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Die bonding solution for Chip-on-Submount (CoS) – Excerpt from our LFW article

Excerpt from MRSI’s recent article emphasizes the CoS die bonding process requirements including geometric placement accuracy & void free eutectic bonding.

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Software Video Training Programs for Die Bonding and Epoxy Dispense Systems

These videos help you to discover advanced features of our MRSI machines, which will ensure your production line is optimized.

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Die Bonding Process Pages – Highlights

Various die bonding approaches have been, and still are, developed to meet the ever-evolving product requirements.

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Die Bonding Solutions

Having a proven ultra-accurate die bonding system platform that is mechanically and thermally stable, with no cantilevered parts, are essential elements to achieve accurate device placement.

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Challenges and Solutions in the Photonics Packaging Industry

This increased demand for photonics components is driven by the growth in optical networks. Learn more about Photonics Packaging by reading more from MRSI Systems!

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How Does MRSI Systems Manufacture to Customer’s Specification?

MRSI Systems thinks from the customer’s perspective and upholds strict protocols to ensure your desired configuration, has been built to proper specification. MRSI’s core value of acting like an

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Mycronic technology essential in 5G development

die-bonding Mycronic technology essential in 5G development Die bonding systems are required for the groundbreaking digital transition Mycronic technology essential in 5G development 5G is

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Join MRSI at the 50th European Conference on Optical Communication

We are pleased to be exhibiting again this year at the 50th ECOC in Frankfurt am Main, Germany.

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Register for the Laser Focus World Webinar: Gen AI: Catalyst for Optical Module Innovation

die-bonding Register for the Laser Focus World Webinar: Gen AI: Catalyst for Optical Module Innovation Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Mycronic and General Manager

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Join MRSI at SPIE Photonics West in San Francisco

die-bonding Join MRSI at SPIE Photonics West in San Francisco Join MRSI at SPIE Photonics West in San Francisco Meet with MRSI Systems, Mycronic Group in San Francisco Booth #5405 MRSI will be

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MRSI will be attending and sponsoring IMAPS Boston 2022

MRSI Systems, Mycronic Group will be exhibiting at the 55th International Symposium on Microelectronics from October 4-5th in Boston Massachusetts at the Hynes Convention Center.

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MRSI to present at the 21st Infostone Optical Communication Market and Technology Conference

MRSI will be presenting at the Infostone Optical Communication Market and Technology Conference which will be held at the Hyatt Regency Shenzhen Airport Hotel in Shenzhen, China from September

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MRSI Systems (Mycronic Group) delivered a keynote speech at the 2022 CFOL Optical Interconnection Conference and MRSI-H-HPLD+ 1.5 micron Die Bonder won the Award for “2022 CFOL Product Innovation”

Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems (Mycronic Group) and General Manager of MRSI Automation (Shenzhen) Co., Ltd., was invited to participate in the 2022 CFOL

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Visit MRSI at the Compound Semiconductor Advanced Technology & Application Conference

Visit us at the CSC Conference in Suzhou, China from August 3-4th to discuss the current and future states of compound semiconductor device technology with us and other industry experts.]

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Join MRSI at SEMICON West 2022

We are excited to announce that MRSI Systems will be exhibiting at SEMICON West from July 12-14th at the Moscone Center in San Francisco! Visit us at booth #2355 to talk with us about topics such

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MRSI is presenting and sponsoring the iMAPS New England 48th Symposium and Expo

The iMAPS New England Symposium and Expo will be held in Boxborough, MA on May 3rd, 2022 at the Boxboro Regency Hotel. Technical sessions include Advanced Packaging, RF& Microwave – 5G

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Learn more about how MRSI solves RF PA device manufacturing challenges

MRSI’s fully automated die bonding solutions help RF power amplifier device manufacturers to address manufacturing requirements and challenges. To learn more about how MRSI’s solutions support

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MRSI to exhibit at LASER World of PHOTONICS Munich

die-bonding MRSI Mycronic exhibiting at Laser World of Photonics Munich MRSI to exhibit at LASER World of PHOTONICS Munich MRSI will be exhibiting at LASER World of PHOTONICS, held at Messe

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Invitation to MRSI Webinar: MRSI is presenting at the 2022 ATC Webinar on Vehicle LIDAR Manufacturing

Abstract: on March 17th, 2022, Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems (Mycronic group) and General Manager of MRSI Automation (Shenzhen) Co., Ltd., is invited to

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Interview with MRSI Systems Dr. Limin Zhou: MRSI Die Bonders support the fast growth of the optical communication market

During 2021 CIOE in Shenzhen, China, Infostone, interviewed Dr. Limin Zhou, Senior Strategic Marketing Director of MRSI Systems (Mycronic Group) to discuss MRSI’s latest product developments and

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MRSI presented at the 12th China International Nanotechnology Industry Expo

The 12th China International Nanotechnology Industry Expo was held in Suzhou, Jiangsu Province from October 27th to 29th, 2021. Dr. Limin Zhou, Senior Director of Strategic Marketing, MRSI

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Visit MRSI at SEMICON West in San Francisco

MRSI is exhibiting at SEMICON West from December 7-9, 2021 at the Moscone Center, San Francisco, CA (Booth #1556). SEMICON West features hundreds of exhibitors, and thousands of attendees,

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Bruno Afonso joins MRSI – Sales

Bruno Afonso has joined MRSI as the Sales Director, EMEA. He is located in Switzerland and earned his BA in Industrial Engineering and his Master Degree in Electrical Engineering from Universidade

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专访MRSI SYSTEMS周利民:MRSI-HVM-p系列贴片机助力光通讯产业高速发展

摘要:9月16-18日,CIOE 2021期间,MRSI SYSTEMS携携最新的MRSI-HVM带轨道双机头固晶机精彩亮相。在4B79展台,讯石以现场视频直播方式走进MRSI SYSTEMS展台参观了正在进行演示的产品,MRSI SYSTEMS战略营销高级总监周利民博士向观众介绍本次参展的新产品。

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MRSI to present at Automotive LIDAR 2021

MRSI (Mycronic Group) is exhibiting, sponsoring, and presenting at the Automotive LIDAR 2021 Virtual Conference and Exhibition from September 21-23rd, 2021. MRSI is presenting on Wednesday,

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MRSI Systems受邀出席光收发器和硅基光电子论坛

摘要:MRSI Systems战略市场高级总监,周利民博士受邀参加光收发器和硅基光电子论坛并将带来主题为“光收发器和硅基光电子量产的挑战及解决方案”的演讲。

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Irving Wang joins MRSI – Product Marketing

Irving Wang joined MRSI this year as the Director of Product Marketing. He is based in the US to spearhead MRSI’s push into the sub-micron market and to support our newly launched MRSI-S-HVM

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MRSI-705 innovative high-volume configuration for lower cost manufacturing

5G infrastructure will require ultra-high bandwidth, latency up to 1 ms, and highly reliable connectivity. In addition, RF architectures need to be scalable, efficient, and extremely compact.

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IMAPS 2020 Virtual Exhibition

MRSI is exhibiting at the 53rd International Symposium on Microelectronics from October 6-8th, 2020. Visit the MRSI Virtual Booth to chat with our team of technical experts to review our exciting

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MRSI to present at IFOC and Exhibit at CIOE in September in Shenzhen including live product demos

MRSI Systems will present at the 19th Infostone Optical Communications Conference(IFOC), organized by Infostone Communication Consultant. The event will take place in Shenzhen, China from September