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Mycronic Benelux

Mycronic Benelux Mycronic, Netherlands, Eindhoven Mycronic B.V. High Tech Campus 10 5656 AE Eindhoven NL8093 88315 B01 Netherlands 31 402 62 06 67 +31 402 62 06 68 Mycronic, Eindhoven,

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Mycronic China

Mycronic China Shanghai, China Mycronic Co., Ltd Unit 1002, 10th floor, E Block Lane 168, Da Duhe Road 200062 Putuo District Shanghai +86 21 3252 3785/86 +86 21 3252 3780 22.5546841,113.9395574

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In-line dispensing

In-line dispensing MYD10/10i MYD50 MY700JD MYSmart in-line dispensing valves Brochure MYD The compact MYD10 enables highly advanced non-contact jetting for enhanced dispensing uniformity,

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Die bonding solutions

Fully automatic high accuracy die bonders that are capable of epoxy and eutectic die bonding are the lifeblood of the modern semiconductor industry.

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1.5 Micron Die Bonders

Learn more about MRSI's 1.5 micron die bonders.

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Software training videos

MRSI is now offering an extensive library of software training videos for your MRSI die bonding and epoxy dispensing systems. Contact MRSI to learn more.

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About us

About Die bonding Under the MRSI brand, we leverage over 40 years of industry expertise in high-accuracy die bonders, active aligners, and fluid dispensers to deliver unparalleled reliability and

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Thank you for contacting us regarding die bonding

Thank you for contacting us regarding die bonding

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Automated optical inspection

Mycronic AOI products provide Automated Optical Inspection ensures quality and reliability in your production processes.

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Smaller, smarter, faster

Just outside of Nürnberg, Germany, one forward-thinking manufacturer is rapidly modernizing its production to meet fast-growing demands for advanced industrial IoT electronics. Thanks to the

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Mycronic introduces the MYPro A40: an evolutionary high-speed, high-flexibility pick-and-place platform

Mycronic, the leading Sweden-based electronics assembly solutions provider, is introducing its next-generation MYPro A40 pick-and-place solution, equipped with an all-new MX7 high-speed mounthead

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Beating the best with Artificial Intelligence

pcb-assembly Beating the best with Artificial Intelligence From millions of data sets to a single click – what’s next for deep learning in SMT? Beating the best with Artificial Intelligence The

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Say hello to Leo the robot!

pcb-assembly Automating material handling through robotics Say hello to Leo the robot! Stock accuracy, traceability, and timely delivery of parts are key aspects of a material handling system.

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Reducing e-waste through innovation

pcb-assembly Reducing e-waste through innovation Global consumption of electrical and electronic equipment is on the rise. When these products enter an end-of-life state, a large amount of the

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Agilis Smart Bin

pcb-assembly Paperless productivity – changeover guidance with Agilis Smart Bin. Agilis Smart Bin MISSING COMPONENTS. Sticky notes falling off. Hunting for information. The list of reasons for

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Best Technology Award Founder

bare-board-testning atg Luther & Maelzer GmbH won the "Best Technology Award" of Founder PCB in 2024 On January 10, 2025, the 2024 Founder PCB Supplier Conference was held in Zhuhai.

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Pattern Generators launches two new products

The Pattern Generators division of Mycronic AB (publ) today launches two new products: The Prexision 8000 Evo, a next generation display mask writer that meets the highest performance

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Mycronic receives order for three mask writers

Mycronic AB (publ) has received an order for three mask writers from an existing customer in Asia: one Prexision 8 Evo, one Prexision Lite 8 Evo and one SLX. The order value is in the range of USD

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Solutions

Solutions Flying ahead in Michigan with Calumet A9a Mycronic is providing its latest Flying Probe electrical testing system.

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Events

dispensing-and-coating

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MRSI Systems Wins Years-Long Litigation Against Palomar Technologies By Invalidating Palomar’s “Double Pick” Patent

Chief Judge of federal court in Boston knocks out Palomar’s claim of infringement for its “double pick” patent allegedly covering a manufacturing process; court rules that claimed method is “so

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MRSI Files Patent Infringement Lawsuit Against Palomar Technologies

Taking action against what it asserts is pervasive and repeated infringement of four separate U.S. patents it owns, leading precision manufacturer MRSI Systems LLC has filed a patent infringement

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MRSI Systems欢迎资深光电子专家周利民博士出任战略营销高级总监

2019年2月13日–全球领先的半导体系统设备制造商Mycronic集团的子公司,MRSI Systems今日荣幸宣布,光电子资深专家周利民博士将加入公司团队并担任战略营销高级总监,负责拓展MRSI Systems在中国的市场影响力。周博士在光电子行业拥有的丰富专业知识,以及他在中国市场的知名度将有助于推动MRSISystems市场战略布局,制定清晰的产品路线图,以及增强MRSI

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MRSI opens a new Product Demo Center in China, will present at the Infostone Conference and attend CIOE with live demos

MRSI Systems (Mycronic Group) will exhibit at the 23rd China International Optoelectronic Exposition (CIOE) at the Shenzhen World Exhibition & Convention Center from September 16-18, 2021. MRSI

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MRSI推出升级版MRSI-705贴片机 助力大批量制造

ICC讯 在IMAPS 2020上,MRSI Systems推出了新型5微米贴片机产品,面向量产配置的MRSI-705。MRSI-705于2012年首次推出,在贴片机行业中处于领先地位,可在一台机器上为客户提供多种应用解决方案。MRSI-705新的配置提供了创新的水平转塔功能,可以在不牺牲灵活性,准确性和可靠性的前提下,显著提高机器的速度和生产率。

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MRSI Mycronic to showcase and present innovative die bonder solutions at CIOE 2023

die-bonding CIOE 2023 MRSI Booth MRSI Mycronic to showcase and present innovative die bonder solutions at CIOE 2023 MRSI, a part of Mycronic Group, will exhibit our family of die bonders and

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MRSI Systems and Palomar Technologies Reach Agreement in Intellectual Property Dispute

Boston, MA – December 10, 2020 – MRSI Systems, LLC and Palomar Technologies, Inc. jointly announce they have reached a confidential agreement that settles all litigation currently pending between

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MRSI receives Laser Focus World Innovators Award for H-TO die bonder

MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2022 Silver Honoree for the

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MRSI Systems 宣布“DIE PLACEMENT HEAD WITH TURRET” (集成水平转塔之芯片贴装头)已获得中国专利授权

MRSI Systems宣布“DIE PLACEMENT HEAD WITH TURRET”(集成水平转塔之芯片贴装头)已获得中国专利授权。迈康尼全球技术部的业务部门-MRSI Systems宣布,中华人民共和国国家知识产权局(CNIPA)已于2021年7月30日授权MRSI Systems 申请的“DIE PLACEMENT HEAD WITH

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MRSI Systems Launches MRSI-HVM3P for New Applications Extending the MRSI-HVM3 Die Bonder Family

BILLERICA, Massachusetts, Aug. 29, 2018 — MRSI Systems (Mycronic Group), is expanding its leading high speed MRSI-HVM3 die bonder platform with the launch of the MRSI-HVM3P to offer