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The richest smt software suite in the industry. Provides fully integrated applications covering the entire chain Enhance your productivity of SMT assembly.

SMT Solutions PCB assembly solutions Case stories Mycronic offers advanced PCB assembly solutions to help streamline the manufacturing process. Our solutions are designed with precision and

Mycronic China Shanghai, China Mycronic Co., Ltd (Shanghai Office) Unit 1002, 10th floor, E Block Lane 168, Da Duhe Road Putuo District, 200062 Shanghai P.R. China +86 21 3252 3785/86 +86 21 3252

Mycronic Saint-Egrève Mycronic France, Saint-Egrève Rue Albert Einstein BATIMENT 8 38120 Saint-Egrève France +33 4 7675 8565 Mycronic, Saint-Egrève, France Yes, please contact

Accelerating R&D cycles and expanding product mix in China

pcb-assembly A strong 30-year partnership Two-in-one solution for precision and efficiency Zero downtime, 30% reduction in rework Ease of installation and programming  A technological marvel 

pcb-assembly ESCATEC in brief How ESCATEC accelerates new product cycles and boosts yields with the MY700 Design freedom at jet speed At the ESCATEC facility in Switzerland, new products are

21st century industries demand 21st century manufacturing solutions. With the help of the latest 3D automated optical inspection systems, MSL Circuits – an ALL Circuits company, is helping

For Allelektronik in southern Sweden, the new MYCenter Analysis dashboard came as a real eye-opener. Having spent more than a decade optimizing production for a single customer, Production

How do you quantify the benefits of automation? Twenty percent higher production volume with the original base of operators is a good start.

Mycronic’s jet printing, dispensing, coating and plasma technologies make it possible to solve any dispensing or conformal coating challenge.

Protecting electronics assemblies are growing in complexity. Capability, versatility and precision are key.

MYCare Services Superior service for superior performance Service & support Our MYCare service offering for our advanced Pattern Generators is a key part of our commitment to our customers.

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Taking a proactive, customer-centric approach with your new colleages Taking a proactive, customer-centric approach Meet your new colleagues We always go to great lengths to ensure each customer

What we offer to our team members About us at Bareboard testing Flexible working time models with flextime accounts Additional social benefits: anniversary bonuses, commuting expenses, group

Career Available jobs About us Apprenticeship program See your future opportunities here See your future opportunities here. What we offer. Education for future industrial clerks, technical

Apprenticeship program Are you interested in an apprenticeship in an international company? At atg Luther & Maelzer in Wertheim, we offer apprenticeship programs for future industrial clerks,

Learn more about MRSI's 5 micron die bonders.

MRSI Systems Video Gallery - See the latest eutectic bonding, die bonding, epoxy stamping, and epoxy die attach videos.

Learn more about MRSI's 1 micron die bonders.

News & events Events News Press releases Cases Technical articles archive Webinars Gallery Video gallery Our future events & webinars. Our most recent news articles. Keep up to date with our

bare-board-testning atg Luther & Maelzer exhibit at CPCA 2024 This year's CPCA trade fair took place from 13 to 15 May 2024 at the National Exhibition Center in Shanghai. More than 700

MRSI Systems（Mycronic集团）宣布在其位于深圳龙华的姐妹公司，深圳市轴心自控技术有限公司工厂建立一项新的演示能力。我们将根据客户的样品材料，安排并提供我们市场领先的MRSI－HVM3产品的本地演示以及芯片贴装应用。

In the fast-paced world of photonics manufacturing, having the right tools can make all the difference. The MRSI-H1 is designed to meet the demands of high-volume production with its

In the bustling world of technology, May was a month marked by significant events, and MRSI was at the forefront. With appearances at IMAPS New England in Boxborough, MA, and the 2024

die-bonding Epoxy Dispenser The Next Generation MRSI-175Ag Epoxy Dispenser is now available In the fast-paced world of advanced packaging and semiconductor manufacturing, precision and efficiency

MRSI’s die bonding systems are designed to address the challenges of chip packaging with a focus on efficiency, precision, and productivity. These systems feature an advanced, patented

Over three decades, MRSI Systems has developed a family of high precision eutectic die bonders for high volume manufacturing of optoelectronics.

TESAT’s challenge was to develop an “Automated Microwave Factory” to manufacture complex highly integrated LTCC microwave modules within the frequency range 2 to 77GHz, 24 hours per day including