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REMUNERATION REPORT 2021 Introduction This remuneration report provides an overview of how Mycronic’s guidelines for remuneration to members of the executive management, which were

Punkt 15 Styrelsens förslag till riktlinjer för ersättning till ledande befattningshavare Styrelsens förslag till riktlinjer för ersättning till koncernledningen,

Punkt 16 Valberedningens förslag till årsstämman den 25 juni 2020 i Mycronic AB (publ) om inrättande av valberedning inför 2021 års årsstämma Valberedningen

ÅRS- OCH HÅLLBARHETSREDOVISNING 2018 The business partner of choice, enabling the future of electronics ÖVERSIKT Mycronic i korthet Översikt och strategi Mycronic i korthet 1 Mycronic

Pressmeddelande Täby, 24 mars 2022 Kallelse till årsstämma i Mycronic AB (publ) Aktieägarna i Mycronic AB (publ) kallas härmed till årsstämma torsdagen den

The Nomination Committee’s statement to its proposed Board of Directors of Mycronic AB (publ), reg. no. 556351-2374 for the Annual General Meeting on May 9, 2023 Background The Nomination

Press release Täby, 24 March 2021 Notice to the Annual General meeting in Mycronic AB (publ) The shareholders in Mycronic AB (publ) are hereby given notice of the Annual General

The Nomination Committee’s statement to its proposed Board of Directors of Mycronic AB (publ), reg. no. 556351-2374 for the Annual General Meeting on May 8, 2024 Background The Nomination

ERSÄTTNINGSRAPPORT 2022 1 (4) ERSÄTTNINGSRAPPORT 2022 Inledning Denna ersättningsrapport tillhandahåller en översikt över hur Mycronics ersättningsriktlinjer

Fullmakt Härmed befullmäktigas nedanstående ombud att rösta för samtliga undertecknades aktier i Mycronic AB (publ), 556351-2374, vid årsstämma i Mycronic AB

Responsibility and control – Corporate governance24 Micronic Mydata AB is a Swedish public company listed on NASDAQ OMX Stockholm. The company has complied with the Swedish Code for Corporate

54 GROUP / BOARD OF DIRECTORS AND AUDITOR Arun Bansal Board member since 2020 Born 1968 Independent Board member Deputy CEO, and President of Europe and Latin America at Ericsson Education

ANNUAL AND SUSTAINABILITY REPORT 2019 Enabling the future of electronics Overview and strategy 1 Mycronic in brief 2 The year in brief 4 CEO comments 6 Strategy: Developments in the

GRI Appendix 2018 — complement to the Annual and Sustainability Report GRI APPENDIX 2018 Mycronic | Complement to the Annual and Sustainability Report 20182 About this report Mycronic’s

Annual and Sustainability Report 2020 Bringing tomorrow’s electronics to life Bringing tomorrow’s electronics to life Electronics touch every corner of our lives. At Mycronic, we

Annual and Sustainability Report 2020 Bringing tomorrow’s electronics to life Bringing tomorrow’s electronics to life Electronics touch every corner of our lives. At Mycronic, we

i DENTOR SUM VENDIT Annual and Sustainability Report 2021 OVERVIEW / PURPOSE AND MISSION Bringing tomorrow’s electronics to life Overview Purpose & mission . . . . . . . . . . . . . .

Års- och hållbarhetsredovisning 2022 Den reviderade års- och koncernredovisningen finns på sidorna 18–27, 36–45, 52–100. Förvaltningsberättelsen är en del av årsredovisningen

This is an in-house translation of the Swedish original that was adopted at the Annual General Meeting on 5 May, 2021 ARTICLES OF ASSOCIATION for Mycronic AB (publ) (Reg. No. 556351-2374)

LM1000 Universal Grid System for step testing Octal Density Universal Grid System Granite based Mechanics for Highest Accuracy Fully automatic Optical Alignment Quick & easy fixture set up

8 Test Heads Double Sided Test System High Speed Direct Linear Drives for X and Z motion Vacuum table optional No Probe Marks Optical auto focus Microscope Lenses Fast 300 mA Kelvin Testing

Bringing tomorrow's electronics to life Bringing tomorrow's electronics to life MRSI Systems (a part of Mycronic Group) is the leading manufacturer of fully automated, high-speed,

适用于光子、微波及 RF 电子产品量产的先进共晶封装 作者：Daniel F. Crowley, Yi Qian [MRSI Systems] 日益增长的数据和带宽需求对光子及 RF 电子产品的大量生产提出了前所未有的要求。而 这一要求又加速了批量生产以及高级产品设计的全自动化进程和先进共晶封装工艺改进。 本文介绍了自动化及共晶工艺领域所取得的最新进展，并着重介绍了光子及

Page 1 of 6 April 2005 Automating Hybrid Circuit Assembly Die Attach The demand for hybrid circuits has remained strong as emerging and existing applications continue to rely on this

T here is a rapid increase in the number of electronic packages using flip chip technology. With the ongoing expansion of the Internet, mobile phones, PDAs, desktop com- puters and laptops,

Place and date: For the issuing office: Solna, 24 February 2023 DNV - Business Assurance Elektrogatan 10, 171 54, Solna, Sweden Ann-Louise Pått Management Representative Lack of fulfilment