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bare-board-testning Berufsinformationstag in Wertheim-Bestenheid am 29.06.2024 Auch dieses Jahr ist die atg Luther & Maelzer GmbH mit einem Stand am Wertheimer Berufsinformationstag vertreten.

Die bonding is as old as the semiconductor industry itself. From the onset, integrated circuits or ICs were developed using four levels of interconnections.

Learn more about MRSI systems products including the MRSI-S-HVM, MRSI-HVM, MRSI-H, MRSI-M3, MRSI-705 die bonders, high precision epoxy dispensing systems & active alignment & die bonding

Eutectic die bonding, sometimes referred to as eutectic die attach, is a die bonding technique used for devices that require enhanced heat dissipation.

Epoxy die bonding, sometimes referred to as epoxy die attach, is the most widely used die bonding technique in semiconductor assembly.

Find customer support information from MRSI Systems, how we can help you and how we go the extra mile to support our customers.

The Challenges in High Volume Manufacturing of Photonic Devices for Data Center Applications. Watch the Webinar Recording.

MRSI Systems很高兴地宣布与Lumentum达成新合作("Lumentum"，纳斯达克代码:LITE)，Lumentum是汽车行业光子芯片和光模块的全球领导者。此次合作有望为该行业带来创新的激光雷达解决方案。

摘要：MRSI Systems, Mycronic Group的MRSI-S-HVM亚微米贴片机荣获“2020年度光通信最具竞争力产品”奖，代表了MRSI-S-HVM亚微米贴片机?获得行业专家评审团的一致认可与高度评价。

MRSI Systems(Mycronic Group)目前已经在中国深圳正式创建了新的产品演示中心，该产品演示中心落成于深圳市南山区朗山路华瀚创新园。

The emergence of two-and-a-half-dimensional (“2.5D”) and three-dimensional (“3D”) (collectively, “2.5D/3D”) integrated circuit packaging technology is creating another compelling opportunity for

The Global deployment of 5G and the exponential growth of data centers is driving the demand for high-performance optical devices.

Ultra-high-speed die bonding technology is pivotal in modern manufacturing, particularly for optical modules production. The MRSI-LEAP Ultra-High-Speed Die Bonders exemplify this advancement,

MRSI has produced immersive software training videos to optimize your company’s experience with our cutting-edge die bonding and epoxy dispensing systems. MRSI wants the acquisition of our

Join MRSI at the upcoming Compound Semiconductor Advanced Technology and Application Conference (CSC) taking place on May 22-23, 2024, in Suzhou, China.

Jack Inocencio, the Sr. Manager of Applications and Service, extended some conducive knowledge on why MRSI System’s products will accelerate photonics manufacturers’ efficiency and

MRSI Systems welcomes you to the European Microwave Exhibition! This event is the largest trade show that is dedicated to Microwave and RF in Europe. It will be held from September 27th-29th in

MRSI’s latest article in Chip Scale Review discusses the similarities and differences between automotive light detection and ranging (LiDAR) and optical transceivers are compared.

Plan now to visit our booth #5407 at SPIE Photonics West, January 28–30, 2025 in San Francisco, CA. Discover our latest technologies, including newly released active alignment solutions and the

die-bonding Improve pick and place machine utilization by keeping dies in their places A lot of dies are presented to die bonders in waffle packs and there is a common issue of component out of

During the summer, China Fiber Optics Online (CFOL), interviewed Dr. Limin Zhou, Senior Strategic Marketing Director of MRSI Mycronic to discuss MRSI’s latest product development and some of the

On August 8, 2021, MRSI Systems(Mycronic Group) held the grand opening of its Product Demonstration Center in Shenzhen, China. The opening ceremony was accompanied with a speech by local

Increasing demand for data and bandwidth requires high volume manufacturing (HVM) of photonics devices. This expansion with double-digit growth rates...

5G continues to drive the needs of the Datacom supply chain which presents challenges to photonic device manufacturers. In this article featured in Laser Focus World, MRSI highlights the

MRSI Systems won the China Optoelectronics Expo Award (CIOE Award) for the latest MRSI-HVM 1.5 micron series of products. The MRSI-HVM with conveyor is an outstanding innovation, widely used in

2021 was a great year for our best-selling product, the MRSI-HVM 1.5 micron high-speed die bonder. This system meets the needs of many industries from telecom, datacom and medical devices

Dr. Limin Zhou, Senior Director of Strategic Marketing, MRSI Systems presented “Integrated Photonics Devices Volume Manufacturing Challenges & Innovative Solutions” at the 20th Infostone

MRSI’s latest article in the July 2020 issue of Laser Focus World highlights a flexible die bonding solution for modern photonics manufacturing.

MRSI is attending and sponsoring the 18th Annual IMAPS Device Packaging Conference and Exhibition.

Complex Hybrid Circuits are used in a variety of high reliability applications including military, aerospace, medical, and photonics. MRSI offers dispense and die bonding solutions specifically