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At Mycronic, we thrive on passion, collaboration, and innovative thinking. Our greatest asset? Our diverse workforce. Explore our job openings on our website and through recruitment agencies.
Mycronic atg Luther & Maelzer GmbH (HQ)
atg Luther & Maelzer GmbH (HQ) atg Luther & Maelzer GmbH (HQ) atg Luther & Maelzer GmbH Karl-Carstens-Straße 19 97877 Wertheim Germany +49 9342 291 0 (Reception) Karl-Carstens-Straße
Axxon China
Axxon China Mycronic, Shenzhen Axxon Shenzhen Axxon Automation Co., Ltd A14 Building, Silicon Valley Power Automotive Innovation Park Guanlan Guiyue Road No.334 , 518110 Long Hua district,
Mycronic Vietnam
Mycronic Vietnam Mycronic in Vietnam Axxon (Vietnam) Automation Co. Ltd 4th Floor Bac Ninh Mitsubishi tower, Le Thai To road, Vo Cuong Ward 16000 Bac Ninh Bac Ninh city Vietnam +84 917681710
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MYPro A41SX
Mycronic presents the latest flexibility in PCB manufacturing, big boards.
MYPro A41DX
MYPro A41DX pick-and-place Agilis™ - The most efficient feeding system Brochures Contact Mycronic’s modular Agilis™ component feeding system is designed for accuracy, ease of use and convenience.
GenI - Generative AOI Programming
GenI - Generative AOI Programming With Gen I™ your team gains: The industry’s fastest programming — eliminate specialized AOI programming for every new product. Faster NPIs — accelerate
MYPro I50Xz
High-performance 3D AOI for high-productivity production.
A9XL
A9XL A9XL Flying Probe PCB Test System Description Specification Brochures Services Contact The A9XL is the latest model of our A9 product family based on our A9 test head technology with a new
MYPro Create
MYPro Create Multi-machine programming for electronics manufacturers A single interface and workflow MYPro Create makes multi-machine programming a lot smoother and paves the way for future
MY700JP
One versatile platform. Twice the possibilities. MYPro series MY700TM Jet Printer and Dispenser MYPro series MY700TM Jet Printer and Dispenser Specifications March 2022 Millions of
MY300HX
MY300HX pick-and-place Agilis™ - The most efficient feeding system Brochures Contact Mycronic’s modular Agilis™ component feeding system is designed for accuracy, ease of use and convenience. It
MYCenter Analysis
The MYCenter Analysis dashboard software provides actionable data to increase utilization, reduce reject rates and improve line balancing in real time.
Display mask writer
The new Prexision series setting the global standards for displays.
MY700JP
Millions of high-precision dots. The MY700 Jet Printer makes it possible to handle the most challenging boards and components with micrometer accuracy, maximum speed and perfect quality solder
MY700JX
The all-in-one solder paste and assembly fluid solution. MY700JX allows you to combine operator-independent solder paste jet printing with high-speed jet dispensing of adhesives, UV materials,
MYD50
MYD50 in-line dispenser Brochure Brochure MYD Linear motor drive in-line dispensers For higher-precision applications such as complex chip packaging, the powerful MYD50 platform further boosts
A5 Neo
A5 Neo Flying Probe Test System For Rigid and Flexible Boards.
MRSI-HVM
For detailed Data Sheets please contact Sales. The MRSI-HVM product family has proved to be the best-in-class die bonder with leading speed, zero-time tool change between dies, and <1.5 micron
MYPro I81
All the power of the MYPro I series 3D AOI in dual lane configuration.
Submicron Die Bonders
For detailed Data Sheets please contact Sales. The MRSI-S-HVM submicron die bonding solution for silicon photonics, co-packaging, and wafer-level packaging
PI Pico - 3D SPI
PI Pico - 3D SPI Brochures Contact PI series 3D SPI brochure and specifications High accuracy and repeatability 3D SPI with auto-programming Clear and simple inspection control Clarity and
PI Primo - 3D SPI
PI Primo - 3D SPI Brochures Contact PI series 3D SPI brochure and specifications Clear and simple inspection control Clarity and simplicity are words rarely associated with the complex process of
MY300LX
MY300LX pick-and-place Agilis™ - The most efficient feeding system Brochures Contact Mycronic’s modular Agilis™ component feeding system is designed for accuracy, ease of use and convenience. It
S3
S3 S3 Description Specification Brochures Services The S3 is able to test 10 µm structures while achieving 100 measurements per second. The machine, therefore, provides the customer with an
A9a plus
A9a plus A9a plus Description Specification Brochures Services Contact The A9a plus is utilizing the same technology as the A9a and is in addition equipped with a temperature control unit and 4
A7-16 Pro
A7-16 Pro A7-16 Pro Description Brochures Specification Services Contact The A7 Pro is also available with 16 test heads and with a large test area of 24" x 39.4". Teh A7-16 Pro benefitting
MYPro I91
All the power of the MYPro I series 3D AOI for heavyweight board inspection.
MRSI-705
For detailed Data Sheets please contact Sales. The MRSI-705 5-Micron Flip-Chip Die Bonder sets the mark for high-precision, high-speed component assembly within a flexible, configurable platform.