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MRSI Systems is Exhibiting at SPIE Photonics West
SPIE Photonics West will be held at the Moscone Center in San Francisco, CA from Jan 27-Feb 1. This is the flagship event for companies in the photonics.
High-power Laser Diode Manufacturing Challenges
This excerpt from MRSI Systems featured article in Laser Focus World highlights the HPLD industry manufacturing challenges and a die bonding solution to address these challenges:
Microelectronics
MRSI Systems has been a leading supplier to assembly houses and OEMs involved with hybrid assembly die bonding systems for more than 40 years.
MRSI Systems Receives Funding from State of Massachusetts for Advanced Manufacturing Initiative
Billerica, Mass., Oct, 6, 2017 – MRSI Systems, a leading manufacturer of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems, has been awarded new funding by the
MRSI Systems Training Services
Learn more about MRSI's training services including on-site training and software training videos. Contact Us.
MRSI Systems 热烈欢迎贺尉宗出任中国区销售总监
MRSI Systems(Mycronic Group)很高兴地宣布贺尉宗(Hendry He)担任我们的中国区销售总监。他将与现有的销售团队及销售代表一起工作,并作为中国区销售代表服务市场,工作地点为上海。Hendry在半导体设备方面拥有丰富的技术知识以及销售经验。结合Hendry对中国市场的庞大网络的掌握Hendry的加入将进一步提高我们对客户需求的响应能力。
MRSI Systems welcomes Hendry He as China Country Sales Director
MRSI Systems (Mycronic Group) is pleased to announce our new China Country Sales Director, Hendry He. He will be working alongside the existing sales team and representatives in the region and is
MRSI receives Laser Focus World Innovators Award for HVM die bonder
MRSI Systems (Mycronic Group) a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2019 Silver Honoree for
MRSI Systems wins Silver Honoree for Laser Focus World Innovators Award 2023
die-bonding Laser Focus World Innovators Award 2023 MRSI Systems wins Silver Honoree for Laser Focus World Innovators Award 2023 MRSI Systems, a part of Mycronic Group, a leading manufacturer of
MRSI Launches New MRSI-H3LD Die Bonder Targeted at the High Power Diode Laser Market
MRSI Systems (Mycronic Group), is launching the MRSI-H3LD, a new 3 micrometer high speed die bonder, optimized for bonding large dies for high power diode lasers, that are used in advanced
MRSI Systems Provides MRSI-M3 Die Bonding Assembly Work Cell to Fabrinet in Silicon Valley for Fast Prototyping and New Product Introduction
North Billerica, MA, USA, May 24, 2016 — MRSI Systems, a leading provider of fully automated, ultra-precision die bonding and epoxy dispensing systems, today announces supply of its flagship
新机发布|MRSI(Mycronic集团)发布创新MRSI-A-L耦合设备,引领精密光学组件封装新纪元
MRSI Systems (a part of Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, proudly introduces the MRSI-A-L
MRSI Systems’ New Product MRSI-HVM3 Die Bonder Has Entered Volume Production Driven by Fast and Wide Customer Adoptions
NORTH BILLERICA, Mass., March 6, 2018 – MRSI Systems, a leading provider of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems is pleased to announce that our
Join MRSI Mycronic at IMAPS New England in May!
die-bonding MRSI Mycronic IMAPS New England 2025 Join MRSI Mycronic at IMAPS New England in May! MRSI Mycronic will be exhibiting, sponsoring, and presenting at the IMAPS New England event on May
MRSI-705HF 5 micron high force die bonder won the award for “Infostone 2023 Optical Communication Most Competitive Equipment
On December 28, 2023, MRSI (Mycronic Group) received the “Infostone 2023 Optical Communication Most Competitive Equipment” award for the MRSI-705HF 5 micron high force die bonder at the First
MRSI Support for Application Specific Pickup Tip Designs
The MRSI-705 features an innovative design with a versatile thirteen-position tool bank for quick, automatic tool changes. Enhanced functionality is achieved with additional tool change banks,
MRSI Mycronic to Sponsor and Exhibit at the 2025 Chiplet Summit
In January 2025, MRSI Mycronic will sponsor and exhibit at the prestigious Chiplet Summit. This event gathers global leaders in semiconductor technology to discuss innovations in chiplet design
Join MRSI at IMS in San Diego
The International Microwave Symposium (IMS) is an annual conference that brings together the brightest minds in the microwave and RF industry. This year's event will take place in San Diego, CA,
Optimizing Die Bonding with Planarity Control: Ensuring Precision in Device Attachment Across Industries
Achieving precise and reliable die bonding is crucial in numerous industries, especially when demanding a high degree of parallelism between bonding surfaces.
Learn why the MRSI-705 is an industry leader in flexibility and reliability
The MRSI-705 5-micron flip-chip die bonder has the largest installed base in photonics packaging, microwave modules, RF power amplifiers, infrared sensors, and medical devices.
4 Recent Topics in Advanced Packaging
Innovation and new market factors are driving advanced packaging. In this post, we highlight some of the trending topics propelling advanced packaging.
MRSI Systems Participated in MIT Microphotonics Center / AIM Photonics Spring Technical Meeting in Cambridge
In March 2017, MRSI Systems participated in The MIT Microphotonics Center and AIM Photonics Spring Meeting for Integrated Photonics Manufacturing Meeting.
Hybrid Electronics Technology for Printed Lighting
die-bonding Hybrid Electronics Technology for Printed Lighting Several members of the MRSI Systems’ team attended the February iMAPS New England-SMTA Boston Technical presentation by Dr. Adam
2017 Optical Fiber Communication Conference and Exhibition (OFC) Highlights
die-bonding 2017 Optical Fiber Communication Conference and Exhibition (OFC) Highlights MRSI Systems is a frequent participant at OFC. OFC gave us an opportunity to meet with our customers and
How one Mycronic engineer is building a ‘lean’ production culture to radically boost output
Discover how Carl Jacobsson, Group Production Manager at Mycronic in Täby, Sweden, revolutionizes production by implementing a ‘lean management’ approach. Learn about waste reduction,
Kallelse till årsstämma i Mycronic AB (publ)
Aktieägarna i Mycronic AB (publ), org. nr 556351-2374, kallas härmed till årsstämma onsdagen den 7 maj 2025, kl. 17:00 i bolagets lokal på Nytorpsvägen 9 i Täby.
Ersättningar till VD och andra ledande befattningshavare
Ersättningar till VD och andra ledande befattningshavare Principer för ersättningar till verkställande direktören och andra ledande befattningshavare fastställs av årsstämman.
Delårsrapport januari-juni 2025
Delårsrapport januari-juni 2025 Andra kvartalet Orderingången uppgick till 1 330 (2 125) MSEK, en minskning med 37 procent Nettoomsättningen ökade med 35 procent till 2 066 (1
Organisation
Mycronics organisation, anställda från olika divisioner på huvudkontoret Täby. Vår verksamhet bedrivs i fyra divisioner Organisation Med huvudkontor i Sverige är vi en
Prenumerera på IR-nyheter
Prenumerera på IR nyheter Här kan du anmäla dig för att prenumerera på IR-nyheter och kontinuerligt få företagsinformation såsom pressmeddelanden och rapporter