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Mycronic AB (publ) has received an order for three mask writers from an existing customer in Asia: one Prexision 8 Evo, one SLX and one FPS6100. The order value is in the range of USD 36-40

Complex Hybrid Circuits are used in a variety of high reliability applications including military, aerospace, medical, and photonics. MRSI offers dispense and die bonding solutions specifically

MRSI Systems is exhibiting at the 51st International Symposium on Microelectronics from October 8-11, 2018 in Pasadena, California at the Pasadena Convention Center.

The exhibition is from March 13th-March 15th. Visit the MRSI Systems’ Booth #4444 at OFC 2018. Enjoy a free “Exhibits Plus Pass” Compliments of MRSI Systems.

die-bonding Visit MRSI Systems at Productronica 2017 in Munich, Germany Productronica is the world’s leading international trade fair for innovative electronics production. The

die-bonding MRSI Systems’ Exceptional Customer Support After the sale, the real test of a quality business is what happens next. What happens if I have a problem? Can you reach a human being

Jon is a strong proponent of relationship selling and believes in the importance of customer advocacy within MRSI by providing the customer a voice.

The International Microelectronics Assembly and Packaging Society New England Chapter’s Symposium will be held in Boxborough, MA on May 2nd, 2017.

“MRSI Systems was glad to exhibit at the Technology Corner, attend the technical conference, and meet customers at ECTC this year again."

MRSI Systems is exhibiting at the 67th ECTC focused on the global microelectronics packaging industry.

Over three decades, MRSI Systems has developed a family of high precision eutectic die bonders for high volume manufacturing of optoelectronics.

Learn more about how VPT Components and MRSI Systems jointly address manufacturing challenges.

These Die Bonding process pages explain the central role that die bonding continues to play in the photonics, sensors and semiconductor industries.

Middlesex Community College technology students recently visited our factory in Billerica, MA.

The following excerpt from MRSI Systems latest article published in Laser Focus World Magazine demonstrates how the latest advanced automated die bonding systems are transforming the world of

Thank you to all who stopped by the MRSI booth at the International Microwave Symposium to discuss microwave RF package applications.

Innovation in wireless technology leads to faster and smarter networks. 5G and the Internet of Things (IoT) have the capacity to connect everyone & devices.

Ezer Espares has over 25 years of experience in semiconductor packaging, testing, and equipment support, including installations and customer support.

MRSI Systems is exhibiting at IMS (Booth #448)—the world’s largest Microwave and RF industry event in Philadelphia, PA at the Pennsylvania Convention Center June 10-15, 2018.

The demand for data and bandwidth continues to expand, resulting in the requirement for high volume manufacturing of photonics devices at unprecedented levels.

MRSI’s latest article in Laser Focus World’s August Issue Challenges for photonics manufacturing in the new data center era, discusses the high volume and high mix nature of photonics

The MRSI-705 has established itself as a reliable tool in the aerospace, defense, and medical industries, playing a crucial role in mission-critical tasks due to its performance, adaptability,

die-bonding

Mycronic AB (publ) has received an order for two SLX mask writers from a new customer in Asia. The order value is in the range of USD 13-15 million. Delivery of the first system is planned for

MRSI Systems will be demonstrating our “One Stop Shop” capabilities at the 20th China International Optoelectronic Exposition (CIOE) at the Shenzhen Convention and Exhibition Center with our

IMAPS New England Chapter’s Symposium will be held at the Boxborough Regency Hotel in Boxborough, MA, May 1st, 2018.

Simplifying high-mix manufacturing for more than 50 years 50 years in the mix If there’s one constant in PCB assembly, it’s change itself. Whether it’s fast-changing product mixes, components or

MRSI is now offering an extensive library of software training videos for your MRSI die bonding and epoxy dispense systems.

die-bonding High-Volume Manufacturing (HVM) of Photonics Devices – Success Requires Expertise in Eutectic Bonding of Chip on Submount (CoS) In this post we examine the critical manufacturing

Customers appreciate the extensive product knowledge that the team has and that they are able to talk to a person that knows them and their machine.