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Join MRSI at ECOC 2023 – The European Conference on Optical Communication

MRSI is excited to announce we will be exhibiting at the 49th exhibition of ECOC in Glasgow, Scotland from October 2-4, 2023.

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Mastering the Art of Handling Delicate High Aspect Ratio Dies: Challenges and Solutions

Handling delicate, large aspect ratio, and thin dies is essential across various applications, including RF Power, Optical, and MEMS. These devices have aspect ratios exceeding 45 to 1,

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Dr. Limin Zhou to present at the CHIP China Conference

Dr. Limin Zhou, General Manager, MRSI Automation (Shenzhen) Co., Ltd., Senior Director of Strategic Marketing, MRSI Systems will present “Discussion on New Challenges and Solutions of Chip

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Manufacturing Automation Case Study – Flexible High-Speed Die Bonding Automation Platform

The following excerpt from MRSI Systems latest article published in Laser Focus World Magazine demonstrates how the latest advanced automated die bonding systems are transforming the world of

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MRSI to Sponsor and Exhibit at the International Microelectronics Assembly and Packaging Society (IMAPS) Symposium

MRSI (Mycronic Group) is exhibiting at the 54th International Symposium on Microelectronics from October 11-14, 2021, in San Diego, California at the Town and Country Resort.

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MRSI will exhibit and present at the Automotive LIDAR 2020 Virtual Conference and Exhibition

MRSI Mycronic is exhibiting at the Automotive LIDAR 2020 Conference and Virtual Exhibition from September 22-24th, 2020. See the conference agenda for more details. Visit the MRSI virtual booth

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Visit MRSI Systems at SEMICON China 2019 in Shanghai

MRSI Systems is exhibiting at SEMICON China in Shanghai, March 20-22, 2019, at the Shanghai New International Expo Centre. Please stop by the CYCAD Century Science & Technology Booth #2567.

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2017 International Microwave Symposium Highlights

Thank you to all who stopped by the MRSI booth at the International Microwave Symposium to discuss microwave RF package applications.

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MRSI Mycronic to Present at Automotive LIDAR 2022

Join us at the 5th annual Automotive LIDAR conference and exhibition from September 20-22nd. Automotive LIDAR is the only conference to be primarily focused on automotive LIDAR technologies and

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MRSI to present at LaserFocusCon 2022

We are pleased to announce that MRSI will be exhibiting at this year’s LaserFocusCon in Suzhou, China on August 30th. Dr. Limin Zhou, Senior Director, Strategic Marketing, MRSI Systems, Mycronic

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MRSI to present and attend 4th LiDAR Tech 2022

MRSI will attend the 4th LiDAR Tech Forum taking place from November 16-18, 2022 in Suzhou, China. This event will focus on market trends, technological breakthroughs, and practical applications

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ECTC San Diego 2022 Highlights

The 2022 Electronics Components and Technology Conference in San Diego was a tremendous success. We would like to thank everyone who attended the conference and to those who stopped by our booth

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Smarter growth in the SMT factory

What happens when business is growing, components are shrinking, and both staff and production space remain the same? A visit to Allelektronik shows that the answer lies in the thoughtful

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In-line dispensing

In-line dispensing MYD10/10i MYD50 MY700JD MYSmart in-line dispensing valves Brochure MYD The compact MYD10 enables highly advanced non-contact jetting for enhanced dispensing uniformity,

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A game changer in high-speed jet printing

Fast, flexible jet printing with dual-head MY700 tech.

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Excellence in the workplace and strong partnerships: DF Elettronica's success story

pcb-assembly Excellence in the workplace and strong partnerships DF Elettronica's success story Italy based DF Elettronica gives us insight to their business and what makes them stand out as

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Contact

Contact us pcb-assembly SMT after hour support SMT after hour support is available for customers with service agreements. Please use the following number if your local service office is closed.

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Mycronic Mexico

Mexico Mycronic in Plaza Epicentra, San Juan de Ocotan, Mexico Carretera Guadalajara-Tepic 7355 – 308 Plaza Epicentra 45019 San Juan de Ocotán Zapopan, Jalisco Mexico Carr. Guadalajara - Tepic

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Mycronic Sweden HQ

Mycronic Sweden HQ Mycronic headquarter in the winter Mycronic AB Nytorpsvägen 9 Box 3141 183 03 Täby Sweden +46 8 638 52 00 +46 8 638 52 90 Mycronic, Täby, Sweden Yes, please contact

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Mycronic USA

Mycronic USA Mycronic, USA, Tewksbury Mycronic Inc 554 Clark Road MA 01876 Tewksbury USA +1 (978) 948-7378 Mycronic, Tewksbury, USA Yes, please contact me

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Automated flying probe for PCB test

Automated flying probe for PCB test A7a Pro A9a A9a plus A9aL The automated A7a Flying Probe Test System provides highest flexibility. The fully automated A9a, 8-head, double-sided, high-speed,

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Flying ahead in Michigan with Calumet

Flying ahead in Michigan with Calumet When American industry brings tomorrow’s electronics to life, it often starts with a printed circuit board (PCB) or substrate from Michigan-based Calumet

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Fixture based test systems

Grid test systems Fixture based test systems LM1000 LM1000 The LM1000 is a highly precise compact step tester for the electrical test of HDI bare boards in mass production. We offer highly

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About us

About us atg Luther & Maelzer a part of Mycronic group. We are specialists in the development, manufacture, and sale of test systems for bare printed circuit boards.  atg LM About us Mycronic

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MRSI to exhibit with live demonstrations and present at LASER World of PHOTONICS CHINA

die-bonding MRSI to exhibit with live demonstrations and present at LASER World of PHOTONICS CHINA We are pleased to announce that MRSI, Mycronic Group will be exhibiting at LASER World of

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MRSI launches new die bonders with improved accuracy

die-bonding MRSI launches new die bonders with improved accuracy MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and

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Press releases

Find the MRSI Systems Press Releases Archives here. Here you will be able to access all of the documents at which you may need to take a look.

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What is the Future of Optoelectronics Packaging?

Innovation in wireless technology leads to faster and smarter networks. 5G and the Internet of Things (IoT) have the capacity to connect everyone & devices.

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Challenges in High-Volume Manufacturing for Die Attach Systems

Increasing demand for high-volume manufacturing accelerates the continuing adaptation of full automation in advanced eutectic packaging.

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VPT Components and MRSI Systems jointly address manufacturing challenges

Learn more about how VPT Components and MRSI Systems jointly address manufacturing challenges.