Sök
Two ways our MRSI Systems Machines offer efficiency and productivity to our customers
Jack Inocencio, the Sr. Manager of Applications and Service, extended some conducive knowledge on why MRSI System’s products will accelerate photonics manufacturers’ efficiency and
MRSI Systems is excited to launch our free software training video program!
MRSI has produced immersive software training videos to optimize your company’s experience with our cutting-edge die bonding and epoxy dispensing systems. MRSI wants the acquisition of our
Improve pick and place machine utilization by keeping dies in their places
die-bonding Improve pick and place machine utilization by keeping dies in their places A lot of dies are presented to die bonders in waffle packs and there is a common issue of component out of
MRSI’s heated head die bonder targets High-Density Photonic Devices
The Global deployment of 5G and the exponential growth of data centers is driving the demand for high-performance optical devices.
MRSI to exhibit at the European Microwave Week in Milan
MRSI Systems welcomes you to the European Microwave Exhibition! This event is the largest trade show that is dedicated to Microwave and RF in Europe. It will be held from September 27th-29th in
Visit MRSI at IMAPS Device Packaging in Arizona
MRSI is attending and sponsoring the 18th Annual IMAPS Device Packaging Conference and Exhibition.
MRSI Systems received the 2021 CIOE Silver Award for the MRSI-HVM Die Bonder
MRSI Systems won the China Optoelectronics Expo Award (CIOE Award) for the latest MRSI-HVM 1.5 micron series of products. The MRSI-HVM with conveyor is an outstanding innovation, widely used in
The Versatile MRSI-HVM
2021 was a great year for our best-selling product, the MRSI-HVM 1.5 micron high-speed die bonder. This system meets the needs of many industries from telecom, datacom and medical devices
MRSI presented at the 20th Infostone Optical Communication Market and Technology Conference (IFOC)
Dr. Limin Zhou, Senior Director of Strategic Marketing, MRSI Systems presented “Integrated Photonics Devices Volume Manufacturing Challenges & Innovative Solutions” at the 20th Infostone
MRSI Shenzhen Demo Center grand opening ceremony
On August 8, 2021, MRSI Systems(Mycronic Group) held the grand opening of its Product Demonstration Center in Shenzhen, China. The opening ceremony was accompanied with a speech by local
Die bonding solution targets modern photonics manufacturing – building bricks for 5G rollout
5G continues to drive the needs of the Datacom supply chain which presents challenges to photonic device manufacturers. In this article featured in Laser Focus World, MRSI highlights the
Interview with MRSI: Accuracy is improved to 1.5 microns to meet the 5G and 400G high-speed interconnection era of optical device automated placement solution system
During the summer, China Fiber Optics Online (CFOL), interviewed Dr. Limin Zhou, Senior Strategic Marketing Director of MRSI Mycronic to discuss MRSI’s latest product development and some of the
MRSI solves one of the greatest challenges in modern photonics manufacturing
MRSI’s latest article in the July 2020 issue of Laser Focus World highlights a flexible die bonding solution for modern photonics manufacturing.
High Volume Manufacturing of Photonic Components and Modules
Increasing demand for data and bandwidth requires high volume manufacturing (HVM) of photonics devices. This expansion with double-digit growth rates...
MRSI Systems – IEEE Tech Insider Webinar: The Challenges in High Volume Manufacturing of Photonic Devices for Data Center Applications
die-bonding MRSI Systems – IEEE Tech Insider Webinar: The Challenges in High Volume Manufacturing of Photonic Devices for Data Center Applications Internet traffic has been growing at an
International Microelectronics Assembly and Packaging Society (IMAPS) Symposium 2018
MRSI Systems is exhibiting at the 51st International Symposium on Microelectronics from October 8-11, 2018 in Pasadena, California at the Pasadena Convention Center.
Building Complex Hybrid Circuits-Advanced Packaging
Complex Hybrid Circuits are used in a variety of high reliability applications including military, aerospace, medical, and photonics. MRSI offers dispense and die bonding solutions specifically
Optical Fiber Conference and Exposition (OFC) 2018 – San Diego
The exhibition is from March 13th-March 15th. Visit the MRSI Systems’ Booth #4444 at OFC 2018. Enjoy a free “Exhibits Plus Pass” Compliments of MRSI Systems.
MRSI Systems’ Exceptional Customer Support
die-bonding MRSI Systems’ Exceptional Customer Support After the sale, the real test of a quality business is what happens next. What happens if I have a problem? Can you reach a human being
Visit MRSI Systems at Productronica 2017 in Munich, Germany
die-bonding Visit MRSI Systems at Productronica 2017 in Munich, Germany Productronica is the world’s leading international trade fair for innovative electronics production. The
MRSI Systems’ Sales Team – Jon Medernach
Jon is a strong proponent of relationship selling and believes in the importance of customer advocacy within MRSI by providing the customer a voice.
MRSI Participated in the 2017 Electronic Components and Technology Conference(ECTC)
“MRSI Systems was glad to exhibit at the Technology Corner, attend the technical conference, and meet customers at ECTC this year again."
iMAPS New England 44th Symposium and Expo: “The Jetsons 2017”
The International Microelectronics Assembly and Packaging Society New England Chapter’s Symposium will be held in Boxborough, MA on May 2nd, 2017.
ECTC – The 67th Electronic Components and Technology Conference
MRSI Systems is exhibiting at the 67th ECTC focused on the global microelectronics packaging industry.
Mycronic Sweden HQ
Mycronic Sweden HQ Mycronic headquarter in the winter Mycronic AB Nytorpsvägen 9 Box 3141 183 03 Täby Sweden +46 8 638 52 00 +46 8 638 52 90 Google maps search Mycronic Taby Yes, please
Supplier Code of Conduct for Service Providers and non-critical Suppliers
ID: 80566 | Version: 3 | Published: May 08, 2025 Mycronic group Supplier Code of Conduct for Service providers and non-critical Suppliers The purpose of this Supplier Code of Conduct for Service
Diversity, equity & inclusion policy
ID: 80401 | Version: 2 | Published: April 12, 2023 Mycronic group diversity, equity and inclusion policy Mycronic is committed to ensuring and cultivating a diverse, equitable and inclusive
Interim report Q2 2023
Interim Report Q2 2023 Presentation of Mycronic's interim report January-June 2023 Interim report January-June 2023 Presentation Q2 report
Presentation year-end report 2022
Presentation year-end report 2022 Presentation of Mycronic's year-end report January-December 2022 Presentation year-end report 2022 Presentation of Mycronic's year-end report January-December
One out of every two smartphones use dispensing technology from Mycronic’s High Volume division
One out of every two smartphones use dispensing technology from Mycronic's High Volume division Axxon, the core of Mycronic's High Volume division, is the leading supplier in the field of