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Solutions Flying ahead in Michigan with Calumet A9a Mycronic is providing its latest Flying Probe electrical testing system.

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Fully automatic high accuracy die bonders that are capable of epoxy and eutectic die bonding are the lifeblood of the modern semiconductor industry.

Learn more about MRSI's 1.5 micron die bonders.

Under the MRSI brand, we leverage over 40 years of industry expertise in high-accuracy die bonders, active aligners, and fluid dispensers to deliver unparalleled reliability and precision for

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MRSI is now offering an extensive library of software training videos for your MRSI die bonding and epoxy dispensing systems. Contact MRSI to learn more.

Chief Judge of federal court in Boston knocks out Palomar’s claim of infringement for its “double pick” patent allegedly covering a manufacturing process; court rules that claimed method is “so

MRSI Systems (Mycronic Group) will exhibit at the 23rd China International Optoelectronic Exposition (CIOE) at the Shenzhen World Exhibition & Convention Center from September 16-18, 2021. MRSI

ICC讯 在IMAPS 2020上，MRSI Systems推出了新型5微米贴片机产品，面向量产配置的MRSI-705。MRSI-705于2012年首次推出，在贴片机行业中处于领先地位，可在一台机器上为客户提供多种应用解决方案。MRSI-705新的配置提供了创新的水平转塔功能，可以在不牺牲灵活性，准确性和可靠性的前提下，显著提高机器的速度和生产率。

die-bonding CIOE 2023 MRSI Booth MRSI Mycronic to showcase and present innovative die bonder solutions at CIOE 2023 MRSI, a part of Mycronic Group, will exhibit our family of die bonders and

Boston, MA – December 10, 2020 – MRSI Systems, LLC and Palomar Technologies, Inc. jointly announce they have reached a confidential agreement that settles all litigation currently pending between

die-bonding

Taking action against what it asserts is pervasive and repeated infringement of four separate U.S. patents it owns, leading precision manufacturer MRSI Systems LLC has filed a patent infringement

BILLERICA, Mass., August 14, 2017 – MRSI Systems, a leading manufacturer of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems, is launching a new High Speed

MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2022 Silver Honoree for the

2019年2月13日–全球领先的半导体系统设备制造商Mycronic集团的子公司，MRSI Systems今日荣幸宣布，光电子资深专家周利民博士将加入公司团队并担任战略营销高级总监，负责拓展MRSI Systems在中国的市场影响力。周博士在光电子行业拥有的丰富专业知识，以及他在中国市场的知名度将有助于推动MRSISystems市场战略布局，制定清晰的产品路线图，以及增强MRSI

MRSI系统公司（Mycronic集团）推出MRSI－H3LD新型3微米高速贴片机，专用于大功率半导体激光器中的芯片贴片，广泛应用于工业激光器、光纤放大、光源和传感器等先进光电子应用。

MRSI Systems宣布“DIE PLACEMENT HEAD WITH TURRET”(集成水平转塔之芯片贴装头)已获得中国专利授权。迈康尼全球技术部的业务部门-MRSI Systems宣布，中华人民共和国国家知识产权局(CNIPA)已于2021年7月30日授权MRSI Systems 申请的“DIE PLACEMENT HEAD WITH

BILLERICA, Massachusetts, Aug. 29, 2018 — MRSI Systems (Mycronic Group), is expanding its leading high speed MRSI-HVM3 die bonder platform with the launch of the MRSI-HVM3P to offer

STOCKHOLM, Nov 9, 2018 — MRSI Systems (Mycronic Group) announces new demonstration capability at its sister company, Shenzhen Axxon Automation (Mycronic Group) facility in the Longhua district,

MRSI Mycronic will be participating in several optical and device packaging exhibitions. We invite you to attend these upcoming events. We look forward to discussing our latest product

The MRSI-705 has established itself as a reliable tool in the aerospace, defense, and medical industries, playing a crucial role in mission-critical tasks due to its performance, adaptability,

In the November/December 2023 issue of Chip Scale Review, MRSI delves into the fascinating world of automotive light detection and ranging (LiDAR) technology. This article explores the parallels

At the exhibition, MRSI will provide live product demos of the recently launched MRSI-H-HPLD+, a new variant of the successful MRSI-H-HPLD that is tailored for high-power laser die attachment

In the world of chip packaging and advanced die bonding, the pursuit of efficiency, accuracy, and productivity is a continuous endeavor. MRSI’s die bonding systems offer a cutting-edge patented

If you are looking to pick from tape and do not have a tape and real feature on your machine, then we have a solution for you. The two inch metal tape holder can accommodate four two-inch strips

MRSI Mycronic is proud to sponsor the 7th Annual Automotive LIDAR Conference, taking place online from November 20-21, 2024.

The rapid adoption of artificial intelligence is driving advancements in optical interconnect technology, resulting in notable improvements in speed, power efficiency, and cost reduction. This

Last year, MRSI Systems launched the MRSI-705HF high force die bonder, a new version of the trusted MRSI-705 that is perfect for sintering and thermocompression bonding applications.