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For detailed Data Sheets please contact Sales. The MRSI-HVM product family has proved to be the best-in-class die bonder with leading speed, zero-time tool change between dies, and <1.5 micron

For detailed Data Sheets please contact Sales. The MRSI-705 5-Micron Flip-Chip Die Bonder sets the mark for high-precision, high-speed component assembly within a flexible, configurable platform.

All the power of the MYPro I series 3D AOI for heavyweight board inspection.

PI Pico - 3D SPI Brochures Contact PI series 3D SPI brochure and specifications High accuracy and repeatability 3D SPI with auto-programming Clear and simple inspection control Clarity and

PI Primo - 3D SPI Brochures Contact PI series 3D SPI brochure and specifications Clear and simple inspection control Clarity and simplicity are words rarely associated with the complex process of

MY300LX pick-and-place Agilis™ - The most efficient feeding system Brochures Contact Mycronic’s modular Agilis™ component feeding system is designed for accuracy, ease of use and convenience. It

S3 S3 Description Specification Brochures Services The S3 is able to test 10 µm structures while achieving 100 measurements per second. The machine, therefore, provides the customer with an

A9a plus A9a plus Description Specification Brochures Services Contact The A9a plus is utilizing the same technology as the A9a and is in addition equipped with a temperature control unit and 4

A7-16 Pro A7-16 Pro Description Brochures Specification Services Contact The A7 Pro is also available with 16 test heads and with a large test area of 24" x 39.4". Teh A7-16 Pro benefitting

All the power of the MYPro I series 3D AOI in dual lane configuration.

For detailed Data Sheets please contact Sales. The MRSI-S-HVM submicron die bonding solution for silicon photonics, co-packaging, and wafer-level packaging

High flexibility 3D AOI for high-mix production with AI-assisted programming.

The MYTower 7+ is Mycronic’s tallest component storage system, measuring at 3.03 m, with a capacity of 1,148 reels.

Mycronic can offer long-term financing of 3 to 5 years, at less than market rates. With very competitive fixed interest rates, your investment in quality PCB assembly equipment can be realized

Built for world-class photomasks. 

A9 A9 Flying Probe PCB Test System Description Specification Brochures Services Contact The A9 is our fastest PCB test system with a new powerful drive technology and granite base to ensure high

One versatile platform. Twice the possibilities. MYPro series MY700TM Jet Printer and Dispenser MYPro series MY700TM  Jet Printer and Dispenser Specifications March 2022 Precision printing.

Precision printing. High-speed jet printer and solder paste PCB printing, surface mount soldering dispenser for a wide range of assembly fluids.

For detailed Data Sheets please contact Sales. The MRSI-H family provides proven superior flexibility for true multi-die, multi-process, multi-product high volume high mix production.

MYPro A40SX pick-and-place Agilis™ - The most efficient feeding system Brochures Contact Mycronic’s modular Agilis™ component feeding system is designed for accuracy, ease of use and convenience.

High-performance 3D AOI for high-productivity production.

One versatile platform. Twice the possibilities. MYPro series MY700TM Jet Printer and Dispenser MYPro series MY700TM  Jet Printer and Dispenser Specifications March 2022 Precision printing.

Mycronic’s largest component storage system capable of storing 2,468 reels in less than 2 m². The same height as the MYTower 6 and MYTower 6+, but is equipped with a new storage technology

MYD10/10i in-line dispenser Brochure Contact us Brochure MYD Ball screw drive in-line dispensers The compact MYD10 enables highly advanced non-contact jetting for enhanced dispensing uniformity,

Millions of high-precision dots. The MY700 Jet Printer makes it possible to handle the most challenging boards and components with micrometer accuracy, maximum speed and perfect quality solder

S2-8 / S2-8 plus S2-8 / S2-8 plus Description Specification Brochures Services Contact The Substrate product line is characterized by outstanding test head technology for the needs of substrate

LM1000 LM1000 Description Brochures Specification Services Contact The LM1000 is a highly precise compact and fully automated step tester for the electrical test of HDI bare boards in mass

A7 Pro A7 Pro Description Brochure Specifications Services Contact us The newly launched A7 Pro is building on the success of the A7 tester but is now equipped with a fast internal Ethernet 1GB/s

A7XW Pro A7XW Pro Description Specification Services Contact Our unique rail concept allows a high test head density on even the largest boards, minimizing the test time for large products with

MYPro S20 - stencil printer Intelligent vision and 2D inspection Brochure Contact MYPro S series brochure MYPro S series specifications High accuracy meets high flexibility In the MYPro S series,