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The Versatile MRSI-HVM

2021 was a great year for our best-selling product, the MRSI-HVM 1.5 micron high-speed die bonder. This system meets the needs of many industries from telecom, datacom and medical devices

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MRSI presented at the 20th Infostone Optical Communication Market and Technology Conference (IFOC)

Dr. Limin Zhou, Senior Director of Strategic Marketing, MRSI Systems presented “Integrated Photonics Devices Volume Manufacturing Challenges & Innovative Solutions” at the 20th Infostone

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Visit MRSI at SPIE Photonics West 2022

Meet with MRSI Systems in San Francisco

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Visit MRSI at IMAPS Device Packaging in Arizona

MRSI is attending and sponsoring the 18th Annual IMAPS Device Packaging Conference and Exhibition.

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Remuneration to the CEO

Remuneration Remuneration to the CEO and other senior executives The principles for remuneration to the CEO and other senior executives are approved by the Annual General Meeting. The proposed

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Governance

Learn more about Mycronic’s corporate governance. Find out how we divide responsibilities and read our corporate governance reports and articles of association.

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Committees

Committees Nomination committee Audit committee Remuneration committee Nomination committee The Audit committee is appointed by the Board and consists of three Board members. Remuneration

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Capital markets day 2022

Capital markets day 2022 Presentation and all videos from Mycronic's Capital markets day 2022  Mycronic's presentation on Capital markets day 2022 (pdf) Full version of Capital Markets

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Presentation year-end report 2022

Presentation year-end report 2022 Presentation of Mycronic's year-end report January-December 2022 Presentation year-end report 2022 Presentation of Mycronic's year-end report January-December

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Presentation year-end report 2023

Presentation year-end report 2023 Presentation of Mycronic's year-end report January-December 2023   Watch the presentation here  

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Interim Report Q3 2023

Interim Report Q3 2023 Presentation of Mycronic's interim report January-September 2023 Interim report January-September 2023 Presentation Q3 report

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Interim report Q2 2023

Interim Report Q2 2023 Presentation of Mycronic's interim report January-June 2023 Interim report January-June 2023 Presentation Q2 report

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What is the Future of Optoelectronics Packaging?

Innovation in wireless technology leads to faster and smarter networks. 5G and the Internet of Things (IoT) have the capacity to connect everyone & devices.

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Applied Plasma

Atmospheric Plasma Solutions for Critical Surface Preparation Powering the future of clean manufacturing Surfx, a Mycronic Group company, develops advanced atmospheric plasma systems that

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Photonic Interconnects

Our machines and materials Software and Technology Always one photon ahead – with industry ready 3D nano-printing and a full solution portfolio for Photonic Integration Based on its globally

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MRSI Automation (Shenzhen) Co., Ltd.

MRSI Automation (Shenzhen) Co., Ltd. 101, Building B, Han's Innovation Tower 9018 Beihuan Avenue, Nanshan District 518057 Shenzhen Guangdong Province China +86 755 26414155 MRSI Automation

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Mycronic Sweden HQ

Mycronic Sweden HQ Mycronic headquarter in the winter Mycronic AB Nytorpsvägen 9 Box 3141 183 03 Täby Sweden +46 8 638 52 00 +46 8 638 52 90 Google maps search Mycronic Taby Yes, please

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Vanguard Automation GmbH

Vanguard Automation GmbH Gablonzer Strasse 10 76185 Karlsruhe Germany +49 721 5966 063 – 0 https://maps.app.goo.gl/8C44wc9j6zrRtUgZ9

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Multiple Die Eutectic Bonding

Eutectic bonding is used as an alternative to epoxy bonding. The choice of eutectic bonding is determined by the application and the technical requirements.

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How to Choose a Die Bonding System

Leading optoelectronic and semiconductor packaging companies require fully automated, ultra-precision die bonding systems

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Epoxy Die Bonding of Ultra Small Ceramic Capacitors

As consumers expect more power and more bandwidth from their devices, we see the Advanced Electronic Packaging industry under continuing pressure to cram more technology into smaller spaces. One

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Optoelectronics Packaging

MRSI Systems has been a leading supplier to manufacturers of advanced optical packaging assembly for over 30 years. This has enabled MRSI to build unmatched expertise in the assembly technologies

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Epoxy Deposition – Requirement for High-Volume Manufacturing (HVM) of Chip-on-Submount (CoS)

Customers require an application-specific specialized die bonder for HVM of CoS that is able to deliver high speeds while maintaining flexibility.

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How to Choose an Epoxy Dispenser

When it comes to epoxy dispensing your vendor system must offer the ultimate flexible platform for demanding environments. The epoxy dispenser should meet the highest standards of reliability and

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Dr. Limin Zhou to present at the 22nd Infostone Optical Communication and Market Technology Conference (IFOC 2024)

Mark your calendars for September 9-10, 2024, at the InterContinental Hotel of the Shenzhen World Exhibition and Convention Center in Shenzhen, China, which hosts the highly anticipated Infostone

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The Japanese version of MRSI’s article “Die-bonder innovations target HPLD manufacturing challenges” is now available

MRSI’s article in Laser Focus World’s February 2020 Issue “Die-bonder innovations target HPLD manufacturing challenges” discusses the die bonding challenges of High-power laser diodes (HPLDs)

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Join us at IMAPS in Boston!

MRSI Mycronic is exhibiting at the 57th International Symposium on Microelectronics from October 1-2, 2024, in Boston, MA. The event will take place at the Encore Boston Harbor from October 1-3,

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Join MRSI Mycronic at the China International Optoelectronic Exposition (CIOE)

MRSI is proud to be exhibiting and presenting at the 25th China International Optoelectronic Exposition this year in Shenzhen. Stop by our booth #10B79 to learn more about how MRSI products meet

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High-Volume Manufacturing (HVM) of Photonics Devices – Success Requires Expertise in Eutectic Bonding of Chip on Submount (CoS)

die-bonding High-Volume Manufacturing (HVM) of Photonics Devices – Success Requires Expertise in Eutectic Bonding of Chip on Submount (CoS) In this post we examine the critical manufacturing

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Trends, Challenges and Opportunities for High Volume Manufacturing of Photonic Devices for Data Center Applications

There are many challenges that photonic device suppliers are facing in the current market. As part of IEEE’s Tech Insider Webinar Series, MRSI Systems recently delivered a presentation on high