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North Billerica, MA, USA, March 20, 2017 — MRSI Systems, a leading provider of fully automated, high-speed, high-precision die bonding and epoxy dispensing systems, today announces the

BILLERICA, Mass., August 14, 2017 – MRSI Systems, a leading manufacturer of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems, is launching a new High Speed

美国马萨诸塞州, August 14, 2017 – 全球领先的全自动、高精度、高速贴片和点胶系统制造商，MRSI Systems推出一款新型产品, MRSI-HVM3 高速贴片机，以支持光电子客户的大批量生产需求。目前，MRSI-HVM3 正在全面投产并发货至世界各地的客户。

BILLERICA, Massachusetts, Aug. 29, 2018 — MRSI Systems (Mycronic Group), is expanding its leading high speed MRSI-HVM3 die bonder platform with the launch of the MRSI-HVM3P to offer

die-bonding MRSI Systems推出用于新应用的MRSI-HVM3P新产品 MRSI Systems（Mycronic集团）8月20日在美国马萨诸塞州扩展其业界领先的MRSI－HVM3高速贴片机机平台，推出MRSI－HVM3P新款机型，为有源光缆（AOC）、管盒（Gold－box）封装 以及 基板芯片（CoC）之外 的其他应用提供优化配置。

MRSI Systems（Mycronic集团）宣布在其位于深圳龙华的姐妹公司，深圳市轴心自控技术有限公司工厂建立一项新的演示能力。我们将根据客户的样品材料，安排并提供我们市场领先的MRSI－HVM3产品的本地演示以及芯片贴装应用。

MRSI系统公司（Mycronic集团）推出MRSI－H3TO新型3微米高速贴片机，这是业界第一款可以真正满足多晶片和多流程的要求，可实现行业领先的贴片速度、卓越的灵活性以及为未来产品准备的3微米贴片精度。 MRSI－H3TO专为WDM与EML－TO或其他多晶片多流程TO－can光电器件量身打造，以支持即将普及的5G无线网络。

STOCKHOLM, Aug 29, 2018 — MRSI Systems (Mycronic Group) is launching the MRSI-H3TO, a new 3 micrometer high speed die bonder which will be the first of its kind to address the multi-die and

MRSI系统公司（Mycronic集团）推出MRSI－H3LD新型3微米高速贴片机，专用于大功率半导体激光器中的芯片贴片，广泛应用于工业激光器、光纤放大、光源和传感器等先进光电子应用。

STOCKHOLM, Nov 9, 2018 — MRSI Systems (Mycronic Group) announces new demonstration capability at its sister company, Shenzhen Axxon Automation (Mycronic Group) facility in the Longhua district,

News die-bonding

We are thrilled to announce our presence at SEMICON West in its dynamic new location—Phoenix, AZ. Experience firsthand the future of die bonding, active alignment, fluid and epoxy dispensing as

MRSI is pleased to announce the presentation of its latest innovation, the MRSI-LEAP Die Bonder, at the China International Optoelectronic Expo (CIOE) in Shenzhen, taking place from September 10th

The International Microwave Symposium (IMS) is an annual conference for professionals in the microwave and RF industry.

The MRSI-A-L machine is a versatile optical active alignment platform suitable for a wide range of applications, including lens, fiber and other optical components active alignment.

The rapid adoption of artificial intelligence is driving advancements in optical interconnect technology, resulting in notable improvements in speed, power efficiency, and cost reduction. This

In the fast-paced world of photonics manufacturing, having the right tools can make all the difference. The MRSI-H1 is designed to meet the demands of high-volume production with its

The 2025 Optical Fiber Communications Conference and Exhibition (OFC) is back to solidify its status as the premier global event for optical networking and communications. 

MRSI Mycronic will be participating in several optical and device packaging exhibitions. We invite you to attend these upcoming events. We look forward to discussing our latest product

die-bonding MRSI-705 with wafer, conveyor Versatile package handling capabilities: dewar and beyond In today's fast-paced production environments, efficiency and versatility are key. The MRSI-705

die-bonding Epoxy Dispenser The Next Generation MRSI-175Ag Epoxy Dispenser is now available In the fast-paced world of advanced packaging and semiconductor manufacturing, precision and efficiency

Last year, MRSI Systems launched the MRSI-705HF high force die bonder, a new version of the trusted MRSI-705 that is perfect for sintering and thermocompression bonding applications.

MRSI Mycronic is proud to sponsor the 7th Annual Automotive LIDAR Conference, taking place online from November 20-21, 2024.

The MRSI-705 has established itself as a reliable tool in the aerospace, defense, and medical industries, playing a crucial role in mission-critical tasks due to its performance, adaptability,

MRSI’s die bonding systems are designed to address the challenges of chip packaging with a focus on efficiency, precision, and productivity. These systems feature an advanced, patented

The optical components industry demands highly precise and customized equipment for complex optical assembly processes. We have answered this need with our new active aligner - a high-performance

In the bustling world of technology, May was a month marked by significant events, and MRSI was at the forefront. With appearances at IMAPS New England in Boxborough, MA, and the 2024

Designing and manufacturing electronic components destined for defense applications entails navigating a landscape of exacting standards. These standards demand unparalleled reliability, minimal

In the November/December 2023 issue of Chip Scale Review, MRSI delves into the fascinating world of automotive light detection and ranging (LiDAR) technology. This article explores the parallels

The MRSI-H1 family of 1-micron flip-chip die bonders stands out as an advanced ultra-precision solution.