Sök

pcb-assembly Available in the beginning of 2024 Mycronic’s stencil printing and jet printing platforms combine to produce any board at any speed. Printing without limits Business is growing for

pcb-assembly With the new MYPro I™ series 3D AOI Programming just got simpler Faster programming. Smarter guidance. Zero false calls. When it comes to advanced 3D AOI, demands are high and

pcb-assembly And this time, it’s vertical The connectivity continues Over the past year, Hermes compatibility has been added to a number of Mycronic’s SMT solutions. The next step is to extend

photomask-equipment City overnight view Connectivity’s role in making everyday life manageable during Covid-19 More virtual interactions, and the rise of a metaverse The pandemic is still

Bare board testing and Mycronic History Mycronic timeline from 1989 Bare board testing timeline June 2021 atg Luther & Maelzer is acquired by Mycronic. Oct 2018 Xcerra Corporation is acquired

The leading supplier of bare board test systems PCB and substrate test systems Manual flying probe for PCB test Flying probe for substrate test Automated flying probe for PCB test Fixture based

Service solutions Bareboard testing Bareboard spare parts, consumables & accessories We support you with our many years of experience and solutions that are tailored to your system and

bare-board-testning Berufsinformationstag in Wertheim-Bestenheid am 29.06.2024 Auch dieses Jahr ist die atg Luther & Maelzer GmbH mit einem Stand am Wertheimer Berufsinformationstag vertreten.

Find customer support information from MRSI Systems, how we can help you and how we go the extra mile to support our customers.

Learn more about MRSI systems products including the MRSI-S-HVM, MRSI-HVM, MRSI-H, MRSI-M3, MRSI-705 die bonders, high precision epoxy dispensing systems & active alignment & die bonding

Die bonding is as old as the semiconductor industry itself. From the onset, integrated circuits or ICs were developed using four levels of interconnections.

Eutectic die bonding, sometimes referred to as eutectic die attach, is a die bonding technique used for devices that require enhanced heat dissipation.

Epoxy die bonding, sometimes referred to as epoxy die attach, is the most widely used die bonding technique in semiconductor assembly.

The Challenges in High Volume Manufacturing of Photonic Devices for Data Center Applications. Watch the Webinar Recording.

摘要：MRSI Systems, Mycronic Group的MRSI-S-HVM亚微米贴片机荣获“2020年度光通信最具竞争力产品”奖，代表了MRSI-S-HVM亚微米贴片机?获得行业专家评审团的一致认可与高度评价。

MRSI Systems很高兴地宣布与Lumentum达成新合作("Lumentum"，纳斯达克代码:LITE)，Lumentum是汽车行业光子芯片和光模块的全球领导者。此次合作有望为该行业带来创新的激光雷达解决方案。

MRSI Systems(Mycronic Group)目前已经在中国深圳正式创建了新的产品演示中心，该产品演示中心落成于深圳市南山区朗山路华瀚创新园。

The emergence of two-and-a-half-dimensional (“2.5D”) and three-dimensional (“3D”) (collectively, “2.5D/3D”) integrated circuit packaging technology is creating another compelling opportunity for

Join MRSI at the upcoming Compound Semiconductor Advanced Technology and Application Conference (CSC) taking place on May 22-23, 2024, in Suzhou, China.

MRSI’s latest article in Chip Scale Review discusses the similarities and differences between automotive light detection and ranging (LiDAR) and optical transceivers are compared.

Jack Inocencio, the Sr. Manager of Applications and Service, extended some conducive knowledge on why MRSI System’s products will accelerate photonics manufacturers’ efficiency and

MRSI has produced immersive software training videos to optimize your company’s experience with our cutting-edge die bonding and epoxy dispensing systems. MRSI wants the acquisition of our

die-bonding Improve pick and place machine utilization by keeping dies in their places A lot of dies are presented to die bonders in waffle packs and there is a common issue of component out of

The Global deployment of 5G and the exponential growth of data centers is driving the demand for high-performance optical devices.

MRSI Systems welcomes you to the European Microwave Exhibition! This event is the largest trade show that is dedicated to Microwave and RF in Europe. It will be held from September 27th-29th in

MRSI is attending and sponsoring the 18th Annual IMAPS Device Packaging Conference and Exhibition.

MRSI Systems won the China Optoelectronics Expo Award (CIOE Award) for the latest MRSI-HVM 1.5 micron series of products. The MRSI-HVM with conveyor is an outstanding innovation, widely used in

2021 was a great year for our best-selling product, the MRSI-HVM 1.5 micron high-speed die bonder. This system meets the needs of many industries from telecom, datacom and medical devices

Dr. Limin Zhou, Senior Director of Strategic Marketing, MRSI Systems presented “Integrated Photonics Devices Volume Manufacturing Challenges & Innovative Solutions” at the 20th Infostone

On August 8, 2021, MRSI Systems(Mycronic Group) held the grand opening of its Product Demonstration Center in Shenzhen, China. The opening ceremony was accompanied with a speech by local