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MRSI Systems announces “One Stop Shop” die bonding solutions at CIOE and ECOC
STOCKHOLM, Aug. 30, 2018 — MRSI Systems (Mycronic Group) will be demonstrating our “One Stop Shop” capabilities at the 20th China International Optoelectronic Exposition (CIOE) at the Shenzhen
MRSI Mycronic to present at Automotive LIDAR 2023
Join us at the 6th annual Automotive LIDAR conference and exhibition from October 3-5, 2023. This conference is the only event in the world exclusively focused on automotive LIDAR technologies
Advancing Microelectronics: MRSI Mycronic’s Presence at IMAPS New England
At the IMAPS New England Symposium, MRSI will showcase our latest innovations.
Mastering the Art of Handling Delicate High Aspect Ratio Dies: Challenges and Solutions
Handling delicate, large aspect ratio, and thin dies is essential across various applications, including RF Power, Optical, and MEMS. These devices have aspect ratios exceeding 45 to 1,
Silver Epoxy Turns Black After an Oxygen Plasma Clean Prior to Wire Bonding – But so What?
Learn more about epoxy bleed from industry expert Tom Green. Here is the abstract of the white paper Silver Epoxy Turns Black After an Oxygen Plasma Clean Prior to Wire Bonding
The Japanese version of MRSI’s article “Die-bonder innovations target HPLD manufacturing challenges” is now available
MRSI’s article in Laser Focus World’s February 2020 Issue “Die-bonder innovations target HPLD manufacturing challenges” discusses the die bonding challenges of High-power laser diodes (HPLDs)
Join MRSI Mycronic at the China International Optoelectronic Exposition (CIOE)
MRSI is proud to be exhibiting and presenting at the 25th China International Optoelectronic Exposition this year in Shenzhen. Stop by our booth #10B79 to learn more about how MRSI products meet
MRSI to sponsor and present at IMAPS New England this May
die-bonding MRSI to sponsor and present at IMAPS New England this May MRSI Systems is delighted to announce another opportunity to see us this spring. We will be a featured Platinum Sponsor along
Join MRSI at ECOC 2023 – The European Conference on Optical Communication
MRSI is excited to announce we will be exhibiting at the 49th exhibition of ECOC in Glasgow, Scotland from October 2-4, 2023.
MRSI Mycronic to Present at Automotive LIDAR 2022
Join us at the 5th annual Automotive LIDAR conference and exhibition from September 20-22nd. Automotive LIDAR is the only conference to be primarily focused on automotive LIDAR technologies and
Dr. Limin Zhou to present at the CHIP China Conference
Dr. Limin Zhou, General Manager, MRSI Automation (Shenzhen) Co., Ltd., Senior Director of Strategic Marketing, MRSI Systems will present “Discussion on New Challenges and Solutions of Chip
MRSI to present and attend 4th LiDAR Tech 2022
MRSI will attend the 4th LiDAR Tech Forum taking place from November 16-18, 2022 in Suzhou, China. This event will focus on market trends, technological breakthroughs, and practical applications
What is the Future of Optoelectronics Packaging?
Innovation in wireless technology leads to faster and smarter networks. 5G and the Internet of Things (IoT) have the capacity to connect everyone & devices.
Manufacturing Automation Case Study – Flexible High-Speed Die Bonding Automation Platform
The following excerpt from MRSI Systems latest article published in Laser Focus World Magazine demonstrates how the latest advanced automated die bonding systems are transforming the world of
MRSI to Sponsor and Exhibit at the International Microelectronics Assembly and Packaging Society (IMAPS) Symposium
MRSI (Mycronic Group) is exhibiting at the 54th International Symposium on Microelectronics from October 11-14, 2021, in San Diego, California at the Town and Country Resort.
MRSI will exhibit and present at the Automotive LIDAR 2020 Virtual Conference and Exhibition
MRSI Mycronic is exhibiting at the Automotive LIDAR 2020 Conference and Virtual Exhibition from September 22-24th, 2020. See the conference agenda for more details. Visit the MRSI virtual booth
MRSI Systems Customer Support Team – Ezer Espares
Ezer Espares has over 25 years of experience in semiconductor packaging, testing, and equipment support, including installations and customer support.
Visit MRSI Systems at SEMICON China 2019 in Shanghai
MRSI Systems is exhibiting at SEMICON China in Shanghai, March 20-22, 2019, at the Shanghai New International Expo Centre. Please stop by the CYCAD Century Science & Technology Booth #2567.
2017 International Microwave Symposium Highlights
Thank you to all who stopped by the MRSI booth at the International Microwave Symposium to discuss microwave RF package applications.
MRSI to present at LaserFocusCon 2022
We are pleased to announce that MRSI will be exhibiting at this year’s LaserFocusCon in Suzhou, China on August 30th. Dr. Limin Zhou, Senior Director, Strategic Marketing, MRSI Systems, Mycronic
ECTC San Diego 2022 Highlights
The 2022 Electronics Components and Technology Conference in San Diego was a tremendous success. We would like to thank everyone who attended the conference and to those who stopped by our booth
Challenges in High-Volume Manufacturing for Die Attach Systems
Increasing demand for high-volume manufacturing accelerates the continuing adaptation of full automation in advanced eutectic packaging.
VPT Components and MRSI Systems jointly address manufacturing challenges
Learn more about how VPT Components and MRSI Systems jointly address manufacturing challenges.
Distributor Code of Conduct
ID: 80225 | Version: 5 | Published: September 11, 2024 Mycronic Group Distributor Code of Conduct The purpose of this Distributor Code of Conduct (“DCoC”) is to outline the minimum ethical
Code of Conduct
Mycronic Group Code of Conduct ID: 80381 | Version: 6 | Published: May 15, 2025 | Approved at board meeting 2025-05-07 Mycronic Group Code of Conduct The Mycronic Group Code of Conduct represents
Automated flying probe for PCB test
Automated flying probe for PCB test A7a Pro A9a A9a plus A9aL The automated A7a Flying Probe Test System provides highest flexibility. The fully automated A9a, 8-head, double-sided, high-speed,
Flying ahead in Michigan with Calumet
Flying ahead in Michigan with Calumet When American industry brings tomorrow’s electronics to life, it often starts with a printed circuit board (PCB) or substrate from Michigan-based Calumet
Fixture based test systems
Grid test systems Fixture based test systems LM1000 LM1000 The LM1000 is a highly precise compact step tester for the electrical test of HDI bare boards in mass production. We offer highly
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About us
About us atg Luther & Maelzer a part of Mycronic group. We are specialists in the development, manufacture, and sale of test systems for bare printed circuit boards. atg LM About us Mycronic