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Solutions
Photomask solutions Large area measurement meet the world's most accurate metrology system New increasing demands on LCD displays Making every pixel count in smartphone display Large area
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Contact us Visit our contact page for contact details.
Mycronic Mexico
Mycronic Mexico Mycronic in Plaza Epicentra, San Juan de Ocotan, Mexico Carretera Guadalajara-Tepic No. 7355 – 308 Plaza Epicentra Z.C. 45019 San Juan de Ocotan Zapopan, Jalisco Mexico Carr.
US Application Center
US Application Center 1450 Koll Circle 95112 San Jose CA USA Yes, please contact me
Axxon Europe B.V.
Axxon Europe B.V. High Tech Campus 10 5656 AE Eindhoven Netherlands Yes, please contact me
Fixture based test systems
Grid test systems Fixture based test systems LM1000 LM1000 The LM1000 is a highly precise compact step tester for the electrical test of HDI bare boards in mass production. We offer highly
Silicon Photonics
Learn more about Silicon Photonics from MRSI Systems who is a leading supplier to manufacturers of advanced optical assembly for over 40 years.
Applications
Learn more about MRSI Systems Applications including Microelectronics, Microwave & RF as well as Photonics and Sensors.
Photonics
Learn more about photonics bonding from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 40 years.
MRSI Systems Training Services
Learn more about MRSI's training services including on-site training and software training videos. Contact Us.
High Power Laser Diodes
Learn more about High Power Laser Diodes from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 40 years.
Prototyping
Meet with our experienced Applications Engineers to learn more about how to develop and design processes. We can also help to test the process for you on our industry-leading die bonders.
Die bonding
Die bonding is as old as the semiconductor industry itself. From the onset, integrated circuits or ICs were developed using four levels of interconnections.
Eutectic die bonding
Eutectic die bonding, sometimes referred to as eutectic die attach, is a die bonding technique used for devices that require enhanced heat dissipation.
Epoxy die bonding
Epoxy die bonding, sometimes referred to as epoxy die attach, is the most widely used die bonding technique in semiconductor assembly.
RF Power Amplifier & Microwave Device
Learn more about RF Power Amplifiers and Microwave Device from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 4o years.
Microelectronics
MRSI Systems has been a leading supplier to assembly houses and OEMs involved with hybrid assembly die bonding systems for more than 40 years.
LIDAR, AR/VR/MR
Learn more about LiDAR, AR/VR/MR from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 40 years.
Microwave & RF
Microwave and RF packages from MRSI Systems who has been a leading supplier of High Frequency, Ultra High Frequency components for over 40 years.
Wafer Level Packaging
Explore the transformative potential of wafer-level packaging in microelectronics and learn how this cost-effective solution enhances performance, reliability, and versatility across industries.
Processes
Processes Die bonding Epoxy die bonding Eutectic die bonding MRSI Die Bonder MRSI Die Bonding MRSI Eutectic Die Bonding Die Bonding
Sensors
The photonics sensor and detectors market is growing rapidly, which encourages application of photonics sensor technology into several industries areas such as manufacturing, defense &
MRSI Systems, LLC Files Patent Infringement Lawsuit Against Suzhou LieQi in China
MRSI Systems, LLC (a part of Mycronic Group), a global high-tech company that provides high precision production solution in electronics industry, filed a patent infringement lawsuit against
MRSI-S-HVM亚微米贴片机荣获“讯石2020年度光通信最具竞争力产品”
摘要:MRSI Systems, Mycronic Group的MRSI-S-HVM亚微米贴片机荣获“2020年度光通信最具竞争力产品”奖,代表了MRSI-S-HVM亚微米贴片机?获得行业专家评审团的一致认可与高度评价。
MRSI improves accuracy to 1.5 micrometers for MRSI-H/HVM-Series die bonders
MRSI Systems (Mycronic Group) is pleased to announce the latest advancement in the MRSI-H/HVM-series product line. Placement accuracy was tested using industry-standard glass die reference
MRSI Systems 热烈欢迎贺尉宗出任中国区销售总监
MRSI Systems(Mycronic Group)很高兴地宣布贺尉宗(Hendry He)担任我们的中国区销售总监。他将与现有的销售团队及销售代表一起工作,并作为中国区销售代表服务市场,工作地点为上海。Hendry在半导体设备方面拥有丰富的技术知识以及销售经验。结合Hendry对中国市场的庞大网络的掌握Hendry的加入将进一步提高我们对客户需求的响应能力。
MRSI Systems welcomes Hendry He as China Country Sales Director
MRSI Systems (Mycronic Group) is pleased to announce our new China Country Sales Director, Hendry He. He will be working alongside the existing sales team and representatives in the region and is
MRSI receives Laser Focus World Innovators Award for HVM die bonder
MRSI Systems (Mycronic Group) a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2019 Silver Honoree for
MRSI Systems wins Silver Honoree for Laser Focus World Innovators Award 2023
die-bonding Laser Focus World Innovators Award 2023 MRSI Systems wins Silver Honoree for Laser Focus World Innovators Award 2023 MRSI Systems, a part of Mycronic Group, a leading manufacturer of
MRSI,Mycronic中国深圳新的产品演示中心正式成立
MRSI Systems(Mycronic Group)目前已经在中国深圳正式创建了新的产品演示中心,该产品演示中心落成于深圳市南山区朗山路华瀚创新园。