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MRSI Launches New MRSI-H3TO Die Bonding Product Family Targeted at the 5G Wireless Network Supply Chain
STOCKHOLM, Aug 29, 2018 — MRSI Systems (Mycronic Group) is launching the MRSI-H3TO, a new 3 micrometer high speed die bonder which will be the first of its kind to address the multi-die and
Magnetic Test
Enabling the next generation of spintronic devices Magnetic Automated Test Equipment for Memory and Sensors Hprobe, part of Mycronic’s Global Technologies division, delivers advanced Magnetic
Die Bonder
Choosing a die bonder is important, and we advise considering all options before making a purchase. With MRSI Systems, you can find exactly what you need.
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Contact MRSI Systems in Massachusetts for product information, technical support and more. Contact MRSI Systems today for more information!
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MRSI North America
MRSI is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems.
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MRSI will be attending and sponsoring IMAPS Boston 2022
MRSI Systems, Mycronic Group will be exhibiting at the 55th International Symposium on Microelectronics from October 4-5th in Boston Massachusetts at the Hynes Convention Center.
How Does MRSI Systems Manufacture to Customer’s Specification?
MRSI Systems thinks from the customer’s perspective and upholds strict protocols to ensure your desired configuration, has been built to proper specification. MRSI’s core value of acting like an
MRSI to present at the 21st Infostone Optical Communication Market and Technology Conference
MRSI will be presenting at the Infostone Optical Communication Market and Technology Conference which will be held at the Hyatt Regency Shenzhen Airport Hotel in Shenzhen, China from September
Join MRSI at the 50th European Conference on Optical Communication
We are pleased to be exhibiting again this year at the 50th ECOC in Frankfurt am Main, Germany.
MRSI is presenting and sponsoring the iMAPS New England 48th Symposium and Expo
The iMAPS New England Symposium and Expo will be held in Boxborough, MA on May 3rd, 2022 at the Boxboro Regency Hotel. Technical sessions include Advanced Packaging, RF& Microwave – 5G
Join MRSI at SPIE Photonics West in San Francisco
die-bonding Join MRSI at SPIE Photonics West in San Francisco Join MRSI at SPIE Photonics West in San Francisco Meet with MRSI Systems, Mycronic Group in San Francisco Booth #5405 MRSI will be
Experience MRSI’s latest innovations at the OFC Exhibition
MRSI will be a featured exhibitor at the OFC Exhibition. The OFC Exhibition is a unique and premium opportunity to immerse yourself into the photonics industry.
Register for the Laser Focus World Webinar: Gen AI: Catalyst for Optical Module Innovation
die-bonding Register for the Laser Focus World Webinar: Gen AI: Catalyst for Optical Module Innovation Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Mycronic and General Manager
Visit MRSI at the Compound Semiconductor Advanced Technology & Application Conference
Visit us at the CSC Conference in Suzhou, China from August 3-4th to discuss the current and future states of compound semiconductor device technology with us and other industry experts.]
Join MRSI at SEMICON West 2022
We are excited to announce that MRSI Systems will be exhibiting at SEMICON West from July 12-14th at the Moscone Center in San Francisco! Visit us at booth #2355 to talk with us about topics such
Interview with MRSI Systems Dr. Limin Zhou: MRSI Die Bonders support the fast growth of the optical communication market
During 2021 CIOE in Shenzhen, China, Infostone, interviewed Dr. Limin Zhou, Senior Strategic Marketing Director of MRSI Systems (Mycronic Group) to discuss MRSI’s latest product developments and
MRSI Systems (Mycronic Group) delivered a keynote speech at the 2022 CFOL Optical Interconnection Conference and MRSI-H-HPLD+ 1.5 micron Die Bonder won the Award for “2022 CFOL Product Innovation”
Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems (Mycronic Group) and General Manager of MRSI Automation (Shenzhen) Co., Ltd., was invited to participate in the 2022 CFOL
Mycronic technology essential in 5G development
die-bonding Mycronic technology essential in 5G development Die bonding systems are required for the groundbreaking digital transition Mycronic technology essential in 5G development 5G is
MRSI presented at the 12th China International Nanotechnology Industry Expo
The 12th China International Nanotechnology Industry Expo was held in Suzhou, Jiangsu Province from October 27th to 29th, 2021. Dr. Limin Zhou, Senior Director of Strategic Marketing, MRSI
Invitation to MRSI Webinar: MRSI is presenting at the 2022 ATC Webinar on Vehicle LIDAR Manufacturing
Abstract: on March 17th, 2022, Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems (Mycronic group) and General Manager of MRSI Automation (Shenzhen) Co., Ltd., is invited to
Learn more about how MRSI solves RF PA device manufacturing challenges
MRSI’s fully automated die bonding solutions help RF power amplifier device manufacturers to address manufacturing requirements and challenges. To learn more about how MRSI’s solutions support
MRSI to exhibit at LASER World of PHOTONICS Munich
die-bonding MRSI Mycronic exhibiting at Laser World of Photonics Munich MRSI to exhibit at LASER World of PHOTONICS Munich MRSI will be exhibiting at LASER World of PHOTONICS, held at Messe
Visit MRSI at SEMICON West in San Francisco
MRSI is exhibiting at SEMICON West from December 7-9, 2021 at the Moscone Center, San Francisco, CA (Booth #1556). SEMICON West features hundreds of exhibitors, and thousands of attendees,
Bruno Afonso joins MRSI – Sales
Bruno Afonso has joined MRSI as the Sales Director, EMEA. He is located in Switzerland and earned his BA in Industrial Engineering and his Master Degree in Electrical Engineering from Universidade
Solutions
Solutions Flying ahead in Michigan with Calumet A9a Mycronic is providing its latest Flying Probe electrical testing system.
Best Support Award from Bomin
bare-board-testning "Shaping the Future, Igniting New Journeys" atg Luther & Mealzer GmbH Awarded Bomin’s 2025 "Best Support Award" On May 24, 2025, the grand opening ceremony
Excellent Partner Award from SCC
bare-board-testning Excellent Partner Award from SCC atg Luther & Maelzer's Chinese unit, Test Solutions (Suzhou) Co (TSL), was invited to the supplier meeting in Guangzhou by its customer
Exhibit at IPC Apex 2024
bare-board-testning atg Luther & Maelzer exhibit at IPC Apex 2024 atg Luther Maelzer (a Mycronic company) will showcase their latest technology, the A9 with Automation (A9aL), at the upcoming