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In March 2017, MRSI Systems participated in The MIT Microphotonics Center and AIM Photonics Spring Meeting for Integrated Photonics Manufacturing Meeting.

die-bonding Hybrid Electronics Technology for Printed Lighting Several members of the MRSI Systems’ team attended the February iMAPS New England-SMTA Boston Technical presentation by Dr. Adam

die-bonding 2017 Optical Fiber Communication Conference and Exhibition (OFC) Highlights MRSI Systems is a frequent participant at OFC. OFC gave us an opportunity to meet with our customers and

North Billerica, MA, USA, May 24, 2016 — MRSI Systems, a leading provider of fully automated, ultra-precision die bonding and epoxy dispensing systems, today announces supply of its flagship

NORTH BILLERICA, Mass., March 6, 2018 – MRSI Systems, a leading provider of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems is pleased to announce that our

Billerica, Mass., Oct, 6, 2017 – MRSI Systems, a leading manufacturer of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems, has been awarded new funding by the

MRSI Systems（Mycronic Group）很高兴地宣布贺尉宗(Hendry He)担任我们的中国区销售总监。他将与现有的销售团队及销售代表一起工作，并作为中国区销售代表服务市场，工作地点为上海。Hendry在半导体设备方面拥有丰富的技术知识以及销售经验。结合Hendry对中国市场的庞大网络的掌握Hendry的加入将进一步提高我们对客户需求的响应能力。

MRSI Systems (Mycronic Group) is pleased to announce our new China Country Sales Director, Hendry He. He will be working alongside the existing sales team and representatives in the region and is

MRSI Systems (Mycronic Group) a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2019 Silver Honoree for

die-bonding Laser Focus World Innovators Award 2023 MRSI Systems wins Silver Honoree for Laser Focus World Innovators Award 2023 MRSI Systems, a part of Mycronic Group, a leading manufacturer of

MRSI Systems (Mycronic Group), is launching the MRSI-H3LD, a new 3 micrometer high speed die bonder, optimized for bonding large dies for high power diode lasers, that are used in advanced

MRSI Systems (Mycronic Group) has opened the doors to their new “Product Demo Center” in Shenzhen, China. The new demo center is in the Huahan Innovation Office Park in the Nanshan District of

On December 28, 2023, MRSI (Mycronic Group) received the “Infostone 2023 Optical Communication Most Competitive Equipment” award for the MRSI-705HF 5 micron high force die bonder at the First

The MRSI-705 features an innovative design with a versatile thirteen-position tool bank for quick, automatic tool changes. Enhanced functionality is achieved with additional tool change banks,

In January 2025, MRSI Mycronic will sponsor and exhibit at the prestigious Chiplet Summit. This event gathers global leaders in semiconductor technology to discuss innovations in chiplet design

The International Microwave Symposium (IMS) is an annual conference that brings together the brightest minds in the microwave and RF industry. This year's event will take place in San Diego, CA,

Experience MRSI Systems at the IMAPS device packaging conference in Fountain Hills, Arizona. MRSI excitedly sponsors the 19th Annual Device Packaging Conference that will be held March 13th-16th

Achieving precise and reliable die bonding is crucial in numerous industries, especially when demanding a high degree of parallelism between bonding surfaces.

The MRSI-705 5-micron flip-chip die bonder has the largest installed base in photonics packaging, microwave modules, RF power amplifiers, infrared sensors, and medical devices.

MRSI Systems has been a leading supplier to manufacturers of advanced optical packaging assembly for over 30 years. This has enabled MRSI to build unmatched expertise in the assembly technologies

Customers require an application-specific specialized die bonder for HVM of CoS that is able to deliver high speeds while maintaining flexibility.

When it comes to epoxy dispensing your vendor system must offer the ultimate flexible platform for demanding environments. The epoxy dispenser should meet the highest standards of reliability and

摘要：（第三届）激光雷达前瞻技术展示交流会于2021年12月14日-12月15日在江苏苏州举办。MRSI Systems战略市场高级总监，周利民博士出席2021（第三届）激光雷达前瞻技术展示交流会并发表“车载激光雷达光器件封装的挑战与解决方案”的演讲。

摘要：由中国国际光电博览会(CIOE)提议设立的”中国光电博览奖“，MRSI Systems携最新的MRSI-HVM 1.5微米系列产品参评，成功入围“中国光电博览奖”。MRSI-HVM-P项目属于高端光电子封装自动化技术领域，广泛用应于当下高密度高速率的数据中心光互联和骨干网络传输用的400G +光电器件，以及5G无线应用的复杂DFB / WDM / EML TO-can TOSA /

On January 11, 2022, the Infostone 2022 Annual meeting and the 8th Heroes List awards ceremony were held. Infostone announced the 8th heroes company list, which is classified into four

This excerpt from MRSI Systems featured article in Laser Focus World highlights the HPLD industry manufacturing challenges and a die bonding solution to address these challenges:

MRSI Mycronic is exhibiting at the 57th International Symposium on Microelectronics from October 1-2, 2024, in Boston, MA. The event will take place at the Encore Boston Harbor from October 1-3,

MRSI will be exhibiting at the 48th exhibition of ECOC in Basel, Switzerland from September 19-21st.

ID: 80388 | Version: 1 | Published: 2023-02-06 Whistleblower policy Mycronic strives to maintain an open business climate and to uphold high ethical standards. To identify and manage risks early,

Presentation year-end report 2023 Presentation of Mycronic's year-end report January-December 2023   Watch the presentation here