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Advanced Packaging for Heterogeneous Integration

Advanced heterogeneous integration for 3-D IC packaging, e.g., chiplet, and optoelectronics packaging requires high-precision die bonders that can perform many different processes, such as

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Join us at IMAPS in San Diego!

MRSI Systems, Mycronic Group will be exhibiting at the 56th International Symposium on Microelectronics from October 3-4th, 2023 in San Diego, CA. This year's Symposium will feature 5

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MRSI Air-Knife Needle Cleaning System

MRSI recently introduced the air-knife vacuum system for cleaning epoxy dispense needles and it is now a standard feature on all MRSI dispense systems.

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Visit MRSI at SEMICON West in San Francisco

SEMICON West, the premier event for the semiconductor industry, is set to take place on July 11-13th, 2023 in San Francisco, CA.

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How Does MRSI Systems Manufacture to Customer’s Specification?

MRSI Systems thinks from the customer’s perspective and upholds strict protocols to ensure your desired configuration, has been built to proper specification. MRSI’s core value of acting like an

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MRSI will be attending and sponsoring IMAPS Boston 2022

MRSI Systems, Mycronic Group will be exhibiting at the 55th International Symposium on Microelectronics from October 4-5th in Boston Massachusetts at the Hynes Convention Center.

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Learn more about how MRSI solves RF PA device manufacturing challenges

MRSI’s fully automated die bonding solutions help RF power amplifier device manufacturers to address manufacturing requirements and challenges. To learn more about how MRSI’s solutions support

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MRSI presented at the 12th China International Nanotechnology Industry Expo

The 12th China International Nanotechnology Industry Expo was held in Suzhou, Jiangsu Province from October 27th to 29th, 2021. Dr. Limin Zhou, Senior Director of Strategic Marketing, MRSI

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Visit MRSI at SEMICON West in San Francisco

MRSI is exhibiting at SEMICON West from December 7-9, 2021 at the Moscone Center, San Francisco, CA (Booth #1556). SEMICON West features hundreds of exhibitors, and thousands of attendees,

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MRSI Systems受邀出席光收发器和硅基光电子论坛

摘要:MRSI Systems战略市场高级总监,周利民博士受邀参加光收发器和硅基光电子论坛并将带来主题为“光收发器和硅基光电子量产的挑战及解决方案”的演讲。

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Irving Wang joins MRSI – Product Marketing

Irving Wang joined MRSI this year as the Director of Product Marketing. He is based in the US to spearhead MRSI’s push into the sub-micron market and to support our newly launched MRSI-S-HVM

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IMAPS 2020 Virtual Exhibition

MRSI is exhibiting at the 53rd International Symposium on Microelectronics from October 6-8th, 2020. Visit the MRSI Virtual Booth to chat with our team of technical experts to review our exciting

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MRSI’s August 2020 Laser Focus World Featured Article: Assembly solution addresses TO-can photonic device manufacturing challenges

In this week’s blog post we highlight our recent Laser Focus World published article on the challenges of new TO-can photonic device manufacturing.

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LASER World of PHOTONICS CHINA 2020

MRSI will exhibit at LASER World of PHOTONICS CHINA 2020 from July 3-5, 2020 in Hall 8, Booth #8.1E416 of the National Exhibition and Convention Center (NECC), in Shanghai, China. There will be

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Laser Focus World Featured Article – Die-bonder innovations target HPLD manufacturing challenges

MRSI’s latest article in Laser Focus World’s February Issue “Die-bonder innovations target HPLD manufacturing challenges” discusses the die bonding challenges of High-power laser diodes (HPLDs)

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Meet with MRSI Systems at Photonics West in San Francisco

die-bonding Meet with MRSI Systems at Photonics West in San Francisco EXHIBITION PASS Meet with MRSI Systems in San Francisco Booth #4585 Learn about our latest technology at this FREE event.

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IMAPS Boston 2019 – Highlights

die-bonding IMAPS Boston 2019 – Highlights MRSI Systems has been a member and proud supporter of IMAPS for more than 30 years and was pleased to sponsor the exhibition at the 2019 IMAPS

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Dr. Yi Qian, MRSI Systems: Automated Die Bonding Trends in the 5G Era

9月4日-7日,全球极具规模及影响力的光电产业综合性展会——第21届中国国际光电博览会(简称光博会/CIOE)在深圳会展中心举办。作为全球光电器件自动化贴片封装设备的领军企业,MRSI Systems(Mycronic Group)与CYCAD Century Science and Technology携手亮相本次光博会,并重点展出MRSI-H、MRSI-HVM等系列产品与最新技术。

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Visit MRSI Systems Demonstration Center in Shenzhen – Mycronic Facility

MRSI Systems, a leading manufacturer of fully automatic, high-speed, high-precision, flexible and multi-functional die bonding systems, demonstration capability was officially opened at the

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Challenges and Solutions for Bonding Ultra-Small Ceramic End-Terminated Capacitors

Electronic components and packages continue the trend of miniaturization which drives demand for cost-effective assembly solutions for smaller components and packages. This is happening in end

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MRSI Systems is Exhibiting and Sponsoring SPIE Photonics West 2019

MRSI Systems will be exhibiting at SPIE Photonics West, held at the Moscone Center in San Francisco, CA, USA from February 5-7, 2019.

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MRSI Systems Supports “Advancing Innovation in Photonics”

die-bonding MRSI Systems Supports “Advancing Innovation in Photonics” Background MRSI Systems is a community member of AIM (American Institute of Manufacturing) Photonics and the local Photonics

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Fully Automated Die Bonding Systems — The Importance of Proper Lighting

Lighting is an important component of any vision recognition system. When it comes to lighting, it is not a case of “one size fits all.”

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Advanced Vision Systems

Increasing demand for data and bandwidth requires high-volume manufacturing of photonics and RF electronics at a level we have never seen before.

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MRSI North America

MRSI North America MRSI Systems, LLC 554 Clark Road MA 01876 Tewksbury USA +1 978 667 9449 MRSI Systems, 554 Clark Road MA 01876 Tewksbury USA Contact us

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Our sustainability impact

As a global supplier of production equipment to the electronics industry, Mycronic strives to act responsibly throughout its value chain. Our sustainability impact As a global supplier of

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Certificates

Certificates At Mycronic we are committed to working in a systematic, consistent, and efficient way to achieve our goals and create value for our customers and stakeholders. We are constantly

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Consensus Estimates

Consensus estimates The consensus estimates are provided by Modular Finance and are based on forecasts from analysts following Mycronic. The analysts’ opinions, forecasts, and estimates regarding

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Auditor

AGM elects the company's auditors. Auditor The AGM elects the company's auditors. At the 2024 AGM, the auditing company Ernst & Young AB was re-elected as auditor for the period up until

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Contact

Contact Investor Relations Sven Chetkovich Director Investor Relations E-mail: helloir@mycronic.com Phone: +46 70 558 39 19