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What is the significance of co-planarity in die bonding?

At the recent IMAPS Conference in Arizona, co-planarity in die bonding was a key topic due to its importance in 2.5 and 3D chip stacking.

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New facility in Wertheim opens successfully

atg L&M - part of Mycronic Group celebrates New facility in Wertheim opens successfully In January 2025 atg Luther & Maelzer GmbH - part of Mycronic Group moved to our newly completed facility

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Mycronic executes share split and determines record date

The annual general meeting of Mycronic AB (publ) held on May 7, 2025, resolved to increase the number of shares by a share split, whereby one (1) existing share will be split into two (2) shares.

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Best Support Award from Bomin

bare-board-testning "Shaping the Future, Igniting New Journeys" atg Luther & Mealzer GmbH Awarded Bomin’s 2025 "Best Support Award" On May 24, 2025, the grand opening ceremony

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Join MRSI at the International Microwave Symposium in San Francisco

The International Microwave Symposium (IMS) is an annual conference for professionals in the microwave and RF industry.

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Mycronic High Flex changes division name to PCB Assembly Solutions

Mycronic AB (publ), the leading Sweden-based electronics assembly solutions provider, today announced that its division formerly known as High Flex will now operate under the name PCB Assembly

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High Flex becomes PCB Assembly Solutions

Mycronic’s High Flex division will from today operate under the name PCB Assembly Solutions. The new name reflects the division’s growing product offering of advanced production equipment and

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Gallery

Gallery Video gallery Image gallery MRSI Die Bonding Video MRSI Patented Turret MRSI Die Bonding

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Learn more about our active alignment solutions

The MRSI-A-L machine is a versatile optical active alignment platform suitable for a wide range of applications, including lens, fiber and other optical components active alignment.

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Dr. Limin Zhou to present at the Semiconductor Advanced Technology Innovation Development and Opportunities Conference

The rapid adoption of artificial intelligence is driving advancements in optical interconnect technology, resulting in notable improvements in speed, power efficiency, and cost reduction. This

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Communiqué from the Annual General Meeting and statutory meeting of the Board of Directors of Mycronic AB (publ)

The Annual General Meeting of Mycronic AB (publ) was held on May 7, 2025. The Annual General Meeting was carried out with the physical presence of shareholders and representatives. The

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Making progress on our climate targets

Making progress on our climate targets We are happy to announce good progress on our science-based climate targets! We have reached one target and are on track to meet the other - but there is

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Mitarbeiter Mechanische Konstruktion (m/w/d)

in Vollzeit (40 Wochenstunden) Mitarbeiter Mechanische Konstruktion (m/w/d) Ihre Aufgaben: Konstruktion und Optimierung von mechatronischen Baugruppen und Systemen Montage, Inbetriebnahme und

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Video: Mycronic Interim Report January-March 2025 - CEO and CFO comments

Watch our brief video summary of the Interim Report Q1 2025 Mycronic Interim Report January-March 2025 - CEO and CFO comments Today we published our Interim Report January-March 2025. "We

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Interim Report January-March 2025

Interim Report January-March 2025 First quarter Order intake amounted to SEK 2,058 (1,645) million, an increase of 25 percent Net sales increased 27 percent to SEK 2,142 (1,692) million. Based on

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MRSI为5G无线网络光电器件推出新型MRSI-H3TO贴片机产品

MRSI系统公司(Mycronic集团)推出MRSI-H3TO新型3微米高速贴片机,这是业界第一款可以真正满足多晶片和多流程的要求,可实现行业领先的贴片速度、卓越的灵活性以及为未来产品准备的3微米贴片精度。 MRSI-H3TO专为WDM与EML-TO或其他多晶片多流程TO-can光电器件量身打造,以支持即将普及的5G无线网络。

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MRSI Systems推出新型MRSI-H3LD高速贴片机

MRSI系统公司(Mycronic集团)推出MRSI-H3LD新型3微米高速贴片机,专用于大功率半导体激光器中的芯片贴片,广泛应用于工业激光器、光纤放大、光源和传感器等先进光电子应用。

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MRSI Systems推出用于新应用的MRSI-HVM3P新产品

die-bonding MRSI Systems推出用于新应用的MRSI-HVM3P新产品 MRSI Systems(Mycronic集团)8月20日在美国马萨诸塞州扩展其业界领先的MRSI-HVM3高速贴片机机平台,推出MRSI-HVM3P新款机型,为有源光缆(AOC)、管盒(Gold-box)封装 以及 基板芯片(CoC)之外 的其他应用提供优化配置。

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MRSI Systems 推出用于大批量生产光电子器件的高速贴片机

美国马萨诸塞州, August 14, 2017 – 全球领先的全自动、高精度、高速贴片和点胶系统制造商,MRSI Systems推出一款新型产品, MRSI-HVM3 高速贴片机,以支持光电子客户的大批量生产需求。目前,MRSI-HVM3 正在全面投产并发货至世界各地的客户。

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MRSI Systems将在深圳中国国际光电博览会(CIOE)上展示新产品 MRSI-HVM3 并赞助第一届国际激光技术高端论坛

美国马萨诸塞州, August 25, 2017 – 全球领先的全自动、高精度、高速贴片和点胶系统制造商,MRSI

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Join MRSI Mycronic at IMAPS New England in May!

die-bonding MRSI Mycronic IMAPS New England 2025 Join MRSI Mycronic at IMAPS New England in May! MRSI Mycronic will be exhibiting, sponsoring, and presenting at the IMAPS New England event on May

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Invitation to the presentation of Mycronic’s Q1 2025

Analysts, investors and media are invited to the presentation of Mycronic’s Q1 2025. The presentation will be held on April 25, 2025, at 10:00 a.m. CEST. The report is published on April 25, 2025,

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Protecting ideas that matter

First-ever Mycronic Inventor Award goes to Pattern Generators Core Research Team Protecting ideas that matter Lasers make Nur Ismail eyes light up with excitement. Mention “acusto-optic

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Global Technologies makes acquisition in the United Kingdom

Mycronic’s Global Technologies division has acquired RoBAT, a company headquartered in the United Kingdom, which has developed a technology for fast and reliable tests of signal quality on PCBs.

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Imprint

Mycronic AB Box 3141,  18303 Täby, Sweden Phone: +46 8 638 52 00 E-Mail: info@mycronic.com   CEO: Anders Lindqvist Company Registration Number: 556351-2374 VAT Number:

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Annual and Sustainability Report 2024 - CEO comments (video summary)

Discover the highlights of Mycronic's Annual and Sustainability Report for 2024. Watch the video summary featuring insights from President and CEO Anders Lindqvist on the company's achievements

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Mycronic publishes Annual and Sustainability Report 2024

Mycronic AB (publ) today publishes its Annual and Sustainability Report 2024, which can be downloaded as a PDF from the report archive on the company’s website.

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Notice to the Annual General Meeting in Mycronic AB (publ)

The shareholders in Mycronic AB (publ), corp. reg. no. 556351-2374, are hereby given notice of the Annual General Meeting to be held on Wednesday, May 7, 2025, at 5:00 p.m. at the company’s

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MRSI-H1: Comprehensive High-Precision Die Bonding Solutions

In the fast-paced world of photonics manufacturing, having the right tools can make all the difference. The MRSI-H1 is designed to meet the demands of high-volume production with its