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The all-in-one solder paste and assembly fluid solution. MY700JX allows you to combine operator-independent solder paste jet printing with high-speed jet dispensing of adhesives, UV materials,

MYD50 in-line dispenser Brochure Brochure MYD Linear motor drive in-line dispensers For higher-precision applications such as complex chip packaging, the powerful MYD50 platform further boosts

The new Prexision series setting the global standards for displays. 

A5 Neo Flying Probe Test System For Rigid and Flexible Boards. 

For detailed Data Sheets please contact Sales. The MRSI-HVM product family has proved to be the best-in-class die bonder with leading speed, zero-time tool change between dies, and <1.5 micron

All the power of the MYPro I series 3D AOI for heavyweight board inspection.

All the power of the MYPro I series 3D AOI in dual lane configuration.

PI Pico - 3D SPI Brochures Contact PI series 3D SPI brochure and specifications High accuracy and repeatability 3D SPI with auto-programming Clear and simple inspection control Clarity and

PI Primo - 3D SPI Brochures Contact PI series 3D SPI brochure and specifications Clear and simple inspection control Clarity and simplicity are words rarely associated with the complex process of

MY300LX pick-and-place Agilis™ - The most efficient feeding system Brochures Contact Mycronic’s modular Agilis™ component feeding system is designed for accuracy, ease of use and convenience. It

For detailed Data Sheets please contact Sales. The MRSI-S-HVM submicron die bonding solution for silicon photonics, co-packaging, and wafer-level packaging

S3 S3 Description Specification Brochures Services The S3 is able to test 10 µm structures while achieving 100 measurements per second. The machine, therefore, provides the customer with an

A9a plus A9a plus Description Specification Brochures Services Contact The A9a plus is utilizing the same technology as the A9a and is in addition equipped with a temperature control unit and 4

A7-16 Pro A7-16 Pro Description Brochures Specification Services Contact The A7 Pro is also available with 16 test heads and with a large test area of 24" x 39.4". Teh A7-16 Pro benefitting

For detailed Data Sheets please contact Sales. The MRSI-705 5-Micron Flip-Chip Die Bonder sets the mark for high-precision, high-speed component assembly within a flexible, configurable platform.

High flexibility 3D AOI for high-mix production with AI-assisted programming.

The MYTower 7+ is Mycronic’s tallest component storage system, measuring at 3.03 m, with a capacity of 1,148 reels.

Mycronic can offer long-term financing of 3 to 5 years, at less than market rates. With very competitive fixed interest rates, your investment in quality PCB assembly equipment can be realized

Built for world-class photomasks. 

One versatile platform. Twice the possibilities. MYPro series MY700TM Jet Printer and Dispenser MYPro series MY700TM  Jet Printer and Dispenser Specifications March 2022 Precision printing.

Precision printing. High-speed jet printer and solder paste PCB printing, surface mount soldering dispenser for a wide range of assembly fluids.

A9 A9 Flying Probe PCB Test System Description Specification Brochures Services Contact The A9 is our fastest PCB test system with a new powerful drive technology and granite base to ensure high

A9L A9L Flying Probe PCB Test System Description Specification Brochures Services Contact The A9L is based on our A9 test head technology with a new powerful drive technology and granite base to

For detailed Data Sheets please contact Sales. The MRSI-H family provides proven superior flexibility for true multi-die, multi-process, multi-product high volume high mix production.

A7XW Pro A7XW Pro Description Specification Services Contact Our unique rail concept allows a high test head density on even the largest boards, minimizing the test time for large products with

LM1000 LM1000 Description Brochures Specification Services Contact The LM1000 is a highly precise compact and fully automated step tester for the electrical test of HDI bare boards in mass

A7 Pro A7 Pro Description Brochure Specifications Services Contact us The newly launched A7 Pro is building on the success of the A7 tester but is now equipped with a fast internal Ethernet 1GB/s

For detailed Data Sheets please contact Sales. The MRSI-LEAP high-speed die bonder boasts a range of innovative features that make it an essential tool for high-volume manufacturing.

MYPro A40SX pick-and-place Agilis™ - The most efficient feeding system Brochures Contact Mycronic’s modular Agilis™ component feeding system is designed for accuracy, ease of use and convenience.

High-performance 3D AOI for high-productivity production.