Search

STOCKHOLM, Aug 29, 2018 — MRSI Systems (Mycronic Group) is launching the MRSI-H3TO, a new 3 micrometer high speed die bonder which will be the first of its kind to address the multi-die and

MRSI系统公司（Mycronic集团）推出MRSI－H3LD新型3微米高速贴片机，专用于大功率半导体激光器中的芯片贴片，广泛应用于工业激光器、光纤放大、光源和传感器等先进光电子应用。

STOCKHOLM, Nov 9, 2018 — MRSI Systems (Mycronic Group) announces new demonstration capability at its sister company, Shenzhen Axxon Automation (Mycronic Group) facility in the Longhua district,

News die-bonding

In the realm of Contract Manufacturing (CM), selecting the right equipment is a nuanced decision shaped by a myriad of variables. These factors are essential for enabling CMs to bid competitively

We are thrilled to announce our presence at SEMICON West in its dynamic new location—Phoenix, AZ. Experience firsthand the future of die bonding, active alignment, fluid and epoxy dispensing as

MRSI is pleased to announce the presentation of its latest innovation, the MRSI-LEAP Die Bonder, at the China International Optoelectronic Expo (CIOE) in Shenzhen, taking place from September 10th

The International Microwave Symposium (IMS) is an annual conference for professionals in the microwave and RF industry.

The MRSI-A-L machine is a versatile optical active alignment platform suitable for a wide range of applications, including lens, fiber and other optical components active alignment.

The rapid adoption of artificial intelligence is driving advancements in optical interconnect technology, resulting in notable improvements in speed, power efficiency, and cost reduction. This

In the fast-paced world of photonics manufacturing, having the right tools can make all the difference. The MRSI-H1 is designed to meet the demands of high-volume production with its

The 2025 Optical Fiber Communications Conference and Exhibition (OFC) is back to solidify its status as the premier global event for optical networking and communications. 

MRSI Mycronic will be participating in several optical and device packaging exhibitions. We invite you to attend these upcoming events. We look forward to discussing our latest product

die-bonding MRSI-705 with wafer, conveyor Versatile package handling capabilities: dewar and beyond In today's fast-paced production environments, efficiency and versatility are key. The MRSI-705

die-bonding Epoxy Dispenser The Next Generation MRSI-175Ag Epoxy Dispenser is now available In the fast-paced world of advanced packaging and semiconductor manufacturing, precision and efficiency

Last year, MRSI Systems launched the MRSI-705HF high force die bonder, a new version of the trusted MRSI-705 that is perfect for sintering and thermocompression bonding applications.

MRSI Mycronic is proud to sponsor the 7th Annual Automotive LIDAR Conference, taking place online from November 20-21, 2024.

The MRSI-705 has established itself as a reliable tool in the aerospace, defense, and medical industries, playing a crucial role in mission-critical tasks due to its performance, adaptability,

MRSI’s die bonding systems are designed to address the challenges of chip packaging with a focus on efficiency, precision, and productivity. These systems feature an advanced, patented

The optical components industry demands highly precise and customized equipment for complex optical assembly processes. We have answered this need with our new active aligner - a high-performance

In the bustling world of technology, May was a month marked by significant events, and MRSI was at the forefront. With appearances at IMAPS New England in Boxborough, MA, and the 2024

Designing and manufacturing electronic components destined for defense applications entails navigating a landscape of exacting standards. These standards demand unparalleled reliability, minimal

In the November/December 2023 issue of Chip Scale Review, MRSI delves into the fascinating world of automotive light detection and ranging (LiDAR) technology. This article explores the parallels

The MRSI-H1 family of 1-micron flip-chip die bonders stands out as an advanced ultra-precision solution.

March will be a busy month for device packaging exhibitions. Please join MRSI Mycronic at these upcoming events. We hope to see you there to discuss our latest new product innovations. Learn more

If you are looking to pick from tape and do not have a tape and real feature on your machine, then we have a solution for you. The two inch metal tape holder can accommodate four two-inch strips

Advanced heterogeneous integration for 3-D IC packaging, e.g., chiplet, and optoelectronics packaging requires high-precision die bonders that can perform many different processes, such as

In the world of chip packaging and advanced die bonding, the pursuit of efficiency, accuracy, and productivity is a continuous endeavor. MRSI’s die bonding systems offer a cutting-edge patented

MRSI Systems, Mycronic Group will be exhibiting at the 56th International Symposium on Microelectronics from October 3-4th, 2023 in San Diego, CA. This year's Symposium will feature 5

At the exhibition, MRSI will provide live product demos of the recently launched MRSI-H-HPLD+, a new variant of the successful MRSI-H-HPLD that is tailored for high-power laser die attachment