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About us
Advanced production solutions for printed circuit board assembly, dispensing and chip protection in cellphones, medical, cars, etc. and world-leading laser writers for photomask for displays and
Key facts about Mycronic
Mycronic are the inventors of jet printing technology. Laser-based masked writers used for billions of screens. The company has more than 500 patents. Join our us on journey!
Always one micrometer ahead
Always one micrometer ahead In a world of rapid technological change, anticipating our customers’ needs is the foundation for our purposeful innovation process. Demanding customers keep us sharp
Purpose & vision
The Mycronic brand and company purpose is to “bring electronics to life”. The vision is “to be the most trusted partner to the creators of tomorrow’s electronics.”
MRSI Systems推出新型MRSI-H3LD高速贴片机
MRSI系统公司(Mycronic集团)推出MRSI-H3LD新型3微米高速贴片机,专用于大功率半导体激光器中的芯片贴片,广泛应用于工业激光器、光纤放大、光源和传感器等先进光电子应用。
MRSI宣布在中国深圳建立HVM3芯片贴装演示能力
MRSI Systems(Mycronic集团)宣布在其位于深圳龙华的姐妹公司,深圳市轴心自控技术有限公司工厂建立一项新的演示能力。我们将根据客户的样品材料,安排并提供我们市场领先的MRSI-HVM3产品的本地演示以及芯片贴装应用。
MRSI Systems Launches MRSI-HVM3P for New Applications Extending the MRSI-HVM3 Die Bonder Family
BILLERICA, Massachusetts, Aug. 29, 2018 — MRSI Systems (Mycronic Group), is expanding its leading high speed MRSI-HVM3 die bonder platform with the launch of the MRSI-HVM3P to offer
MRSI Systems Welcomes Dr. Limin Zhou as Senior Director of Strategic Marketing
MRSI Systems, part of the Mycronic Group is pleased to announce the appointment of Dr. Limin Zhou as the Senior Director of Strategic Marketing to expand MRSI’s market presence in China. He will
MRSI Launches New MRSI-H3TO Die Bonding Product Family Targeted at the 5G Wireless Network Supply Chain
STOCKHOLM, Aug 29, 2018 — MRSI Systems (Mycronic Group) is launching the MRSI-H3TO, a new 3 micrometer high speed die bonder which will be the first of its kind to address the multi-die and
MRSI Announces HVM3 Die Bonding Demonstration Capability in Shenzhen China
STOCKHOLM, Nov 9, 2018 — MRSI Systems (Mycronic Group) announces new demonstration capability at its sister company, Shenzhen Axxon Automation (Mycronic Group) facility in the Longhua district,
MRSI Systems Acquires Die Bonding Business
BILLERICA, MA — January 31, 2014 — MRSI Systems, a developer and manufacturer of turnkey chip placement and dispensing systems, announced today it has completed a leveraged buyout of assets from
Contact us
Contact MRSI Systems in Massachusetts for product information, technical support and more. Contact MRSI Systems today for more information!
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MRSI North America
MRSI is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems.
Notice to the Annual General Meeting in Mycronic AB (publ)
The shareholders in Mycronic AB (publ), corp. reg. no. 556351-2374, are hereby given notice of the Annual General Meeting to be held on Wednesday, May 7, 2025, at 5:00 p.m. at the company’s
Communiqué from the Annual General Meeting and statutory meeting of the Board of Directors of Mycronic AB (publ)
The Annual General Meeting of Mycronic AB (publ) was held on May 8, 2024. The Annual General Meeting was carried out with the physical presence of shareholders and representatives. The
Interim Report January–June 2024
Interim Report January–June 2024 Second quarter Order intake amounted to SEK 2,125 (1,748) million, an increase of 22 percent Net sales increased 23 percent to SEK 1,527 (1,245) million. Also
Mycronic receives order for a Prexision 8 Entry Evo
Mycronic AB (publ) has received an order for a Prexision 8 Entry Evo from an existing customer in Asia. The order value is in the range of USD 10-12 million. Delivery of the system is planned for
Global Technologies makes acquisition in the United Kingdom
Mycronic’s Global Technologies division has acquired RoBAT, a company headquartered in the United Kingdom, which has developed a technology for fast and reliable tests of signal quality on PCBs.
Invitation to the presentation of Mycronic’s Q4 2024
Analysts, investors and media are invited to the presentation of Mycronic’s Q4 2024. The presentation will be held on February 6, 2025, at 10:00 a.m. CET. The report is published on February 6,
High Flex becomes PCB Assembly Solutions
Mycronic’s High Flex division will from today operate under the name PCB Assembly Solutions. The new name reflects the division’s growing product offering of advanced production equipment and
Comparison of Speed and Throughput
In the realm of Contract Manufacturing (CM), selecting the right equipment is a nuanced decision shaped by a myriad of variables. These factors are essential for enabling CMs to bid competitively
MRSI to Showcase Innovation at the Asia Photonics Expo 2026
MRSI, a global leader in precision assembly solutions for the photonics industry, is excited to announce its participation in the upcoming Asia Photonics Expo (APE), scheduled to take place in
MRSI at CIOE 2025: Showcasing the MRSI-LEAP Die Bonder
MRSI is pleased to announce the presentation of its latest innovation, the MRSI-LEAP Die Bonder, at the China International Optoelectronic Expo (CIOE) in Shenzhen, taking place from September 10th
Join us at the Optical Fiber Communications Conference and Exhibition (OFC) in Los Angeles!
die-bonding OFC 2026 MRSI to exhibit Join us at the Optical Fiber Communications Conference and Exhibition (OFC) in Los Angeles! The exhibition features more than 700 industry-leading companies
Join MRSI at the International Microwave Symposium in San Francisco
The International Microwave Symposium (IMS) is an annual conference for professionals in the microwave and RF industry.
Dr. Limin Zhou to present at the Semiconductor Advanced Technology Innovation Development and Opportunities Conference
The rapid adoption of artificial intelligence is driving advancements in optical interconnect technology, resulting in notable improvements in speed, power efficiency, and cost reduction. This
Learn more about our active alignment solutions
The MRSI-A-L machine is a versatile optical active alignment platform suitable for a wide range of applications, including lens, fiber and other optical components active alignment.
Join us in Phoenix!
We are thrilled to announce our presence at SEMICON West in its dynamic new location—Phoenix, AZ. Experience firsthand the future of die bonding, active alignment, fluid and epoxy dispensing as