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History

Learn about MRSI Systems, a MA die bonding and epoxy dispensing system manufacturer in MA.

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Why do customer's choose MRSI?

Learn about MRSI Systems capabilities and what helps MRSI stand apart from the competition in die bonder and epoxy dispensing system manufacturing.

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Thank you for contacting us regarding die bonding

Thank you for contacting us regarding die bonding

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Mycronic Sweden HQ

Mycronic Sweden HQ Mycronic headquarter in the winter Mycronic AB Nytorpsvägen 9 Box 3141 183 03 Täby Sweden +46 8 638 52 00 +46 8 638 52 90 Mycronic Täby Yes, please contact me

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Test Solution (Suzhou) Co. Ltd.

Test Solution (Suzhou) Co. Ltd. Mycronic atg Luther & Maelzer China, Suzhou Industrial Park Test Solution (Suzhou) Co. Ltd. Block 5 # 301, No.5 Xinghan Street Suzhou Industrial Park China +86

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Video gallery

MRSI Systems Video Gallery - See the latest eutectic bonding, die bonding, epoxy stamping, and epoxy die attach videos.

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News & events

News & events Events News Press releases Cases Technical articles archive Webinars Gallery Video gallery MRSI events Our future events & webinars. Our most recent news articles. Keep up to

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Image gallery

Check out the MRSI Systems gallery for images and videos of MRSI die bonding and epoxy dispensing systems available from MRSI Systems in MA.

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MRSI Systems Wins Years-Long Litigation Against Palomar Technologies By Invalidating Palomar’s “Double Pick” Patent

Chief Judge of federal court in Boston knocks out Palomar’s claim of infringement for its “double pick” patent allegedly covering a manufacturing process; court rules that claimed method is “so

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MRSI Files Patent Infringement Lawsuit Against Palomar Technologies

Taking action against what it asserts is pervasive and repeated infringement of four separate U.S. patents it owns, leading precision manufacturer MRSI Systems LLC has filed a patent infringement

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MRSI Systems 推出用于大批量生产光电子器件的高速贴片机

美国马萨诸塞州, August 14, 2017 – 全球领先的全自动、高精度、高速贴片和点胶系统制造商,MRSI Systems推出一款新型产品, MRSI-HVM3 高速贴片机,以支持光电子客户的大批量生产需求。目前,MRSI-HVM3 正在全面投产并发货至世界各地的客户。

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MRSI Systems Delivered 3-Micron Die Bonder MRSI-M3 to AIM Photonics Academy’s Education and Practice Factory at MIT in Cambridge for Research and Education

North Billerica, MA, USA, March 20, 2017 — MRSI Systems, a leading provider of fully automated, high-speed, high-precision die bonding and epoxy dispensing systems, today announces the

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MRSI Systems Launches High Speed Die Bonder for Photonics High Volume Manufacturing

BILLERICA, Mass., August 14, 2017 – MRSI Systems, a leading manufacturer of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems, is launching a new High Speed

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MRSI launches submicron die bonding solution for silicon photonics, co-packaging, and wafer-level packaging

At CIOE 2020 MRSI Systems will introduce a new product, MRSI-S-HVM high-speed, flexible 0.5 micrometer die bonder for silicon photonics, co-packaging.

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MRSI Systems推出用于新应用的MRSI-HVM3P新产品

die-bonding MRSI Systems推出用于新应用的MRSI-HVM3P新产品 MRSI Systems(Mycronic集团)8月20日在美国马萨诸塞州扩展其业界领先的MRSI-HVM3高速贴片机机平台,推出MRSI-HVM3P新款机型,为有源光缆(AOC)、管盒(Gold-box)封装 以及 基板芯片(CoC)之外 的其他应用提供优化配置。

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MRSI Systems Launches MRSI-HVM3P for New Applications Extending the MRSI-HVM3 Die Bonder Family

BILLERICA, Massachusetts, Aug. 29, 2018 — MRSI Systems (Mycronic Group), is expanding its leading high speed MRSI-HVM3 die bonder platform with the launch of the MRSI-HVM3P to offer

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MRSI Systems Announces Chinese Patent Issued Covering Die Placement Head with Turret

Mycronic Global Technologies Business Unit, MRSI Systems announces the recent issuance of utility patent titled “DIE PLACEMENT HEAD WITH TURRET” and numbered ZL 201680048482.5 (PCT/US2016/047135)

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MRSI Systems Acquires Die Bonding Business

BILLERICA, MA — January 31, 2014 — MRSI Systems, a developer and manufacturer of turnkey chip placement and dispensing systems, announced today it has completed a leveraged buyout of assets from

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MRSI Named in the 2019 Infostone Top Honors List in China, with the MRSI-HVM Series Receiving the Award for the Most Competitive Product for Optical Communications

MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed die bonding and dispensing systems, has been recognized in the list of 2019 Infostone top

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Advanced Photonics Applications – MRSI-H-LD

Designed for high-volume manufacturing of advanced photonics and RF / Microwave devices the MRSI-H-LD 1.5 micron die bonder delivers industry-leading speed without sacrificing ultra-high

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MRSI to present at IFOC and Exhibit at CIOE in September in Shenzhen including live product demos

MRSI Systems will present at the 19th Infostone Optical Communications Conference(IFOC), organized by Infostone Communication Consultant. The event will take place in Shenzhen, China from September

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LASER World of PHOTONICS CHINA 2020

MRSI will exhibit at LASER World of PHOTONICS CHINA 2020 from July 3-5, 2020 in Hall 8, Booth #8.1E416 of the National Exhibition and Convention Center (NECC), in Shanghai, China. There will be

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MRSI’s August 2020 Laser Focus World Featured Article: Assembly solution addresses TO-can photonic device manufacturing challenges

In this week’s blog post we highlight our recent Laser Focus World published article on the challenges of new TO-can photonic device manufacturing.

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Laser Focus World Featured Article – Die-bonder innovations target HPLD manufacturing challenges

MRSI’s latest article in Laser Focus World’s February Issue “Die-bonder innovations target HPLD manufacturing challenges” discusses the die bonding challenges of High-power laser diodes (HPLDs)

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Join MRSI at the International Microwave Symposium

The world’s largest Microwave and RF industry event is being held virtually this year. 

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Meet with MRSI Systems at Photonics West in San Francisco

die-bonding Meet with MRSI Systems at Photonics West in San Francisco EXHIBITION PASS Meet with MRSI Systems in San Francisco Booth #4585 Learn about our latest technology at this FREE event.

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SEMICON West 2020 Virtual Event

MRSI Systems invites you to SEMICON West 2020 Virtual Event from July 20-23, 2020.

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Interview with MRSI Systems Dr. Limin Zhou: MRSI Die Bonders support the fast growth of the optical communication market

During 2021 CIOE in Shenzhen, China, Infostone, interviewed Dr. Limin Zhou, Senior Strategic Marketing Director of MRSI Systems (Mycronic Group) to discuss MRSI’s latest product developments and

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MRSI Systems (Mycronic Group) delivered a keynote speech at the 2022 CFOL Optical Interconnection Conference and MRSI-H-HPLD+ 1.5 micron Die Bonder won the Award for “2022 CFOL Product Innovation”

Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems (Mycronic Group) and General Manager of MRSI Automation (Shenzhen) Co., Ltd., was invited to participate in the 2022 CFOL

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Invitation to MRSI Webinar: MRSI is presenting at the 2022 ATC Webinar on Vehicle LIDAR Manufacturing

Abstract: on March 17th, 2022, Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems (Mycronic group) and General Manager of MRSI Automation (Shenzhen) Co., Ltd., is invited to