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MRSI will be a featured exhibitor at the OFC Exhibition. The OFC Exhibition is a unique and premium opportunity to immerse yourself into the photonics industry.  

die-bonding Watch MRSI’s Software Training Videos MRSI has released a comprehensive set of software training videos that are designed to help users get the most out of their MRSI Machines. These

MRSI will attend the 5th Auto Lidar Tech Forum from Jun 5-7th in Suzhou, China. This event will focus on the market trends, technological breakthroughs, and practical applications of LIDAR

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MRSI is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems.

March will be a busy month for device packaging exhibitions. Please join MRSI Mycronic at these upcoming events. We hope to see you there to discuss our latest new product innovations. Learn more

Advanced heterogeneous integration for 3-D IC packaging, e.g., chiplet, and optoelectronics packaging requires high-precision die bonders that can perform many different processes, such as

At the exhibition, MRSI will provide live product demos of the recently launched MRSI-H-HPLD+, a new variant of the successful MRSI-H-HPLD that is tailored for high-power laser die attachment

In the November/December 2023 issue of Chip Scale Review, MRSI delves into the fascinating world of automotive light detection and ranging (LiDAR) technology. This article explores the parallels

In the world of chip packaging and advanced die bonding, the pursuit of efficiency, accuracy, and productivity is a continuous endeavor. MRSI’s die bonding systems offer a cutting-edge patented

If you are looking to pick from tape and do not have a tape and real feature on your machine, then we have a solution for you. The two inch metal tape holder can accommodate four two-inch strips

This increased demand for photonics components is driven by the growth in optical networks. Learn more about Photonics Packaging by reading more from MRSI Systems!

MRSI’s fully automated die bonding solutions help RF power amplifier device manufacturers to address manufacturing requirements and challenges. To learn more about how MRSI’s solutions support

These videos help you to discover advanced features of our MRSI machines, which will ensure your production line is optimized.

We are pleased to be exhibiting again this year at the 50th ECOC in Frankfurt am Main, Germany.

die-bonding MRSI Mycronic exhibiting at Laser World of Photonics Munich MRSI to exhibit at LASER World of PHOTONICS Munich MRSI will be exhibiting at LASER World of PHOTONICS, held at Messe

Excerpt from MRSI’s recent article emphasizes the CoS die bonding process requirements including geometric placement accuracy & void free eutectic bonding.

The MRSI-H1 family of 1-micron flip-chip die bonders stands out as an advanced ultra-precision solution.

die-bonding Learn more about MRSI’s Training Programs MRSI is currently offering training programs at our Tewksbury, MA facility. These courses are taught by dedicated trainers who are MRSI

MRSI Systems, Mycronic Group will be exhibiting at the 56th International Symposium on Microelectronics from October 3-4th, 2023 in San Diego, CA. This year's Symposium will feature 5

MRSI recently introduced the air-knife vacuum system for cleaning epoxy dispense needles and it is now a standard feature on all MRSI dispense systems.

9月4日－7日，全球极具规模及影响力的光电产业综合性展会——第21届中国国际光电博览会（简称光博会／CIOE）在深圳会展中心举办。作为全球光电器件自动化贴片封装设备的领军企业，MRSI Systems（Mycronic Group）与CYCAD Century Science and Technology携手亮相本次光博会，并重点展出MRSI－H、MRSI－HVM等系列产品与最新技术。

MRSI Systems, a leading manufacturer of fully automatic, high-speed, high-precision, flexible and multi-functional die bonding systems, demonstration capability was officially opened at the

The arrival of 5G marks a new era for the manufacturing supply chain. This transformation presents new challenges for die bonding and packaging processes. As a leader in the automated packaging

Having a proven ultra-accurate die bonding system platform that is mechanically and thermally stable, with no cantilevered parts, are essential elements to achieve accurate device placement.

TESAT’s challenge was to develop an “Automated Microwave Factory” to manufacture complex highly integrated LTCC microwave modules within the frequency range 2 to 77GHz, 24 hours per day including

The demand for data and bandwidth continues to expand, resulting in the requirement for high volume manufacturing of photonics devices at unprecedented levels.

Increasing demand for data and bandwidth requires high-volume manufacturing of photonics and RF electronics at a level we have never seen before.

Communiqué from the Annual General Meeting and statutory meeting of the Board of Directors of Mycronic AB (publ) The Annual General Meeting of Mycronic AB (publ) was held on May 9, 2023. The