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Visit MRSI Systems at the European Conference on Optical Communications (ECOC) 2017 — New Die Bonder for High Volume Manufacturing
Over three decades, MRSI Systems has developed a family of high precision eutectic die bonders for high volume manufacturing of optoelectronics.
Visit MRSI Systems Demonstration Center in Shenzhen – Mycronic Facility(2)
ICCSZ讯 近日,全自动,高速,高精度,灵活多功能的贴片系统的领先制造商MRSI Systems在中国深圳南山绿创云谷大厦的Mycronic展示中心正式开放。在MRSI Systems战略营销高级总监周利民博士的带领下,讯石人员参观了演示中心全貌并了解MRSI Systems的现状及MRSI-HVM3贴片设备的应用。
MRSI Systems Automated Microwave Hybrid Manufacturing at TESAT-Spacecom (TESAT)
TESAT’s challenge was to develop an “Automated Microwave Factory” to manufacture complex highly integrated LTCC microwave modules within the frequency range 2 to 77GHz, 24 hours per day including
MRSI Mycronic announces advanced high-speed 1µm die bonder MRSI-LEAP for ultra-high-volume manufacturing of AI optical module applications
MRSI Mycronic is proud to announce the launch of the MRSI-LEAP high-speed 1µm die bonder. This innovative equipment is designed for ultra-high-volume manufacturing of optical modules,
MRSI Mycronic to showcase high-speed assembly solutions at CIOE 2025
die-bonding MRSI Mycronic CIOE Booth 2025 MRSI Mycronic to showcase high-speed assembly solutions at CIOE 2025 MRSI Mycronic, part of the Mycronic Group, will present advanced assembly solutions
MRSI introduces innovative MRSI-A-L Active Aligner for optical packaging solutions
MRSI Systems (a part of Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, proudly introduces the MRSI-A-L
Advanced Vision Systems
Increasing demand for data and bandwidth requires high-volume manufacturing of photonics and RF electronics at a level we have never seen before.
The Resurgence of Optical Communication: MRSI Mycronic's Award-Winning Innovation
The rapid advancement of artificial intelligence has brought renewed attention to the optical communication industry. This sector, now favored by both capital market and commercial customers, is
Cases
Automated processes help clients grow
Join MRSI Mycronic at SPIE Photonics West 2026!
We invite you to visit our booth (#5145) at SPIE Photonics West, held from January 20–22, 2026, at the Moscone Center in San Francisco. This premier exhibition for optics and photonics provides a
Interview with MRSI Systems Dr. Limin Zhou: MRSI Die Bonders support the fast growth of the optical communication market
During 2021 CIOE in Shenzhen, China, Infostone, interviewed Dr. Limin Zhou, Senior Strategic Marketing Director of MRSI Systems (Mycronic Group) to discuss MRSI’s latest product developments and
MRSI Systems – “One Stop Shop” Fully Automated Die Bonding Solutions
Our die bonders are historically regarded the leaders in flexibility, and during the last two years, we have expanded our die bonding families. These high speed die bonders deliver
Visit MRSI Systems at the European Conference on Optical Communications (ECOC) 2018 – Fully Automated Die Bonders
Visit MRSI Systems’ Booth (#577) to learn about our new die bonder product launches.
International Microwave Symposium 2018
MRSI Systems is exhibiting at IMS (Booth #448)—the world’s largest Microwave and RF industry event in Philadelphia, PA at the Pennsylvania Convention Center June 10-15, 2018.
Challenges in Die Bonding of Gallium Nitride High Power Devices
Gallium Nitride (GaN) materials have long been regarded as great alternatives and enhancements to GaAs and silicon-based counterparts for applications...
Highlights of the Microelectronics Symposium
The 51st International Symposium on Microelectronics was held at the Pasadena Convention Center in Pasadena, California this month. This symposium is the premier event for microelectronic
SEMICON West 2018 – MRSI Systems’ Advanced Packaging Solutions
All major optical communication component manufacturers, data center transceiver suppliers, optical network technology groups and, in general, the world of photonics packaging have been facing an
MRSI Systems—New Process Pages
These Die Bonding process pages explain the central role that die bonding continues to play in the photonics, sensors and semiconductor industries.
Automotive LIDAR Conference 2018: AI & Autonomous Vehicles
MRSI Systems exhibited at the Automotive LIDAR 2018 Expo and Conference in Detroit, Michigan last month. The conference focused not only on hardware solutions but software as well. The use of AI
Featured Article Laser Focus World: Challenges for photonics manufacturing in the new data center era
MRSI’s latest article in Laser Focus World’s August Issue Challenges for photonics manufacturing in the new data center era, discusses the high volume and high mix nature of photonics
Interim Report January-September 2023
Interim Report January-September 2023 Third quarter Order intake was SEK 1,467 (1,609) million, a decrease of 9 percent Net sales increased 5 percent to SEK 1,274 (1,214) million. Based on
Interim Report January–June 2023
Interim Report January–June 2023 Second quarter Order intake amounted to SEK 1,748 (1,203) million, an increase of 45 percent Net sales decreased 2 percent to SEK 1,245 (1,273) million. Based on
Mycronic receives order for an SLX mask writer
Mycronic AB (publ) has received an order for an SLX mask writer from a new customer in Asia. The order value is in the range of USD 5-7 million. Delivery of the system is planned for the third
Mycronic receives order for an SLX mask writer
Mycronic AB (publ) has received an order for an SLX mask writer from an existing customer in Asia. The order value is in the range of USD 7-9 million. Delivery of the system is planned for the
Mycronic AB: Mycronic receives order for an SLX mask writer
Mycronic AB (publ) has received an order for an SLX mask writer from an existing customer in Asia. The order value is in the range of USD 4-6 million. Delivery of the system is planned for the
Mycronic appoints Nomination Committee
Mycronic appoints Nomination Committee The Nomination Committee for Mycronic’s 2024 Annual General Meeting has been appointed in accordance with the instructions for the Nomination Committee as
Invitation to presentation of Mycronic’s Q2 2023
Invitation to presentation of Mycronic’s Q2 2023 Analysts, investors and media are invited to the presentation of Mycronic’s Q2 2023. The presentation will be held on July 14, 2023, at 10:00 a.m.
MRSI Systems (Mycronic Group) delivered a keynote speech at the 2022 CFOL Optical Interconnection Conference and MRSI-H-HPLD+ 1.5 micron Die Bonder won the Award for “2022 CFOL Product Innovation”
Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems (Mycronic Group) and General Manager of MRSI Automation (Shenzhen) Co., Ltd., was invited to participate in the 2022 CFOL
MRSI will be attending and sponsoring IMAPS Boston 2022
MRSI Systems, Mycronic Group will be exhibiting at the 55th International Symposium on Microelectronics from October 4-5th in Boston Massachusetts at the Hynes Convention Center.
MRSI to present at the 21st Infostone Optical Communication Market and Technology Conference
MRSI will be presenting at the Infostone Optical Communication Market and Technology Conference which will be held at the Hyatt Regency Shenzhen Airport Hotel in Shenzhen, China from September