announce our participation as an exhibitor at the upcoming 58th International Symposium on Microelectronics is organized by the International Microelectronics Assembly and

We are excited to participate in IMAPS CHIPcon, the premier event for Chiplet and Heterogeneous Integration Packaging (CHIP) technology, from July 7–10, 2025, in San Jose, CA. This conference

We are pleased to announce we are exhibiting with our distributor PREM at NEPCON Thailand, scheduled from June 18-21, 2025, at BITEC in Bangkok.

5G时代的到来势不可挡，而这一趋势也不断对芯片的贴片、封装工艺提出新的要求。在此背景下， 作为全球光电器件自动化贴片封装设备的领军企业， MRSI Systems也适时推出了新产品、新技术。在今年9月的深圳光博会上，MRSI的产品管理和市场营销副总裁钱毅博士向OFweek光通讯网介绍了MRSI的产品、研发优势及未来的市场趋势。

The Global deployment of 5G and the exponential growth of data centers is driving the demand for high-performance optical devices.

MRSI has produced immersive software training videos to optimize your company’s experience with our cutting-edge die bonding and epoxy dispensing systems. MRSI wants the acquisition of our

Learn more about epoxy bleed from industry expert Tom Green. Here is the abstract of the white paper Silver Epoxy Turns Black After an Oxygen Plasma Clean Prior to Wire Bonding

Experience MRSI Systems at the IMAPS device packaging conference in Fountain Hills, Arizona. MRSI excitedly sponsors the 19th Annual Device Packaging Conference that will be held March 13th-16th

Jack Inocencio, the Sr. Manager of Applications and Service, extended some conducive knowledge on why MRSI System’s products will accelerate photonics manufacturers’ efficiency and

die-bonding MRSI to sponsor and present at IMAPS New England this May MRSI Systems is delighted to announce another opportunity to see us this spring. We will be a featured Platinum Sponsor along

Our launch of our free software training outlined the cadence of how 1 training video would be released a week. Since then, we are proud to announce we have released five new videos with more to

die-bonding Improve pick and place machine utilization by keeping dies in their places A lot of dies are presented to die bonders in waffle packs and there is a common issue of component out of

During the summer, China Fiber Optics Online (CFOL), interviewed Dr. Limin Zhou, Senior Strategic Marketing Director of MRSI Mycronic to discuss MRSI’s latest product development and some of the

On August 8, 2021, MRSI Systems(Mycronic Group) held the grand opening of its Product Demonstration Center in Shenzhen, China. The opening ceremony was accompanied with a speech by local

MRSI (Mycronic Group) is exhibiting at the 54th International Symposium on Microelectronics from October 11-14, 2021, in San Diego, California at the Town and Country Resort.

摘要：由中国国际光电博览会(CIOE)提议设立的”中国光电博览奖“，MRSI Systems携最新的MRSI-HVM 1.5微米系列产品参评，成功入围“中国光电博览奖”。MRSI-HVM-P项目属于高端光电子封装自动化技术领域，广泛用应于当下高密度高速率的数据中心光互联和骨干网络传输用的400G +光电器件，以及5G无线应用的复杂DFB / WDM / EML TO-can TOSA /

5G continues to drive the needs of the Datacom supply chain which presents challenges to photonic device manufacturers. In this article featured in Laser Focus World, MRSI highlights the

MRSI Mycronic is exhibiting at the Automotive LIDAR 2020 Conference and Virtual Exhibition from September 22-24th, 2020. See the conference agenda for more details. Visit the MRSI virtual booth

Dr. Limin Zhou, Senior Director of Strategic Marketing, MRSI Systems presented “Integrated Photonics Devices Volume Manufacturing Challenges & Innovative Solutions” at the 20th Infostone

die-bonding IFOC 2020 MRSI Systems – CIOE 2020 & IFOC 2020 Highlights CIOE was held from September 9-11, 2020, in a new location at the Shenzhen World Exhibition & Convention Center.

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About us atg Mycronic is a part of Mycronic group. We are specialists in the development, manufacture, and sale of test systems for bare printed circuit boards.  atg Mycronic About us atg Mycronic

Contact us Visit our contact page for contact details for our sales and support departments.

bare-board-testning atg A7Plus: High Speed – High Accuracy Flying probe system atg Luther & Maelzer to exhibit at the upcoming TPCA show in Taipei, Taiwan atg Luther & Maelzer GmbH will use

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