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On-site training
MRSI offers a comprehensive set of training programs covering our family of products. Contact MRSI Systems to learn more about On-Site Training.
Prototyping and Training Services
We provide prototyping and small batch die bonding services for our customers to shorten your time to market.
MRSI-S-HVM Submicron Die Bonder won the award for “Infostone 2020 The Most Competitive Optical Communications Product”
MRSI Systems (Mycronic Group), submicron die bonder MRSI-S-HVM won the award for "The Most Competitive Optical Communications Product in 2020." The MRSI-S-HVM submicron die bonder was recognized
MRSI launches submicron die bonding solution for silicon photonics, co-packaging, and wafer-level packaging
At CIOE 2020 MRSI Systems will introduce a new product, MRSI-S-HVM high-speed, flexible 0.5 micrometer die bonder for silicon photonics, co-packaging.
MRSI将出席第18届ICCSZ OC市场与技术研讨会,并在CIOE提供贴片演示
MRSI Systems(Mycronic Group)赞助由ICCSZ举办的第18届光纤通讯市场暨技术专题研讨会,研讨会将于9月2日至3日在中国深圳举行。同期,中国国际光电博览会(CIOE)于2019年9月4日至7日在中国深圳隆重召开。
MRSI发布为硅光器件、协同封装和晶圆级封装提供亚微米级贴片解决方案
ICC讯 在CIOE 2020,MRSI SYSTEMS将推出一款新产品,高速、灵活的0.5微米 MRSI-S-HVM 贴片机,为硅光器件,协同封装的电子和光子芯片,以及晶圆级封装应用提供解决方案。
MRSI宣布MRSI-H / HVM系列贴片机精度提升至1.5微米
MRSI Systems(Mycronic Group)很高兴宣布公司MRSI-H / HVM系列产品线的最新进展。MRSI使用行业标准玻璃芯片参考样品测试放置精度,测试结果显示,产品精度从3Sigma的±3微米增强至±1.5微米。该产品从2019年10月1日发货开始,产品名称改为MRSI-H和MRSI-HVM(之前称为MRSI-H3和MRSI-HVM3)。
MRSI Systems Welcomes Dr. Limin Zhou as Senior Director of Strategic Marketing
MRSI Systems, part of the Mycronic Group is pleased to announce the appointment of Dr. Limin Zhou as the Senior Director of Strategic Marketing to expand MRSI’s market presence in China. He will
MRSI launches new Die Bonder with improved throughput for high power laser manufacturers
MRSI Systems (Mycronic Group) is pleased to announce the introduction of MRSI-H-HPLD+, the latest advancement in the MRSI-H/HVM-series product line. This new variant of the successful
MRSI Systems Acquires Die Bonding Business
BILLERICA, MA — January 31, 2014 — MRSI Systems, a developer and manufacturer of turnkey chip placement and dispensing systems, announced today it has completed a leveraged buyout of assets from
MRSI Systems Delivered 3-Micron Die Bonder MRSI-M3 to AIM Photonics Academy’s Education and Practice Factory at MIT in Cambridge for Research and Education
North Billerica, MA, USA, March 20, 2017 — MRSI Systems, a leading provider of fully automated, high-speed, high-precision die bonding and epoxy dispensing systems, today announces the
Join us in March!
March will be a busy month for device packaging exhibitions. Please join MRSI Mycronic at these upcoming events. We hope to see you there to discuss our latest new product innovations. Learn more
Jon Medernach to retire after a triumphant twenty years at MRSI Systems
After over 40 years of a successful capital equipment sales career, Jon Medernach will be hanging up his hat and enjoying retirement at the end of the month. As we bid farewell to Jon, our North
The High-Performance and Flexible MRSI A-L for Optical Assembly
The optical components industry demands highly precise and customized equipment for complex optical assembly processes. We have answered this need with our new active aligner - a high-performance
Die bonding solution for Chip-on-Submount (CoS) – Excerpt from our LFW article
Excerpt from MRSI’s recent article emphasizes the CoS die bonding process requirements including geometric placement accuracy & void free eutectic bonding.
Dr. Yi Qian, MRSI Systems: Automated Die Bonding Trends in the 5G Era
The arrival of 5G marks a new era for the manufacturing supply chain. This transformation presents new challenges for die bonding and packaging processes. As a leader in the automated packaging
Interview with MRSI Systems Dr. Limin Zhou: MRSI Die Bonders support the fast growth of the optical communication market
During 2021 CIOE in Shenzhen, China, Infostone, interviewed Dr. Limin Zhou, Senior Strategic Marketing Director of MRSI Systems (Mycronic Group) to discuss MRSI’s latest product developments and
Visit MRSI Systems at the European Conference on Optical Communications (ECOC) 2018 – Fully Automated Die Bonders
Visit MRSI Systems’ Booth (#577) to learn about our new die bonder product launches.
Dispensing and coating
Dispensing & coating dispensing-and-coating
Health & safety policy
ID: 80400 | Version: 3 | Published: April 15, 2024 Mycronic group health and safety policy Mycronic is committed to providing a safe, healthy environment for employees, consultants and all those
Presentation Q3 report 2022
Presentation Q3 report 2022 Presentation of Mycronic's Q3 report January-September 2022 Interim report January-September 2022 Presentation Q3 report
Strengthening ties from Shanghai to Täby
Jason Dong, a pattern generator expert at Mycronic, moved from China to Sweden for a two-year assignment at the company’s headquarters.
Adding new ideas to the mix
Discover how Per Carlqvist, director of Pick and Place R&D, found his dream job at Mycronic. Read about Per's experience working with advanced electronics technology and living in Japan.
Science Based Targets for sustainable innovation
Learn how Mycronic, a leader in electronics, is reducing greenhouse gas emissions through Science-Based Targets. Discover the impact of aligning with climate science and the Paris Agreement.
"The success of SLX is about people and technology along with the trust of our customers."
"The success of SLX is about people and technology along with the trust of our customers." What is the success behind the SLX series, and.. what is a mask writer? Charlott Samuelsson, Senior
Future engineers through diversity
Discover how Mycronic inspires children and high school students to pursue a career in engineering and solve real-world problems with technology.
Half a century of navigating a fast-changing electronics industry
We transform customer needs into leading market products. Video: Half a century of navigating a fast-changing electronics industry For more than 50 years, Mycronic has brought life-changing
High Volume Manufacturing of Photonic Devices: Assembly Starts with Design
The explosive growth of internet traffic demands higher bandwidth in data communications. High volume manufacturing of photonic devices is crucial.
Highlights of the Microelectronics Symposium
The 51st International Symposium on Microelectronics was held at the Pasadena Convention Center in Pasadena, California this month. This symposium is the premier event for microelectronic
MRSI Systems to Exhibit MRSI-H-LD at Productronica
MRSI Systems is a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems, and will be exhibiting at Productronica from November 12-15, 2019