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Mer om Mycronic Mycronic is a global high-tech company whose innovative solutions have been advancing electronics technology for over 40 years. Om oss Mycronic är en global ledare som

Delårsrapport januari-september 2014 Tredje kvartalet juli-september 2014 Orderingången uppgick till 842 (232) MSEK Nettoomsättningen uppgick till 338 (220) MSEK Rörelseresultatet

I N B J U D A N - Press- och analytikerträff Mycronic presenterar resultatet för tredje kvartalet och delårsperioden januari-september 2014 Datum: Tisdagen den 28 okt 2014 Tid: 09.00

Lär dig mer om våra vetenskapsbaserade klimatmål Våra två vetenskapsbaserade klimatmål på kort sikt har godkänts av Science Based Target-initiativet. I följande

Redeye - Tidig leverans utav Mycronics Detta är en kort uppdatering med anledning av Mycronics pressmeddelande om ändrad helårsprognos på grund av tidigare leverans av den

die-bonding CN zh-Hans Shanghai New International Expo Centre (SNIEC) Laser World of Photonics China LASER World of PHOTONICS CHINA 2026 Asia’s largest trade fair for the photonics industry in

die-bonding MY en MITEC, Kuala Lampur, Malaysia SEMICON Southeast Asia 2026 SEMICON Southeast Asia 2026 We are happy to be exhibiting at SEMICON Southeast Asia. Visit MRSI Mycronic Booth #2119.

International Microelectronics Assembly and Packaging Society (IMAPS) New England 52nd Symposium & Expo.

A9XL A9XL Flying Probe PCB Test System Description Specification Brochures Services Contact The A9XL is the latest model of our A9 product family based on our A9 test head technology with a new

MYPro Create Multi-machine programming for electronics manufacturers A single interface and workflow MYPro Create makes multi-machine programming a lot smoother and paves the way for future

MY300HX pick-and-place Agilis™ - The most efficient feeding system Brochures Contact Mycronic’s modular Agilis™ component feeding system is designed for accuracy, ease of use and convenience. It

One versatile platform. Twice the possibilities. MYPro series MY700TM Jet Printer and Dispenser MYPro series MY700TM  Jet Printer and Dispenser Specifications March 2022 Millions of

The MYCenter Analysis dashboard software provides actionable data to increase utilization, reduce reject rates and improve line balancing in real time.

MYD50 in-line dispenser Brochure Brochure MYD Linear motor drive in-line dispensers For higher-precision applications such as complex chip packaging, the powerful MYD50 platform further boosts

Millions of high-precision dots. The MY700 Jet Printer makes it possible to handle the most challenging boards and components with micrometer accuracy, maximum speed and perfect quality solder

The all-in-one solder paste and assembly fluid solution. MY700JX allows you to combine operator-independent solder paste jet printing with high-speed jet dispensing of adhesives, UV materials,

The new Prexision series setting the global standards for displays. 

A5 Neo Flying Probe Test System For Rigid and Flexible Boards. 

For detailed Data Sheets please contact Sales. The MRSI-HVM product family has proved to be the best-in-class die bonder with leading speed, zero-time tool change between dies, and <1.5 micron

All the power of the MYPro I series 3D AOI for heavyweight board inspection.

All the power of the MYPro I series 3D AOI in dual lane configuration.

PI Pico - 3D SPI Brochures Contact PI series 3D SPI brochure and specifications High accuracy and repeatability 3D SPI with auto-programming Clear and simple inspection control Clarity and

PI Primo - 3D SPI Brochures Contact PI series 3D SPI brochure and specifications Clear and simple inspection control Clarity and simplicity are words rarely associated with the complex process of

MY300LX pick-and-place Agilis™ - The most efficient feeding system Brochures Contact Mycronic’s modular Agilis™ component feeding system is designed for accuracy, ease of use and convenience. It

S3 S3 Description Specification Brochures Services The S3 is able to test 10 µm structures while achieving 100 measurements per second. The machine, therefore, provides the customer with an

A9a plus A9a plus Description Specification Brochures Services Contact The A9a plus is utilizing the same technology as the A9a and is in addition equipped with a temperature control unit and 4

A7-16 Pro A7-16 Pro Description Brochures Specification Services Contact The A7 Pro is also available with 16 test heads and with a large test area of 24" x 39.4". Teh A7-16 Pro benefitting

For detailed Data Sheets please contact Sales. The MRSI-S-HVM submicron die bonding solution for silicon photonics, co-packaging, and wafer-level packaging

For detailed Data Sheets please contact Sales. The MRSI-705 5-Micron Flip-Chip Die Bonder sets the mark for high-precision, high-speed component assembly within a flexible, configurable platform.

High flexibility 3D AOI for high-mix production with AI-assisted programming.